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    • 51. 发明授权
    • Pattern dimension measurement method and charged particle beam apparatus
    • 图案尺寸测量方法和带电粒子束装置
    • US09297649B2
    • 2016-03-29
    • US14001433
    • 2011-12-12
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • G01B15/06G01N23/225H01J37/28H01J37/22G01N23/00H01J37/244
    • G01B15/06G01N23/00H01J37/222H01J37/244H01J37/28H01J2237/24578H01J2237/2816H01J2237/2817
    • The present invention aims to provide a pattern dimension measurement method for accurately measuring an amount of shrinkage of a pattern that shrinks and an original dimension value before the shrinkage and a charged particle beam apparatus.In order to attain the above-mentioned object, there are proposed a pattern dimension measurement method and a charged particle beam apparatus that are characterized by: forming a thin film on a sample including the pattern after carrying out beam scanning onto a first portion of the pattern; acquiring a first measurement value by scanning a beam onto a region corresponding to the first portion on which the thin film is formed; acquiring a second measurement value by scanning a beam onto a second portion that has identical dimensions as those of the first portion on design data; and finding the amount of shrinkage of the pattern based on subtraction processing of subtracting the first measurement value from the second measurement value.
    • 本发明的目的在于提供一种图形尺寸测量方法,用于精确测量收缩的图案的收缩量和收缩前的原始尺寸值以及带电粒子束装置。 为了实现上述目的,提出了一种图案尺寸测量方法和带电粒子束装置,其特征在于:在对包含图案的样品进行束扫描之后,在包含该图案的样品上形成薄膜至第一部分 模式; 通过将光束扫描到与其上形成有薄膜的第一部分对应的区域来获取第一测量值; 通过将光束扫描到与设计数据上的第一部分具有相同尺寸的第二部分上来获取第二测量值; 并且基于从第二测量值减去第一测量值的减法处理来找出图案的收缩量。
    • 53. 发明申请
    • PATTERN DIMENSION MEASUREMENT METHOD AND CHARGED PARTICLE BEAM APPARATUS
    • 图案尺寸测量方法和充电颗粒光束装置
    • US20140048706A1
    • 2014-02-20
    • US14001433
    • 2011-12-12
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • Hiroki KawadaNorio HasegawaToru Ikegami
    • G01N23/00
    • G01B15/06G01N23/00H01J37/222H01J37/244H01J37/28H01J2237/24578H01J2237/2816H01J2237/2817
    • The present invention aims to provide a pattern dimension measurement method for accurately measuring an amount of shrinkage of a pattern that shrinks and an original dimension value before the shrinkage and a charged particle beam apparatus.In order to attain the above-mentioned object, there are proposed a pattern dimension measurement method and a charged particle beam apparatus that are characterized by: forming a thin film on a sample including the pattern after carrying out beam scanning onto a first portion of the pattern; acquiring a first measurement value by scanning a beam onto a region corresponding to the first portion on which the thin film is formed; acquiring a second measurement value by scanning a beam onto a second portion that has identical dimensions as those of the first portion on design data; and finding the amount of shrinkage of the pattern based on subtraction processing of subtracting the first measurement value from the second measurement value.
    • 本发明的目的在于提供一种图形尺寸测量方法,用于精确测量收缩的图案的收缩量和收缩前的原始尺寸值以及带电粒子束装置。 为了实现上述目的,提出了一种图案尺寸测量方法和带电粒子束装置,其特征在于:在对包含图案的样品进行束扫描之后,在包含该图案的样品上形成薄膜至第一部分 模式; 通过将光束扫描到与其上形成有薄膜的第一部分对应的区域来获取第一测量值; 通过将光束扫描到与设计数据上的第一部分具有相同尺寸的第二部分上来获取第二测量值; 并且基于从第二测量值减去第一测量值的减法处理来找出图案的收缩量。
    • 59. 发明授权
    • Semiconductor integrated circuit device and manufacturing method thereof
    • 半导体集成电路器件及其制造方法
    • US07042038B2
    • 2006-05-09
    • US10653889
    • 2003-09-04
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L27/10852H01L27/10817
    • An active region (L) with a metal insulator semiconductor field effect transistor (MISFET) (Qs) formed therein for selection of a DRAM memory cell, which makes up a memory cell of the DRAM, is arranged to have an island-like pattern that linearly extends in an X direction on one principal surface of a semiconductor substrate (1). The memory-cell selection MISFET (Qs) has an insulated gate electrode (7) (word line WL) that extends along a Y direction on the principal surface of the semiconductor substrate (1) with the same width kept along the length thereof, which gate electrode is arranged to oppose another gate electrode (7) (word line WL) adjacent thereto at a prespecified distance or pitch that is narrower than said width. In addition, a bit line (BL) is provided overlying the memory-cell select MISFET (Qs) in a manner such that the bit line extends in the X direction on the principal surface of the semiconductor substrate (1) with the same width and opposes its neighboring bit line (BL) at a distance or pitch that is wider than said width.
    • 在其中形成有用于选择构成DRAM的存储单元的DRAM存储单元的金属绝缘体半导体场效应晶体管(MISFET)(Qs)的有源区域(L)被布置成具有岛状图案, 在半导体衬底(1)的一个主表面上沿X方向线性地延伸。 存储单元选择MISFET(Qs)具有在半导体衬底(1)的主表面上沿着Y方向延伸的绝缘栅电极(字线WL),沿着其长度保持相同的宽度, 栅电极被布置成以比所述宽度窄的预定距离或间距与与其相邻的另一个栅电极(7)(字线WL)相对。 此外,位线(BL)以这样的方式设置在存储单元选择MISFET(Qs)上,使得位线在半导体衬底(1)的主表面上沿X方向以相同的宽度延伸,并且 以比所述宽度更宽的距离或间距来对置其相邻位线(BL)。
    • 60. 发明授权
    • Manufacturing method of semiconductor integrated circuit devices and mask manufacturing methods
    • 半导体集成电路器件的制造方法和掩模制造方法
    • US06548312B1
    • 2003-04-15
    • US09640721
    • 2000-08-18
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • H01L2100
    • G03F7/70433
    • In order to inhibit or prevent a pattern abnormality such as the deformation or misalignment of a pattern of a semiconductor integrated circuit device, a light intensity is calculated based on the pattern data DBP of a mask and the aberration data DBL of a lens of a pattern exposure device (step 101) and then the results of the light intensity calculation is compared with the results of the light intensity calculated on condition that the lens of the pattern exposure device has no aberration (step 102), and then a pattern data exceeding an allowable level, of the pattern data of the mask, is corrected according to the amount of correction calculated on the basis of the results of the comparison such that the pattern data does not exceed the allowable level (step 104). The mask is manufactured by using the mask making data DBM after the correction and then is mounted on the pattern exposure device to transfer a predetermined pattern to a semiconductor wafer.
    • 为了抑制或防止诸如半导体集成电路器件的图案的变形或未对准的图案异常,基于掩模的图案数据DBP和图案的透镜的像差数据DBL计算光强度 曝光装置(步骤101),然后将光强度计算的结果与在图案曝光装置的透镜没有像差的条件下计算的光强度的结果进行比较(步骤102),然后模式数据超过 根据比较结果计算出的校正量,使图案数据不超过允许值(步骤104),对掩模的图案数据的允许电平进行校正。 通过在校正后使用掩模制作数据DBM来制造掩模,然后安装在图案曝光装置上以将预定图案转印到半导体晶片。