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51. 发明授权

US09446524B2 Wire clamp with piezoelectric actuator and method and apparatus for applying a preload force to the piezoelectric actuator 有权
标题翻译：具有压电致动器的线夹，以及用于向压电致动器施加预载力的方法和装置
公开(公告)号：US09446524B2
公开(公告)日：2016-09-20
申请号：US14079840
申请日：2013-11-14
申请人： Yue Zhang , Chong Hao Chen , Zheng Yu Lin
发明人： Yue Zhang , Chong Hao Chen , Zheng Yu Lin
IPC分类号： B25J15/02 , B25J15/00 , H01L23/00 , E02D3/054
CPC分类号： B25J15/0028 , B25J15/0033 , B25J15/0042 , E02D3/054 , H01L24/74 , H01L24/78 , H01L24/85 , H01L2224/45099 , H01L2224/78 , H01L2924/00014 , Y10T29/49998 , Y10T29/53222 , Y10T29/53226 , Y10T29/5323 , Y10T29/53257 , Y10T29/53283
摘要： A wire clamp includes a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface.
摘要翻译：线夹具包括夹体; 耦合到所述夹具体的一对臂; 以及压电致动器，其具有在第一端和第二端之间延伸的纵向轴线，所述致动器在所述第一端处连接到所述一对臂并且在所述第二端处联接到所述夹具主体。致动器的第二端通过用于沿着纵向轴线施加预载力的预加载机构联接到夹具主体，并且预加载机构包括至少一个具有倾斜表面的楔块，该倾斜表面可在匹配的倾斜表面上滑动。

52. 发明授权

US09412711B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09412711B2
公开(公告)日：2016-08-09
申请号：US14793057
申请日：2015-07-07
申请人： ROHM CO., LTD.
发明人： Kenji Fujii , Satoshi Kageyama
IPC分类号： H01L23/52 , H01L23/00
CPC分类号： H01L24/05 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/02166 , H01L2224/04042 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/05664 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/78306 , H01L2224/85181 , H01L2224/85439 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides an electronic device that is able to achieve an improvement in yield or an electronic device that is able to prevent a sealing resin from exfoliating from a sub-electrode. The electronic device is provided with an electronic element and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The bonding pad includes a Pd layer that directly contacts the wire.
摘要翻译：本发明提供能够实现产量提高的电子设备或能够防止密封树脂从副电极剥离的电子设备。电子装置设置有电子元件和接合到电子元件的导线。电子元件包括接合焊盘，接合线与导线接合。焊盘包括直接接触导线的Pd层。

53. 发明授权

US09379077B2 Metal contact for semiconductor device 有权
标题翻译：半导体器件的金属接触
公开(公告)号：US09379077B2
公开(公告)日：2016-06-28
申请号：US14440876
申请日：2013-10-30
申请人： NANTONG FUJITSU MICROELECTRONICS CO., LTD.
发明人： Chang-Ming Lin , Lei Shi , Honghui Wang
IPC分类号： H01L23/00
CPC分类号： H01L24/14 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/78 , H01L2224/0401 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/11013 , H01L2224/1132 , H01L2224/1134 , H01L2224/1146 , H01L2224/1147 , H01L2224/1161 , H01L2224/1182 , H01L2224/11825 , H01L2224/1184 , H01L2224/11849 , H01L2224/119 , H01L2224/11902 , H01L2224/11903 , H01L2224/13007 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13541 , H01L2224/13562 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/45147 , H01L2224/78303 , H01L2224/81191 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/3841 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device package and packaging method, the semiconductor device packaging method comprising: providing a chip with a bonding pad formed on the chip surface; forming a passivation layer and a bump on the chip surface, wherein the passivation layer has an opening exposing part of the pad, the bump is located in the opening and the size of the bump is less than the size of the opening; forming a solder ball covering the top surface and the side wall of the bump, and the bottom surface of the opening. The formed semiconductor device package is not easy to form a short circuit. The bonding strength between the solder ball and the bump is high and the performance of the semiconductor device is stable.
摘要翻译：一种半导体器件封装和封装方法，所述半导体器件封装方法包括：为芯片提供形成在所述芯片表面上的焊盘; 在所述芯片表面上形成钝化层和凸块，其中所述钝化层具有暴露所述焊盘部分的开口，所述凸块位于所述开口中，并且所述凸块的尺寸小于所述开口的尺寸; 形成覆盖凸起的顶表面和侧壁以及开口的底表面的焊球。形成的半导体器件封装不容易形成短路。焊球与凸块之间的接合强度高，半导体器件的性能稳定。

