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    • 54. 发明授权
    • Lateral bipolar field effect mode hybrid transistor and method for
operating the same
    • 侧面双极场效应模式混合晶体管及其操作方法
    • US6015982A
    • 2000-01-18
    • US968213
    • 1997-11-12
    • Anders Soderbarg
    • Anders Soderbarg
    • H01L29/73H01L21/331H01L21/8249H01L27/06H01L27/07H01L27/095H01L29/772H01L27/085
    • H01L27/0722
    • The invention relates to a semiconductor device and a method in this device, wherein the semiconductor device operates completely or partly in lateral extension. The semiconductor device comprises at least two high-voltage lateral bipolar transistors with at least two mutually opposite emitter/base regions, which are placed at the surface of the epi-taxial layer at a mutual distance such that an intermediate common collector region is formed. The common collector region can be completely depleted when the device has a voltage applied and by using a lateral depletion of said collector region, the voltage durability of the semiconductor device can be determined lithographically by the distance between the doped regions comprised in the device. Furthermore, undesired parasitic components, which are dependent on the quality of the active layer of the device, resistivity and substrate potential, can be eliminated or suppressed.
    • 本发明涉及这种器件中的半导体器件和方法,其中半导体器件完全或部分地横向延伸。 半导体器件包括至少两个具有至少两个彼此相对的发射极/基极区域的高电压横向双极晶体管,它们以相互间隔放置在外围层的表面,使得形成中间共同集电极区域。 当器件具有施加的电压并且通过使用所述集电极区域的横向耗尽时,公共集电极区域可以完全耗尽,可以通过包括在器件中的掺杂区域之间的距离光刻地确定半导体器件的电压耐久性。 此外,可以消除或抑制依赖于器件的有源层的质量,电阻率和衬底电位的不期望的寄生成分。
    • 60. 发明授权
    • Integrated circuits comprising lateral transistors and process for fabrication thereof
    • 包含横向晶体管的集成电路及其制造方法
    • US3766446A
    • 1973-10-16
    • US3766446D
    • 1970-11-18
    • KOGYO GIJUTSUIN
    • TARUI TKOMIYA Y
    • H01L21/00H01L27/00H01L27/07H01L19/00
    • H01L27/0722H01L21/00H01L27/00Y10S148/037Y10S148/053Y10S148/085Y10S148/096Y10S148/106Y10S148/136Y10S148/145Y10S148/151
    • A ''''lateral'''' transistor for use in integrated circuits may have its base region formed by a technique of ''''ion implantation'''' with or without a step of impurity diffusion or, alternatively, by two steps of impurity diffusion including the formation of the so-called ''''buried'''' layer. In either case an emitter region is double-diffused into the base region simultaneously with collector diffusion, in such a manner that the base width of the lateral transistor is defined by a difference between the lengths of the double diffusion. The aforesaid ion implantation and buried layer techniques are utilized in the fabrication of integrated circuits incorporating such lateral transistors, in which base regions and isolation regions are formed at the same time. In other integrated circuits also disclosed herein, the lateral transistors together with or without field-effect transistors are isolated by means of substrate having higher resistivity than the base regions of the transistors.
    • 用于集成电路的“横向”晶体管可以通过具有或不具有杂质扩散步骤的或具有杂质扩散步骤的“离子注入”技术形成其基极区域,或者可选地,通过两个步骤的杂质扩散,包括形成所谓的 “埋”层。 在任一情况下,发射极区域与集电极扩散同时扩散到基极区域中,使得横向晶体管的基极宽度由双扩散长度之间的差定义。 上述离子注入和掩埋层技术用于结合这样的横向晶体管的集成电路的制造,其中同时形成基极区域和隔离区域。 在本文也公开的其他集成电路中,通过具有比晶体管的基极区更高的电阻率的衬底来隔离与场效应晶体管一起或不与场效应晶体管连接的横向晶体管。