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    • 55. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100164573A1
    • 2010-07-01
    • US12494355
    • 2009-06-30
    • Ja-Beom KooDong-Suk Shin
    • Ja-Beom KooDong-Suk Shin
    • H03L7/06
    • H03L7/0812H03K5/133H03K2005/00026H03L7/087
    • A semiconductor device, includes a clock delay unit configured to include a plurality of delay units connected in series, where the delay amount of each delay unit varies depending on a level of a control voltage, for delaying a source clock to generate a feedback clock and mixing clocks outputted from the respective delay units to generate a frequency multiplication clock, a harmonic lock determination unit configured to determine whether a harmonic lock has occurred based on a frequency difference between the source clock and the frequency multiplication clock, and a control voltage generator configured to adjust a level of the control voltage based on a phase difference between the source clock and the feedback clock and a determination result of the harmonic lock determination unit.
    • 一种半导体器件,包括:时钟延迟单元,被配置为包括串联连接的多个延迟单元,其中每个延迟单元的延迟量根据控制电压的电平而变化,用于延迟源时钟以产生反馈时钟; 从相应的延迟单元输出的混合时钟以产生倍频时钟;谐波锁定确定单元,被配置为基于源时钟和倍频时钟之间的频率差来确定是否发生了谐波锁定;以及控制电压发生器, 基于源时钟和反馈时钟之间的相位差以及谐波锁定确定单元的确定结果来调节控制电压的电平。
    • 56. 发明授权
    • Method of fabricating transistor including buried insulating layer and transistor fabricated using the same
    • 制造包括埋入绝缘层的晶体管的方法和使用其制造的晶体管
    • US07701010B2
    • 2010-04-20
    • US12206225
    • 2008-09-08
    • Dong-Suk Shin
    • Dong-Suk Shin
    • H01L29/786
    • H01L29/66636H01L29/165H01L29/517H01L29/665H01L29/6653H01L29/66628H01L29/66772H01L29/7848H01L29/78621H01L29/78639
    • In a method of fabricating a transistor including a buried insulating layer and transistor fabricated using the same, the method includes sequentially forming a sacrificial layer and a top semiconductor layer on a single crystalline semiconductor substrate. A gate pattern is formed on the top semiconductor layer. A sacrificial spacer is formed to cover sidewalls of the gate pattern. An elevated semiconductor layer is grown on a portion of the top semiconductor layer adjacent to the sacrificial spacer. The sacrificial spacer is removed. A portion of the top semiconductor layer from which the sacrificial spacer is removed is etched until the sacrificial layer is exposed, thereby forming a recess, which separates the top semiconductor layer into a first top semiconductor layer pattern and a second top semiconductor layer pattern, which remain under the gate pattern and the elevated semiconductor layer, respectively. The sacrificial layer is selectively removed. A buried insulating layer is formed to fill a region from which the sacrificial layer is removed. A buried semiconductor layer is grown in the recess. An extending recess extends from the recess and is formed to expose the semiconductor substrate. The extending recess separates the buried insulating layer into a first buried insulating layer pattern and a second buried insulating layer pattern, which are self-aligned to the first and second top semiconductor layer patterns, respectively.
    • 在制造包括掩埋绝缘层的晶体管和使用其制造的晶体管的方法中,该方法包括在单晶半导体衬底上顺序地形成牺牲层和顶部半导体层。 在顶部半导体层上形成栅极图案。 形成牺牲隔离物以覆盖栅极图案的侧壁。 在与牺牲间隔物相邻的顶部半导体层的一部分上生长升高的半导体层。 去除牺牲隔离物。 去除牺牲隔离物的顶部半导体层的一部分被蚀刻直到牺牲层被暴露,从而形成将顶部半导体层分离为第一顶部半导体层图案和第二顶部半导体层图案的凹部,其中 分别保持在栅极图案和升高的半导体层之下。 牺牲层被选择性地去除。 形成掩埋绝缘层以填充去除牺牲层的区域。 在凹槽中生长掩埋半导体层。 延伸凹部从凹部延伸并形成为露出半导体衬底。 延伸凹部将掩埋绝缘层分别分别与第一和第二顶部半导体层图案自对准的第一掩埋绝缘层图案和第二掩埋绝缘层图案。
    • 59. 发明申请
    • DLL CIRCUIT AND METHOD OF CONTROLLING THE SAME
    • DLL电路及其控制方法
    • US20090146707A1
    • 2009-06-11
    • US12170282
    • 2008-07-09
    • Dong-Suk Shin
    • Dong-Suk Shin
    • H03L7/06
    • H03L7/0814H03L7/10
    • A delay locked loop (DLL) circuit includes an initial operation setting unit configured to generate an initial operation signal in response to a reference clock signal and an operation start signal; a shift register configured to generate a delay control code in response to the initial operation signal, a phase comparison signal, and an initial setting code; a delay line configured to delay the reference clock signal or a feedback clock signal in response to the initial operation signal and the delay control code, thereby generating a plurality of unit delay clock signals; and an initial delay monitoring unit configured to generate the initial setting code in response to the reference clock signal and the plurality of unit delay clock signals.
    • 延迟锁定环(DLL)电路包括初始操作设置单元,其被配置为响应于参考时钟信号和操作开始信号而产生初始操作信号; 移位寄存器,被配置为响应于初始操作信号,相位比较信号和初始设置码产生延迟控制代码; 延迟线,被配置为响应于初始操作信号和延迟控制代码来延迟参考时钟信号或反馈时钟信号,由此产生多个单位延迟时钟信号; 以及初始延迟监视单元,被配置为响应于所述参考时钟信号和所述多个单位延迟时钟信号而产生所述初始设置码。
    • 60. 发明申请
    • POWER-DOWN MODE CONTROL APPARATUS AND DLL CIRCUIT HAVING THE SAME
    • 掉电模式控制装置和具有该模式的DLL电路
    • US20090121784A1
    • 2009-05-14
    • US12175212
    • 2008-07-17
    • Hyun-Woo LeeWon-Joo YunDong-Suk Shin
    • Hyun-Woo LeeWon-Joo YunDong-Suk Shin
    • G05F1/10
    • G11C7/02G11C5/143G11C5/144G11C7/22G11C7/222
    • A power-down mode control apparatus includes an internal power-down control block configured to receive a locking completion signal and to generate an internal power-down signal, which is toggled for a predetermined time; a noise check block configured to check occurrence/non-occurrence of noise on the basis of a phase detection signal and to generate a plurality of power-down selection signals in response to the locking completion signal and the internal power-down signal; and a power-down enter control block configured to generate a plurality of power-down enter signals, which instruct individual circuits to enter a power-down mode in response to a reference clock signal, the plurality of power-down selection signals, a power-down mode signal, and the internal power-down signal.
    • 断电模式控制装置包括内部掉电控制块,其被配置为接收锁定完成信号并产生切换预定时间的内部掉电信号; 噪声检查块,被配置为基于相位检测信号来检查噪声的发生/不发生,并且响应于锁定完成信号和内部掉电信号而产生多个掉电选择信号; 以及断电进入控制块,被配置为产生多个断电输入信号,其响应于参考时钟信号指示各个电路进入掉电模式,所述多个掉电选择信号,功率 下降模式信号和内部掉电信号。