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51. 发明授权

US08095378B2 Automated system for managing the selection of clinical items and documentation for a clinical event 有权
标题翻译：自动化系统，用于管理临床事件的选择和文件
公开(公告)号：US08095378B2
公开(公告)日：2012-01-10
申请号：US10294963
申请日：2002-11-14
申请人： Michael A. Zimmerman , Melissa A. Morawitz , Lawrence J. Licata
发明人： Michael A. Zimmerman , Melissa A. Morawitz , Lawrence J. Licata
IPC分类号： G06Q10/00 , G06Q50/00 , G06Q40/00
CPC分类号： G06Q10/087 , G06F19/00 , G06F19/325 , G06Q40/08 , G06Q50/22 , G06Q50/24
摘要： A method in a computer system for preparing for a clinical event is provided. In a preferred embodiment, the method includes the steps of identifying a preference card associated with the clinical event, the preference card including a list of predefined clinical item values, accessing at least one patient-specific demographic value; determining whether at least one of the predefined clinical item values is incompatible with at least one patient-specific demographic value, and updating the preference card if at least one of the predefined clinical item values is incompatible with at least one patient-specific demographic value.
摘要翻译：提供了一种用于准备临床事件的计算机系统中的方法。在优选实施例中，该方法包括以下步骤：识别与临床事件相关联的偏好卡，偏好卡包括预定临床项目值的列表，访问至少一个患者特定人口统计值; 确定所述预定临床项目值中的至少一个是否与至少一个患者特异性人口统计值不兼容，以及如果所述预定临床项目值中的至少一个与至少一个患者特异性人口统计值不兼容，则更新所述偏好卡。

52. 发明申请

US20080305355A1 Plastic electronic component package 审中-公开
标题翻译：塑料电子元件包装
公开(公告)号：US20080305355A1
公开(公告)日：2008-12-11
申请号：US12220543
申请日：2008-07-25
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： F16J15/02 , B32B15/08
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

53. 再颁专利

USRE43807E1 Microcircuit package having ductile layer 有权
标题翻译：具有延性层的微电路封装
公开(公告)号：USRE43807E1
公开(公告)日：2012-11-20
申请号：US13348934
申请日：2012-01-12
申请人： Michael A. Zimmerman , Jonathan Harris
发明人： Michael A. Zimmerman , Jonathan Harris
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/142 , H01L21/4803 , H01L23/047 , H01L23/10 , H01L23/4924 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29183 , H01L2224/32245 , H01L2224/32506 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83444 , H01L2224/83455 , H01L2224/83805 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/15747 , H01L2924/16195 , H01L2924/3511 , H01L2924/00 , H01L2924/01014 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.
摘要翻译：在铜凸缘和管芯之间具有延性层的微电路封装。延性层吸收凸缘和安装在凸缘上的半导体器件之间的应力，并且可以显着降低施加到半导体器件的应力。此外，封装提供铜凸缘和聚合物电介质与铜接近的TCE的组合，这导致低应力结构，提高了可靠性和导电性。

54. 发明申请

US20080150104A1 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE 审中-公开
标题翻译：具有不同拓扑的LEADFRAME用于MEMS封装
公开(公告)号：US20080150104A1
公开(公告)日：2008-06-26
申请号：US11875130
申请日：2007-10-19
申请人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
发明人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
IPC分类号： H01L23/495 , H01L21/02
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
摘要翻译：描述了用于微机电（MEMS）装置的封装。预制的引线框架底座具有相对的顶部和底部表面。每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

