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    • 52. 发明申请
    • MULTI-FIN DEVICE BY SELF-ALIGNED CASTLE FIN FORMATION
    • 通过自对准城堡形成的多功能设备
    • US20120091511A1
    • 2012-04-19
    • US12907272
    • 2010-10-19
    • Hsin-Chih ChenTsung-Lin LeeFeng Yuan
    • Hsin-Chih ChenTsung-Lin LeeFeng Yuan
    • H01L29/772H01L21/302
    • H01L29/772H01L21/3086H01L29/66795H01L29/785
    • The present disclosure provides a method includes forming a multi-fin device. The method includes forming a patterned mask layer on a semiconductor substrate. The patterned mask layer includes a first opening having a first width W1 and a second opening having a second width W2 less than the first width. The patterned mask layer defines a multi-fin device region and an inter-device region, wherein the inter-device region is aligned with the first opening; and the multi-fin device region includes at least one intra-device region being aligned with the second opening. The method further includes forming a material layer on the semiconductor substrate and the patterned mask layer, wherein the material layer substantially fills in the second opening; performing a first etching process self-aligned to remove the material layer within the first opening such that the semiconductor substrate within the first opening is exposed; performing a second etching process to etch the semiconductor substrate within the first opening, forming a first trench in the inter-device region; and thereafter performing a third etching process to remove the material layer in the second opening.
    • 本公开提供了一种包括形成多翅片装置的方法。 该方法包括在半导体衬底上形成图案化掩模层。 图案化掩模层包括具有第一宽度W1的第一开口和具有小于第一宽度的第二宽度W2的第二开口。 图案化掩模层限定多鳍器件区域和器件间区域,其中器件间区域与第一开口对准; 并且所述多鳍片器件区域包括与所述第二开口对准的至少一个器件内区域。 该方法还包括在半导体衬底和图案化掩模层上形成材料层,其中材料层基本上填充在第二开口中; 执行自对准的第一蚀刻工艺以去除第一开口内的材料层,使得第一开口内的半导体衬底被暴露; 执行第二蚀刻工艺以在所述第一开口内蚀刻所述半导体衬底,在所述器件间区域中形成第一沟槽; 然后执行第三蚀刻处理以去除第二开口中的材料层。
    • 56. 发明授权
    • Non-volatile memory device having a generally L-shaped cross-section sidewall SONOS
    • 具有大致L形横截面侧壁SONOS的非易失性存储器件
    • US07847335B2
    • 2010-12-07
    • US11402529
    • 2006-04-11
    • Tzyh-Cheang LeeTsung-Lin LeeJiunn-Ren Hwang
    • Tzyh-Cheang LeeTsung-Lin LeeJiunn-Ren Hwang
    • H01L29/788
    • H01L21/28282H01L27/115H01L27/11568H01L29/4234H01L29/66833H01L29/7923
    • A non-volatile semiconductor memory device includes a gate stack formed on a substrate, semiconductor spacers, an oxide-nitride-oxide stack, and a contact pad. The semiconductor spacers are adjacent to sides of the gate stack and over the substrate. The oxide-nitride-oxide stack is located between the spacers and the gate stack, and located between the spacers and the substrate, such that the oxide-nitride-oxide stack has a generally L-shaped cross-section on at least one side of the gate stack. The contact pad is over and in electrical contact with the gate electrode and the semiconductor spacers. The contact pad may be further formed into recessed portions of the oxide-nitride-oxide stack between the gate electrode and the semiconductor spacers. The contact pad may include an epitaxial silicon having a metal silicide formed thereon.
    • 非易失性半导体存储器件包括形成在衬底,半导体间隔物,氧化物 - 氮化物 - 氧化物堆叠和接触焊盘上的栅堆叠。 半导体间隔物邻近栅极堆叠的两侧并在衬底上方。 氧化物 - 氧化物 - 氧化物堆叠位于间隔物和栅极堆叠之间,并且位于间隔物和衬底之间,使得氧化物 - 氧化物 - 氧化物堆叠在至少一侧上具有大致L形的横截面 门堆叠。 接触垫在栅极电极和半导体间隔物之间​​是电接触的。 接触焊盘可以进一步形成在栅电极和半导体间隔物之间​​的氧化物 - 氮化物 - 氧化物堆叠的凹陷部分。 接触焊盘可以包括其上形成有金属硅化物的外延硅。
    • 57. 发明申请
    • Structure and method for a sidewall SONOS memory device
    • 侧壁SONOS存储器件的结构和方法
    • US20070161195A1
    • 2007-07-12
    • US11327185
    • 2006-01-06
    • Tzyh-Cheang LeeFu-Liang YangJiunn-Ren HwangTsung-Lin Lee
    • Tzyh-Cheang LeeFu-Liang YangJiunn-Ren HwangTsung-Lin Lee
    • H01L21/336
    • H01L21/28282H01L29/4234H01L29/66833H01L29/7923Y10S438/954
    • A system and method for a sidewall SONOS memory device is provided. An electronic device includes a non-volatile memory. A substrate includes source/drain regions. A gate stack is directly over the substrate and between the source/drain regions. The gate stack has a sidewall. A nitride spacer is formed adjacent to the gate stack. A first oxide material is formed directly adjacent the spacer. An oxide-nitride-oxide structure is formed between the spacer and the gate stack. The oxide-nitride-oxide structure has a generally L-shaped cross-section on at least one side of the gate stack. The oxide-nitride-oxide structure includes a vertical portion and a horizontal portion. The vertical portion is substantially aligned with the sidewall and located between the first oxide material and the gate sidewall. The horizontal portion is substantially aligned with the substrate and located between the first oxide and the substrate.
    • 提供了一种用于侧壁SONOS存储器件的系统和方法。 电子设备包括非易失性存储器。 衬底包括源极/漏极区域。 栅极堆叠直接在衬底上并且在源极/漏极区域之间。 栅极堆叠具有侧壁。 在栅叠层附近形成氮化物间隔物。 第一氧化物材料直接邻近间隔物形成。 在间隔物和栅极叠层之间形成氧化物 - 氧化物 - 氧化物结构。 氧化物 - 氧化物 - 氧化物结构在栅极堆叠的至少一侧具有大致L形的横截面。 氧化物 - 氮化物 - 氧化物结构包括垂直部分和水平部分。 垂直部分基本上与侧壁对准并且位于第一氧化物材料和栅极侧壁之间。 水平部分基本上与衬底对准并位于第一氧化物和衬底之间。