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51. 发明授权

US4785533A Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same 失效
标题翻译：混合集成电路器件及其制造方法及引线框架
公开(公告)号：US4785533A
公开(公告)日：1988-11-22
申请号：US15327
申请日：1987-02-17
申请人： Mituaki Seino , Tsuneo Endoh
发明人： Mituaki Seino , Tsuneo Endoh
IPC分类号： H05K3/34 , H05K3/36 , H05K3/40 , H01R43/00 , H05K1/11
CPC分类号： H05K3/366 , H01R12/58 , H05K2201/09045 , H05K2201/09163 , H05K2201/10386 , H05K2201/10946 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , Y10T29/49121
摘要： The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge of the wiring board, the device being featured in that a fixing section of each of the leads consists of a main fixing portion secured to the primary rear surface of the wiring board, and an auxiliary fixing portion secured to the side face of the wiring board, the auxiliary fixing portion of the lead being branched from the main fixing portion thereof such that the branched auxiliary fixing portion is bent at an angle of approximately 90.degree. with respect to the main fixing portion. This provides the hybrid integrated circuit device in which the leads have the enhanced connection strength against the wiring board, and the wiring board has a lower mounted height.
摘要翻译：本发明涉及一种混合集成电路装置，包括：多个电子部件; 将多个电子部件安装在其主前表面上的布线板; 以及固定在所述布线板的边缘的多个引线，其特征在于，每个所述引线的固定部分由固定到所述布线板的主后表面的主固定部分和辅助固定部分固定到布线板的侧面，引线的辅助固定部分从主固定部分分支，使得分支辅助固定部分相对于主固定部分以大约90度的角度弯曲。这提供了混合集成电路器件，其中引线对布线板具有增强的连接强度，并且布线板具有较低的安装高度。

52. 发明授权

US07176579B2 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US07176579B2
公开(公告)日：2007-02-13
申请号：US10733581
申请日：2003-12-12
申请人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
发明人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
IPC分类号： H01L23/538 , H01L23/58
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H05K1/0206 , H05K1/0298 , H05K1/183 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.
摘要翻译：本发明实现了半导体模块的小型化。半导体模块包括在其下表面上具有外部电极端子和散热垫的模块板，其中包括其中的高频功率放大装置的初级晶体管的第一半导体芯片，包含下一级的第二半导体芯片晶体管和其中的最后级晶体管，以及构成匹配电路的集成无源器件。第一半导体芯片和第二半导体芯片和集成无源器件中的至少一个以重叠的方式安装在模块板的上表面上。

54. 发明申请

US20060145352A1 Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：US20060145352A1
公开(公告)日：2006-07-06
申请号：US11338529
申请日：2006-01-23
申请人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号： H01L23/48
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/00013 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K2201/0215 , H05K2201/0218 , H05K2201/045 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669
摘要： In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
摘要翻译：在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物，金属球通过化合物结合在一起。

55. 发明授权

US07023706B2 Semiconductor device and manufacturing the same 失效
公开(公告)号：US07023706B2
公开(公告)日：2006-04-04
申请号：US10323818
申请日：2002-12-20
申请人： Mikio Negishi , Hiroki Noto , Tomio Yamada , Tsuneo Endoh
发明人： Mikio Negishi , Hiroki Noto , Tomio Yamada , Tsuneo Endoh
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H01L23/36 , H01L25/165 , H01L2224/16225 , H01L2924/01057 , H01L2924/13091 , H01L2924/15311 , H01L2924/1532 , H01L2924/19105 , H01L2924/19106
摘要： A semiconductor device capable of attaining the reduction of size is disclosed. The semiconductor device comprises a module substrate having a surface and a back surface, a control chip mounted on the surface of the module substrate, plural chip parts mounted on the surface in adjacency to the control chip, first and second output chips mounted on the back surface of the module substrate, plural lands formed on the back surface of the module substrate, and a seal portion formed of resin to seal the control chip and the plural chip parts, wherein the first and second output chips are larger in the amount of heat generated than the control chip, the heat from the first and second output ships is radiated to a mother board, and packaging parts on the surface side of the module substrate are sealed with only a sealing resin without using a metallic case or the like to attain the reduction in size of the module.