54. 发明授权

US09379046B2 Module comprising a semiconductor chip 有权
公开(公告)号：US09379046B2
公开(公告)日：2016-06-28
申请号：US14752295
申请日：2015-06-26
申请人： Infineon Technologies AG
发明人： Ralf Otremba , Xaver Schloegel , Khai Huat Jeffrey Low , Chee Soon Law
IPC分类号： H01L21/00 , H01L23/495 , H01L23/00 , B81C1/00
CPC分类号： H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

55. 发明申请

US20160169355A1 DRIVE MECHANISM AND MANUFACTURING DEVICE 有权
标题翻译：驱动机构和制造设备
公开(公告)号：US20160169355A1
公开(公告)日：2016-06-16
申请号：US14903800
申请日：2014-05-30
申请人： KAIJO CORPORATION
发明人： Shuichi TAKANAMI
IPC分类号： F16H21/46 , B25J9/00 , H01L23/00
CPC分类号： F16H21/46 , B25J9/0033 , H01L24/742 , H01L24/78 , H01L2224/1134 , H01L2224/78353 , H01L2224/786 , H01L2224/78821 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.
摘要翻译：一种驱动机构，包括第一杆（103a），第二杆（104a），在平面上移动的第一平面电动机（106），在平面上移动的中心平面电动机（105）和移动部分（101）第一杆的一端通过第一旋转支点（125a）可旋转地连接到移动部分，第一杆的另一端通过第二旋转支点（126a）可旋转地连接到第一平面电动机，第二旋转支点第二杆通过设置在第一杆上的第三旋转支点（128a）可旋转地连接。第二杆的另一端通过第四旋转支点（127a）可旋转地连接到中心平面电动机，并且当第一平面电动机靠近中心移动时，移动部分移动以从中心平面电动机后退平面电机。

56. 发明申请

US20160148898A1 WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS 有权
标题翻译：用于电线连接装置的电线系统
公开(公告)号：US20160148898A1
公开(公告)日：2016-05-26
申请号：US14549771
申请日：2014-11-21
申请人： Chi Wah CHENG , Hon Kam NG
发明人： Chi Wah CHENG , Hon Kam NG
IPC分类号： H01L23/00 , B65H59/00 , B65H51/20 , B65H63/06 , B65H51/02
CPC分类号： H01L24/78 , B65H51/02 , B65H51/20 , B65H59/00 , B65H63/02 , B65H63/06 , B65H2553/42 , B65H2701/361 , H01L2224/45014 , H01L2224/7855 , H01L2224/78601 , H01L2224/78611 , H01L2224/78901 , H01L2924/00014 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.
摘要翻译：公开了一种用于引线接合装置的线卷轴系统，包括：布置成接收线的线卷轴; 用于将线的自由端馈送到引线接合装置的接合头的线引导件; 以及张紧机构，用于拉紧所述线以限定所述线卷轴和所述导线器之间的线路径。线滑系统包括成像模块，该成像模块包括具有图像传感器的相机。成像模块还包括图像处理单元。定位摄像机通过所述图像传感器对所述线路的至少一部分进行成像以产生图像数据。图像处理单元被配置为处理图像数据以确定线路的至少一部分的几何形状和/或几何形状的变化。

57. 发明授权

US09339888B2 Bonding apparatus 有权
标题翻译：接合装置
公开(公告)号：US09339888B2
公开(公告)日：2016-05-17
申请号：US14364059
申请日：2013-07-23
申请人： KAIJO CORPORATION
发明人： Shuichi Takanami
IPC分类号： B23K20/10 , H01L23/00
CPC分类号： B23K20/106 , H01L24/78 , H01L2224/78301 , H01L2224/78309 , H01L2224/78349 , H01L2224/789 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599
摘要： A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
摘要翻译：一种接合装置，包括：接合臂，其具有面向接合工具的中心轴的接收部; 与接合工具接触的一对毛细管保持部; 配置成产生与毛细管保持部接触的超声波振动的一对压电元件; 以及加压装置，其具有设置成面向接合臂的接收部分的加压构件和构造成使加压构件朝向接合臂的接收部分移动的移动装置。加压构件在将一对压电元件，一对毛细管保持部和接合工具放置在接合臂的接收部之间的状态下移动，以使接合臂保持一对毛细管保持部和粘合工具。

