会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 56. 发明授权
    • Semiconductor member manufacturing method and semiconductor device manufacturing method
    • 半导体元件制造方法及半导体器件的制造方法
    • US06828214B2
    • 2004-12-07
    • US10112751
    • 2002-04-02
    • Kazuya NotsuNobuhiko Sato
    • Kazuya NotsuNobuhiko Sato
    • H01L2130
    • H01L21/76259Y10T428/12674Y10T428/24802Y10T428/24917Y10T428/249953
    • This invention provides an SOI substrate manufacturing method using a transfer method (bonding and separation). A separation layer (12) is formed on a silicon substrate (11). A silicon layer (13), SiGe layer (14), silicon layer (15′), and insulating layer (21) are sequentially formed on the resultant structure to prepare a first substrate (10′). This first substrate (10′) is bonded to a second substrate (30). The bonded substrate stack is separated into two parts at the separation layer (12). Next, Ge in the SiGe layer (14) is diffused into the silicon layer (13) by hydrogen annealing. With this process, a strained SOI substrate having the SiGe layer on the insulating layer (21) and a strained silicon layer on the SiGe layer is obtained.
    • 本发明提供一种使用转印方法(接合和分离)的SOI衬底制造方法。 在硅衬底(11)上形成分离层(12)。 在所得结构上依次形成硅层(13),SiGe层(14),硅层(15')和绝缘层(21),以制备第一衬底(10')。 该第一基板(10')结合到第二基板(30)上。 键合衬底叠层在分离层(12)处分成两部分。 接下来,SiGe层(14)中的Ge通过氢退火扩散到硅层(13)中。 通过该工艺,可以获得在绝缘层(21)上具有SiGe层的应变SOI衬底和SiGe层上的应变硅层。
    • 60. 发明授权
    • Semiconductor substrate and method for producing the same
    • 半导体衬底及其制造方法
    • US06593211B2
    • 2003-07-15
    • US09390283
    • 1999-09-03
    • Nobuhiko Sato
    • Nobuhiko Sato
    • H01L2130
    • H01L21/02381H01L21/0245H01L21/02513H01L21/02532H01L21/0262H01L21/02661H01L21/76259
    • There are disclosed a semiconductor substrate having a non-porous monocrystalline layer with reduced crystal defects on a porous silicon layer and a method of forming the substrate. The forming method comprises a heat treatment step of heat-treating a porous silicon layer in an atmosphere not containing a silicon-based gas and the step of growing a non-porous monocrystalline layer on the porous silicon layer, wherein the heat treatment is conducted under the conditions such that the etched thickness of the silicon layer is 2 nm or less and that the rate of change r of the surface pore density of the porous silicon layer (r=surface pore density after heat treatment/surface pore density before heat treatment) satisfies the relationship 1/10000≦r≦1.
    • 公开了一种半导体衬底,其具有在多孔硅层上具有减小的晶体缺陷的非多孔单晶层和形成衬底的方法。成形方法包括热处理步骤,其在大气中热处理多孔硅层 含有硅基气体的步骤以及在所述多孔硅层上生长无孔单晶层的步骤,其中所述热处理在所述硅层的蚀刻厚度为2nm以下的条件下进行, 的多孔硅层的表面孔密度的变化率r(r =热处理后的表面孔密度/热处理前的表面孔密度)满足1/10000 <= r <1的关系。