56. 发明申请

US20050257756A1 Cylinder liner cooling structure 失效
标题翻译：缸套冷却结构
公开(公告)号：US20050257756A1
公开(公告)日：2005-11-24
申请号：US11128242
申请日：2005-05-13
申请人： Tsuneo Endoh , Kengo Ishimitsu
发明人： Tsuneo Endoh , Kengo Ishimitsu
IPC分类号： F01P3/02 , F02F1/14 , F02F1/16 , F02B75/18
CPC分类号： F01P3/02
摘要： This invention relates to a cooling structure for cooling a cylinder liner by circulating coolant in a water jacket formed along an outer periphery of the cylinder liner. This cooling structure includes an annular first water reservoir for temporarily storing coolant. This first water reservoir allows the coolant to uniformly flow circumferentially of the cylinder liner. The cooling structure also includes a plurality of coolant passages provided radially for connecting the first water reservoir to the water jacket. The coolant is caused to strike a part of a wall defining the water jacket substantially vertically from the radial coolant passages, thereby to generate turbulent flow in the coolant to efficiently cool the cylinder liner.
摘要翻译：本发明涉及一种冷却结构，用于通过沿着气缸套的外周形成的水套中的冷却剂循环来冷却气缸套。该冷却结构包括用于临时储存冷却剂的环形第一储水器。该第一储水器允许冷却剂沿气缸套的周向均匀地流动。冷却结构还包括径向设置的多个冷却剂通道，用于将第一储水器连接到水套。导致冷却剂从基本上垂直于径向冷却剂通道撞击限定水套的壁的一部分，从而在冷却剂中产生湍流以有效地冷却气缸套。

57. 发明申请

US20050238269A1 Bearing structure 审中-公开
标题翻译：轴承结构
公开(公告)号：US20050238269A1
公开(公告)日：2005-10-27
申请号：US11097220
申请日：2005-04-04
申请人： Tsuneo Endoh , Hidemi Kimura , Kengo Ishimitsu
发明人： Tsuneo Endoh , Hidemi Kimura , Kengo Ishimitsu
IPC分类号： F02F1/20 , F16C3/10 , F16C3/12 , F16C9/00 , F16C9/02 , F16C17/18 , F16D13/54
CPC分类号： F16C3/12 , F16C9/00 , F16C17/18
摘要： A bearing structure is provided for a crankshaft and a connecting rod of an internal combustion engine. A single-piece first floating bearing having oil films formed thereon is disposed between a crankpin of the crankshaft and a big end of the connecting rod. A single-piece second floating bearing having oil films formed thereon is disposed between a first journal of the crankshaft and a first main bearing portion provided in a cylinder block. A single-piece third floating bearing having oil films formed thereon is disposed between a second journal of the crankshaft and a second main bearing portion provided in the cylinder block.
摘要翻译：为曲轴和内燃机的连杆提供轴承结构。其中形成有油膜的单件式第一浮动轴承设置在曲轴的曲柄销和连杆的大端之间。具有形成在其上的油膜的单件式第二浮动轴承设置在曲轴的第一轴颈和设置在气缸体中的第一主轴承部分之间。在其上形成有油膜的单件式第三浮动轴承设置在曲轴的第二轴颈和设置在气缸体中的第二主轴承部分之间。

58. 发明授权

US06880513B1 Engine block 失效
标题翻译：发动机缸体
公开(公告)号：US06880513B1
公开(公告)日：2005-04-19
申请号：US10110768
申请日：2000-10-23
申请人： Haruhiko Komatsu , Tsuneo Endoh , Tsuyoshi Baba , Yuichi Itoh , Tosio Takamoto
发明人： Haruhiko Komatsu , Tsuneo Endoh , Tsuyoshi Baba , Yuichi Itoh , Tosio Takamoto
IPC分类号： F02F1/00 , F01P3/02 , F02B75/18 , F02F1/10 , F02F1/16 , F02F7/00 , F02G5/02
CPC分类号： F02F7/0021 , F02B2075/1816 , F02F1/102 , F02F1/108 , F02F7/0007 , F02F7/0095 , F05C2201/021
摘要： An engine block includes a cylinder head, a plurality of bearing caps for a crankshaft, a cylinder block disposed between the cylinder head and the bearing caps, a plurality of fastening members for fastening the cylinder head and the bearing caps to each other, and a plurality of columnar members interposed between the cylinder head and the bearing caps to receive the fastening forces of the fastening members. Thus, it is possible to provide an engine block including a cylinder block reduced in weight by a remarkable reduction in required strength.
摘要翻译：发动机缸体包括气缸盖，多个用于曲轴的轴承盖，设置在气缸盖和轴承盖之间的气缸体，用于将气缸盖和轴承盖彼此紧固的多个紧固构件，以及插入在气缸盖和轴承盖之间的多个柱状构件以接收紧固构件的紧固力。因此，可以通过显着降低所需强度来提供包括减小重量的气缸体的发动机缸体。