55. 发明授权

US06510226B1 Dual network housing device 有权
标题翻译：双网络外壳设备
公开(公告)号：US06510226B1
公开(公告)日：2003-01-21
申请号：US09489321
申请日：2000-01-21
申请人： Brian J. Thomann , Michael A. Zimmerman
发明人： Brian J. Thomann , Michael A. Zimmerman
IPC分类号： H04M100
CPC分类号： H04Q1/116 , H04Q1/035 , H04Q2201/10
摘要： An improved network housing device for protecting telecommunications and electrical systems disposed in the outdoors from foreign objects and influences of the weather and atmosphere comprises a dual enclosure device having an outer enclosure and an inner enclosure unit. With this dual structure, requirements imposed by outdoor use can be allocated among the outer and inner units, with the outer unit fulfilling weatherability and ultra-violet stability requirements, and the inner unit fulfilling low-flammability requirements. The device may be fabricated entirely with plastic to provide a reliable and low-cost housing.
摘要翻译：一种改进的网络外壳设备，用于保护设置在户外的通信和电气系统免受异物和天气和气氛的影响，包括具有外部外壳和内部外壳单元的双重外壳设备。通过这种双重结构，可以在外部和外部单元之间分配户外使用的要求，外部单元满足耐候性和紫外线稳定性要求，内部单元满足低燃烧性要求。该装置可以完全用塑料制造，以提供可靠和低成本的壳体。

56. 发明授权

US06421011B1 Patch antenna using non-conductive frame 有权
标题翻译：贴片天线采用非导电框架
公开(公告)号：US06421011B1
公开(公告)日：2002-07-16
申请号：US09425374
申请日：1999-10-22
申请人： Maarten Van Egmond , Keith V. Guinn , Stelios Papatheodorou , Edward Bryan Roberts , Ming-Ju Tsai , Michael A. Zimmerman
发明人： Maarten Van Egmond , Keith V. Guinn , Stelios Papatheodorou , Edward Bryan Roberts , Ming-Ju Tsai , Michael A. Zimmerman
IPC分类号： H01Q138
CPC分类号： H01Q21/0087 , H01Q1/42 , H01Q9/0407
摘要： A non-conductive frame supports the resonators in a patch antenna assembly. The frame supports the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations. Additionally, the frame grasps the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. The frames may also include posts that are used to attach the frames to the feedboard without using additional components such as screws.
摘要翻译：非导电框架支撑贴片天线组件中的谐振器。该框架支持谐振器而不在谐振器中产生孔，从而避免产生不需要的电场偏振的问题。此外，框架在低电流密度区域中抓住谐振器，从而避免在辐射图中产生额外的干扰。框架还可以包括用于将框架附接到馈送板而不使用诸如螺钉的附加组件的柱。

57. 发明授权

US09819053B1 Solid electrolyte high energy battery 有权
公开(公告)号：US09819053B1
公开(公告)日：2017-11-14
申请号：US13861170
申请日：2013-04-11
申请人： Michael A. Zimmerman
发明人： Michael A. Zimmerman
IPC分类号： C08L81/02 , C08K3/22 , C08K5/08 , H01M10/0565 , B29C47/00 , H01M10/04 , H01M10/0525 , H01M6/18
CPC分类号： H01M10/0565 , B29C47/0004 , B29C47/025 , C08J5/2256 , C08J2381/04 , H01M8/1032 , H01M8/1083 , H01M10/04 , H01M10/0525 , H01M2008/1095 , H01M2300/0082
摘要： The present invention is directed to a battery including a solid ionically conductive polymer electrolyte having a first surface and a second surface; a first electrode disposed on the first surface of the solid ionically conductive polymer electrolyte; a second electrode disposed on the second surface of the solid ionically conductive polymer electrolyte; and at least a first conductive terminal and a second conductive terminal, each terminal being in electrical contact with respectively the first conductive electrode and the second conductive electrode. The invention is also directed to a material including a polymer; a dopant; and at least one compound including an ion source; wherein a liberation of a plurality of ions from the ion source provides a conduction mechanism to form an ionically conductive polymer material. The present invention is further directed to methods for making such batteries and materials.

