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    • 52. 发明授权
    • Head interconnect with support material carbonized shunt
    • 头部互连与支撑材料碳化分流
    • US06631052B1
    • 2003-10-07
    • US09372283
    • 1999-08-11
    • Mark T. GirardRyan A. Jurgenson
    • Mark T. GirardRyan A. Jurgenson
    • G11B548
    • G11B5/112G11B5/11G11B5/115G11B5/40H05K1/0259H05K1/0393H05K1/167H05K2201/0323H05K2203/107H05K2203/1136
    • The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed shunt sites wherein there is at least one through hole in the substrate.
    • 本发明提供了一种用于创建和去除分流器以防止对电气部件的ESD / EOS损伤的方法。 在本发明的一个实施例中,通过将互连的可碳化和可消融衬底暴露于诸如激光束的辐射能量源来提供和去除导电通路。 本发明还提供了包括通过可碳化和可烧蚀材料在至少一个表面上接合的至少两个导电线或引线的互连。 导线可以各自包括与另一个的分支死端引线部分交错的分支死端引线部分。 或者,导线可以以弯曲或弯曲或蛇形或回溯模式彼此靠近地延伸。 根据本发明的互连可以包括基本上支撑除了在基板中存在至少一个通孔的预定位置或所提供的分流位置处的导电线的基板。
    • 54. 发明申请
    • Head protection mechanism for use in a tape drive that is driven by a ring cam
    • 用于由环形凸轮驱动的磁带驱动器中的磁头保护机构
    • US20020051313A1
    • 2002-05-02
    • US10005591
    • 2001-10-29
    • Mitsumi Electric Co. Ltd.
    • Ikuichiro Nawa
    • G11B005/10
    • G11B5/102G11B5/115G11B5/40
    • In a head protection mechanism (50) for protecting a magnetic head (31) so that a coupled portion of a reader tape (71) is not in contact with the magnetic head, a protection arm (51) is rotatably mounted on a main surface of a chassis (12) close to an actuator assembly (20). The protection arm has a tape passing groove (51a) and an arm portion (514). Rotatably mounted on a back surface of the chassis, a protection lever (54) has one end (541) which is close to a ring cam (62) and which is engageably disposed to a cam face (621). The protection lever has another end (542) which is coupled to a tip (514a) of the arm portion in the protection arm via a hole (12c) bored in the chassis. A spring (53) always urges the protection arm nearer to the actuator assembly.
    • 在用于保护磁头(31)以使读取带(71)的耦合部分不与磁头接触的头部保护机构(50)中,保护臂(51)可旋转地安装在主表面 靠近致动器组件(20)的底盘(12)。 保护臂具有带通过槽(51a)和臂部(514)。 可转动地安装在底盘的后表面上,保护杆(54)具有靠近环形凸轮(62)的一端(541),该端部可啮合地设置在凸轮面(621)上。 保护杠杆具有另一端(542),该端部通过在底盘中钻孔的孔(12c)联接到保护臂中的臂部分的尖端(514a)。 弹簧(53)总是促使保护臂靠近致动器组件。
    • 57. 发明授权
    • Method of making laminated magnetic material
    • 层压磁性材料的制作方法
    • US4025379A
    • 1977-05-24
    • US550731
    • 1975-02-18
    • Clayton N. Whetstone
    • Clayton N. Whetstone
    • G11B5/115G11B5/147H01F1/18H01F27/245H01F41/02C09J5/00
    • H01F1/18G11B5/115G11B5/147H01F27/245H01F41/0233Y10S428/90Y10T29/49044Y10T29/49078Y10T428/1129Y10T428/12528
    • An extrusion billet is fabricated from layers of soft magnetic material separated by one or more metal layers. The billet is coreduced and heat treated to impart the desired magnetic properties to the soft magnetic material and also to form intermetallic insulating layers between the magnetic layers. Electric field shield sections are formed in a similar manner by placing relatively thick layers of copper between adjacent layers of metal located adjacent to the layers of soft magnetic material. The layers of soft magnetic metal can also be separated by a layer of semiconductor material; or a metal foil having a semiconductor-forming or high electrical resistivity forming material deposited thereon. In the latter case no extrusion is required. Instead, pressure and heat cause the materials to react and form either a semiconductor layer or a layer with an electrical resistivity higher than about 10.sup..sup.-4 ohm-cm between adjacent layers of soft magnetic metal. Even the deposition step is eliminated by separating and bonding the layers of soft magnetic metal with glass so long as the glass and soft magnetic metal have similar coefficients of thermal expansion.
    • 挤出坯料由一层或多层金属层分离的软磁材料层制成。 钢坯被压制和热处理以赋予软磁性材料所需的磁特性,并且还在磁性层之间形成金属间绝缘层。 通过在相邻的软磁材料层之间的相邻金属层之间放置相对较厚的铜层,以类似的方式形成电场屏蔽部分。 软磁金属层也可以被半导体材料层隔开; 或其上沉积有半导体形成或高电阻率形成材料的金属箔。 在后一种情况下不需要挤出。 相反,压力和热量使得材料反应并形成半导体层或在相邻的软磁性金属层之间具有高于约10 -4欧姆 - 厘米的电阻率的层。 只要玻璃和软磁金属具有相似的热膨胀系数,即使通过用玻璃分离和粘合软磁金属层来消除沉积步骤。