59. 发明授权

US06843309B2 Condenser 失效
标题翻译：冷凝器
公开(公告)号：US06843309B2
公开(公告)日：2005-01-18
申请号：US10182196
申请日：2001-01-25
申请人： Hiroyoshi Taniguchi , Tsuneo Endoh , Tsutomu Takahashi , Taizou Kitamura , Takashi Takazawa
发明人： Hiroyoshi Taniguchi , Tsuneo Endoh , Tsutomu Takahashi , Taizou Kitamura , Takashi Takazawa
IPC分类号： F01K23/02 , F28B1/06 , F28B9/08 , F28D9/00 , F28B1/18
CPC分类号： F28B1/06 , F28B9/08 , F28D9/0012 , F28D9/005
摘要： A condenser includes a cooling section having a plurality of vapor passages to convert vapor into water, a blower for drawing water produced in the vapor passages out of the vapor passages, and a recovery section for receiving the drawn-out water. Thus, the water produced in the vapor passages in the cooling section can be prevented from occluding the vapor passages.
摘要翻译：冷凝器包括具有多个蒸气通道以将蒸汽转化成水的冷却部分，用于将蒸汽通道中产生的水抽出蒸气通道的鼓风机和用于接收抽出的水的回收部分。因此，能够防止在冷却部中的蒸气通路中产生的水分堵塞蒸气通路。

60. 发明授权

US06710263B2 Semiconductor devices 失效
标题翻译：半导体器件
公开(公告)号：US06710263B2
公开(公告)日：2004-03-23
申请号：US09790978
申请日：2001-02-23
申请人： Toshiyuki Kobayashi , Yasutoshi Kurihara , Takumi Ueno , Nobuyoshi Maejima , Hirokazu Nakajima , Tomio Yamada , Tsuneo Endoh
发明人： Toshiyuki Kobayashi , Yasutoshi Kurihara , Takumi Ueno , Nobuyoshi Maejima , Hirokazu Nakajima , Tomio Yamada , Tsuneo Endoh
IPC分类号： H05K116
CPC分类号： H01L24/97 , H01L23/49894 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/09701 , H01L2924/10329 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/351 , H05K1/0271 , H05K1/0306 , H05K3/0052 , H05K3/284 , H05K3/4611 , H05K3/4629 , H05K2201/09036 , H05K2201/0909 , H05K2203/175 , H01L2224/92247 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2075 , H01L2924/2076 , H01L2924/20754 , H01L2224/05599 , H01L2924/01049
摘要： In a semiconductor device, the likely occurrence of cracking of a ceramic substrate, and the consequential disconnection of internal layer wiring, due to thermal changes suffered when the semiconductor device is mounted on external wiring boards having different thermal expansion is prevented. The semiconductor device has a ceramic substrate, a wiring pattern formed on a first principal plane and having mounted semiconductor components, an external electrode portion formed on a second principal plane and connected to an external circuit, internal layer wiring formed inside said ceramic substrate to electrically connect said wiring pattern and said external electrode portion via through-hole wiring, and semiconductor components and a resin layer covering said semiconductor components, wherein the internal layer wiring is formed internally with respect to the side of said ceramic substrate with a clearance of at least 0.05 mm.
摘要翻译：在半导体装置中，防止了当将半导体器件安装在具有不同热膨胀的外部布线板上时，由于热变化而导致陶瓷基板的破裂的可能发生，以及由此导致的内层布线的断开。半导体器件具有陶瓷基板，形成在第一主平面上并具有安装的半导体部件的布线图案，形成在第二主平面上并连接到外部电路的外部电极部分，形成在所述陶瓷基板内部的内部层布线，通过通孔布线连接所述布线图案和所述外部电极部分，以及半导体部件和覆盖所述半导体部件的树脂层，其中内层布线相对于所述陶瓷基板的侧面至少形成有至少间隙 0.05毫米。

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