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    • 60. 发明授权
    • Semiconductor integrated circuit and manufacturing method thereof
    • 半导体集成电路及其制造方法
    • US6110772A
    • 2000-08-29
    • US16512
    • 1998-01-30
    • Tadayoshi TakadaTsuyoshi TakahashiYasunari TagamiHirotsugu HataSatoru Kaneko
    • Tadayoshi TakadaTsuyoshi TakahashiYasunari TagamiHirotsugu HataSatoru Kaneko
    • H01L27/04H01L21/02H01L21/265H01L21/822H01L27/06H01L21/70
    • H01L27/0635H01L28/20H01L28/40
    • A semiconductor IC including a resistance element on a circuit substrate. The resistance element includes a resistance layer formed on an insulating layer. The resistance layer is formed using a Si layer obtained by forming an a-Si layer, doping the a-Si layer with impurities, and heating the doped a-Si layer to diffuse the impurities while substantially preserving the fineness of the a-Si layer surface. Preferably, a SiN layer is provided lying beneath the resistance layer. A capacitor may be integrated on the same circuit substrate where the resistance element is formed. In this case, a lower electrode, a SiN dielectric layer, and an upper electrode are formed in this order to constitute a capacitor. The SiN dielectric layer of the capacitor is formed extending from a capacitor formation region to another region, so that the resistance layer of the resistance element is formed on the extending SiN dielectric layer. The lower and upper electrodes of the capacitor may be formed using an a-Si layer, similar to the resistance layer.
    • 一种在电路基板上包括电阻元件的半导体IC。 电阻元件包括形成在绝缘层上的电阻层。 电阻层使用通过形成a-Si层获得的Si层,用杂质掺杂a-Si层并加热掺杂的a-Si层以扩散杂质而形成,同时基本上保持a-Si层的细度 表面。 优选地,设置在电阻层下方的SiN层。 电容器可以集成在形成电阻元件的同一电路基板上。 在这种情况下,依次形成下电极,SiN电介质层和上电极,构成电容器。 电容器的SiN介质层形成为从电容器形成区域延伸到另一区域,使得电阻元件的电阻层形成在延伸的SiN电介质层上。 可以使用类似于电阻层的a-Si层来形成电容器的下电极和上电极。