58. 发明授权

US08852694B2 Articles including surface microfeatures and methods for forming same 有权
标题翻译：文章包括表面微观特征及形成方法
公开(公告)号：US08852694B2
公开(公告)日：2014-10-07
申请号：US13306962
申请日：2011-11-29
申请人： Alfred J. Crosby , Dinesh Chandra , Anuj Seth , Michael A. Zimmerman
发明人： Alfred J. Crosby , Dinesh Chandra , Anuj Seth , Michael A. Zimmerman
IPC分类号： C08F2/48 , B05D5/06 , B05D5/02 , C03C17/30 , C03C17/32 , B05D3/04 , B05D1/42 , B05D3/06
CPC分类号： B05D5/02 , B05D1/42 , B05D3/0486 , B05D3/067 , B05D5/061 , C03C17/30 , C03C17/32 , C03C2217/77 , Y10T428/24355
摘要： A method of forming a polymer film includes dispensing a substrate and coating the substrate with a composition that is curable using actinic radiation. In an example, the method further includes exposing the composition to actinic radiation in presence of an atmosphere including 1 vol % to 37 vol % oxygen, whereby the surface of the composition forms an undulating morphology. In another example, the method further includes applying an oxygen-containing overlay over the composition, exposing the composition to actinic radiation through the oxygen-containing overlay, and removing the oxygen-containing overlay, whereby the surface of the composition forms an undulating morphology.
摘要翻译：形成聚合物膜的方法包括分配基底并用可光化辐射固化的组合物涂覆基底。在一个实例中，该方法还包括在包含1体积％至37体积％氧气的气氛的存在下将组合物暴露于光化辐射，由此组合物的表面形成起伏的形态。在另一个实例中，该方法还包括在组合物上施加含氧覆盖物，使组合物暴露于通过含氧覆盖物的光化辐射，以及除去含氧覆盖层，由此组合物的表面形成起伏的形态。

59. 发明授权

US08039945B2 Plastic electronic component package 有权
标题翻译：塑料电子元件包装
公开(公告)号：US08039945B2
公开(公告)日：2011-10-18
申请号：US12950528
申请日：2010-11-19
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： H01L23/48
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

60. 发明申请

US20110209755A1 LIQUID CRYSTAL POLYMER BARRIER FILMS FOR OPTOELECTRONICS 审中-公开
标题翻译：用于光电子的液晶聚合物屏障膜
公开(公告)号：US20110209755A1
公开(公告)日：2011-09-01
申请号：US12979624
申请日：2010-12-28
申请人： Michael A. Zimmerman , Avin V. Dhoble , Frank J. Csillag
发明人： Michael A. Zimmerman , Avin V. Dhoble , Frank J. Csillag
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L51/448 , C09K19/02 , C09K19/38 , C09K2219/03 , H01L51/5253 , Y02E10/549
摘要： An optoelectronic structure can include a liquid crystal polymer layer and an optoelectronic device adjacent to a first surface of the liquid crystal polymer layer. The liquid crystal polymer layer can include the first surface and a second surface opposite the first surface. In an embodiment, the liquid crystal polymer layer can further include a liquid crystal polymer at least partially exposed to a gas at the second surface. In another embodiment, the liquid crystal polymer may be a thermotropic liquid crystal polymer. In still another embodiment, the polymer layer can include an additive to reduce migration of a gas through the polymer layer. Methods of forming such optoelectronic structures can include melt-processing techniques.
摘要翻译：光电结构可以包括液晶聚合物层和与液晶聚合物层的第一表面相邻的光电器件。液晶聚合物层可以包括第一表面和与第一表面相对的第二表面。在一个实施方案中，液晶聚合物层可进一步包括至少部分地暴露于第二表面处的气体的液晶聚合物。在另一个实施方案中，液晶聚合物可以是热致变液晶聚合物。在另一个实施方案中，聚合物层可以包括添加剂以减少气体通过聚合物层的迁移。形成这种光电子结构的方法可以包括熔融加工技术。

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