58. 发明授权

US09337134B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09337134B2
公开(公告)日：2016-05-10
申请号：US14278300
申请日：2014-05-15
申请人： Renesas Electronics Corporation
发明人： Kenji Oyachi , Tamaki Wada , Yuichi Morinaga
IPC分类号： H01L23/498 , G06K19/077 , H01L23/31 , H01L23/00
CPC分类号： H01L24/48 , G06K19/07718 , G06K19/0772 , G06K19/07722 , G06K19/07743 , G06K19/07745 , H01L23/053 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/49811 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/49 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05124 , H01L2224/05155 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/1401 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/4847 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48644 , H01L2224/48824 , H01L2224/48844 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/83862 , H01L2224/85045 , H01L2224/85048 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/10161 , H01L2924/10253 , H01L2924/181 , H01L2924/18301 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2924/01079 , H01L2224/4554
摘要： Reliability of a semiconductor device is improved. A semiconductor device has a base material comprised of insulating material having a through hole, a terminal formed on a lower surface of the base material, and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole of the base material, and has a sealing body for sealing the conductive member, inside of the through hole of the base material, and the semiconductor chip. An anchor means is provided in a region of the exposed surface of the terminal which is exposed from the through hole of the base material except for a joint portion joined with the conductive member such as the wire.
摘要翻译：提高了半导体器件的可靠性。半导体器件具有由具有通孔的绝缘材料，形成在基材的下表面上的端子和以面朝上的方式安装在基材的上表面上的半导体芯片构成的基材。此外，半导体器件具有诸如导线的导电构件，其将半导体芯片的焊盘与从基材的通孔露出的端子的暴露表面电连接，并且具有密封体导电构件，基材的通孔内部和半导体芯片。锚定装置设置在除了与诸如导线的导电构件连接的接合部分之外的从基材的通孔露出的端子的暴露表面的区域中。

59. 发明申请

US20160116355A1 METHOD FOR DETERMINING THE COMPRESSION LEVEL OF A NODE AFTER ULTRASONIC WELDING 审中-公开
标题翻译：用于确定超声波焊接后的节点压缩水平的方法
公开(公告)号：US20160116355A1
公开(公告)日：2016-04-28
申请号：US14888988
申请日：2014-05-12
申请人： SCHUNK SONOSYSTEMS GMBH
发明人： Dieter STROH
IPC分类号： G01L5/00
CPC分类号： G01L5/0076 , B23K20/10 , B23K2101/32 , B23K2101/38 , B29C65/08 , B29C66/90 , D07B1/06 , D07B7/169 , D07B2501/406 , H01L24/78 , H01L2224/78 , H01L2924/00014 , H01R43/0207 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for determining the compression level of a node by compacting and welding electrical lines inserted into a compression chamber of an ultrasonic welding system, the compression chamber having an adjustable height and width. The method includes inserting the lines into the compression chamber, compacting the lines, determining the compacting cross section of the compacted lines, determining the actual total cross section via a correlation function taking the compacting cross section into account, welding the compacted node with a welding parameter set, determining the welding dimension from the height (h2) and width (b) of the compression chamber after welding, and calculating the compression level based on the actual total cross section and the welding dimensions.
摘要翻译：一种用于通过压缩和焊接插入超声波焊接系统的压缩室中的电线来确定节点的压缩水平的方法，所述压缩室具有可调节的高度和宽度。该方法包括将管线插入压缩室，压实管线，确定压实线的压实横截面，考虑压实横截面的相关函数确定实际总横截面，用压焊参数集，焊接后从压缩室的高度（h2）和宽度（b）确定焊接尺寸，并根据实际总截面和焊接尺寸计算压缩水平。

60. 发明授权

US09314869B2 Method of recovering a bonding apparatus from a bonding failure 有权
标题翻译：从接合故障中恢复接合装置的方法
公开(公告)号：US09314869B2
公开(公告)日：2016-04-19
申请号：US13350363
申请日：2012-01-13
申请人： Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
发明人： Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
IPC分类号： B23K20/00 , H01L23/00
CPC分类号： B23K20/007 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/78268 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01327 , H01L2924/12036 , H01L2224/45099 , H01L2224/484 , H01L2924/00
摘要： A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
摘要翻译：公开了一种从接合故障恢复接合装置以恢复用于半导体芯片制造的正常操作状态的方法。接合装置包括：i）用于将导线接合在半导体芯片和基板之间的接合工具; 和ii）位置传感器。具体地说，该方法包括以下步骤：a）位置传感器确定接合工具在接合工具接触表面时的位置，以将线接合到衬底; b）接合装置基于接合工具的位置检测由半导体从基板脱离而引起的接合故障; 以及c）所述接合装置将所述半导体芯片与所述导线分开。

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