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    • 56. 发明授权
    • Hybrid integration of electrical and optical chips
    • 混合集成电光芯片
    • US06859571B2
    • 2005-02-22
    • US10281459
    • 2002-10-25
    • Lionel C. Kimerling
    • Lionel C. Kimerling
    • G02B6/42G02B6/43H01L23/66G02B6/12
    • G02B6/4201G02B6/42G02B6/43H01L23/66H01L2224/16H01L2924/3011
    • A system of integrating electronic and optical functions includes an electronic chip that also includes monolithic IC electronics for performing electronic functions. Furthermore, the electronic chip includes a plurality of solder bumps for receiving input for processing. An optical chip receives an optical signal and performs optical functions on the signal, and outputs electrical signals indicative of the optical functions performed on the signal. Moreover, the optical chip includes a plurality of solder bumps for sending the electrical signals as input to the electronic chip. The solder bumps of the electronic chip and optical chip are bonded to together so that a hybrid integration is formed that separates the yield of the optical and electrical circuits forming the electronic and optical chip.
    • 集成电子和光学功能的系统包括还包括用于执行电子功能的单片IC电子器件的电子芯片。 此外,电子芯片包括用于接收用于处理的输入的多个焊料凸块。 光学芯片接收光信号并对该信号执行光学功能,并且输出指示对该信号执行的光学功能的电信号。 此外,光学芯片包括用于将电信号作为输入发送到电子芯片的多个焊料凸块。 电子芯片和光学芯片的焊料凸块被结合在一起,从而形成了分离形成电子和光学芯片的光学和电路的成品率的混合集成。