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51. 发明授权

US07374428B2 Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
标题翻译：使用金属弹性体半环和其他多点接触几何的地面阵列（LGA）插入器
公开(公告)号：US07374428B2
公开(公告)日：2008-05-20
申请号：US11865395
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

52. 发明授权

US07361025B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07361025B2
公开(公告)日：2008-04-22
申请号：US11865423
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

53. 发明授权

US07361024B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07361024B2
公开(公告)日：2008-04-22
申请号：US11865217
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

54. 发明授权

US07354277B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07354277B2
公开(公告)日：2008-04-08
申请号：US11865293
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

55. 发明授权

US07172431B2 Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof 失效
标题翻译：电连接器设计和接触几何及其使用方法及其制造方法
公开(公告)号：US07172431B2
公开(公告)日：2007-02-06
申请号：US10928473
申请日：2004-08-27
申请人： Brian S. Beaman , George Liang-Tai Chiu , Keith Fogel , Paul A. Lauro , Daniel P. Morris , Da-Juan Shih
发明人： Brian S. Beaman , George Liang-Tai Chiu , Keith Fogel , Paul A. Lauro , Daniel P. Morris , Da-Juan Shih
IPC分类号： H01R12/00
CPC分类号： H01R13/2464 , G01R1/06716 , G01R1/06727 , G01R1/07314 , G01R1/07357 , H01R12/714
摘要： A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.
摘要翻译：探针或电连接器包括具有多个电接触位置的表面的基底。成形细长的电导体具有联接到电接触位置之一的第一端和其第二端，其突出远离电接触位置并穿过材料片中的孔。片材被设置成与衬底的表面间隔开。在细长电导体的第二端，有一个尖端结构，其大于该材料片中的孔。尖端结构具有其尖端部分。尖端结构设置成抵靠接触表面的接触位置。电子结构朝向接触表面移动，允许尖端结构穿过其中的电接触位置的表面并且随着成形细长电导体由于被...的压缩而弯曲而在其表面上移动，擦拭或振动电子结构向接触表面移动。

56. 发明授权

US06848914B2 Electrical coupling of substrates by conductive buttons 有权
标题翻译：通过导电按钮电连接基板
公开(公告)号：US06848914B2
公开(公告)日：2005-02-01
申请号：US09975213
申请日：2001-10-11
申请人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
发明人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
IPC分类号： H01R12/52 , H01R13/24 , H01R43/00 , H01R12/00
CPC分类号： H01R43/007 , H01R12/52 , H01R13/2421
摘要： A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.
摘要翻译：用于电耦合两个基板（例如，印刷线路板和电子模块）的结构和方法。首先，提供介质芯。导电布线围绕介质芯螺旋缠绕。此外，可以在导电布线周围形成电介质护套。所得的导电杆结构沿着导电棒的长度被轴向地切割，以产生具有端部触头的导电按钮。导电按钮的端部触点可用于将两个基板电耦合到两个基板的相应焊盘处。

57. 发明授权

US06618942B2 Method for insertion of inserting printed circuit card into socket connectors 失效
标题翻译：将印刷电路卡插入插座连接器的方法
公开(公告)号：US06618942B2
公开(公告)日：2003-09-16
申请号：US09970618
申请日：2001-10-04
申请人： Brian S. Beaman , Scott J. Hadderman , Richard D. Wheeler
发明人： Brian S. Beaman , Scott J. Hadderman , Richard D. Wheeler
IPC分类号： H05K1300
CPC分类号： H01R12/88 , H01R12/721 , Y10T29/49139 , Y10T29/49169 , Y10T29/49217
摘要： A method for insertion of inserting printed circuit card into socket connectors which prevents sockets from getting contaminated or damaged during the insertion of a printed circuit card comprises the steps of: inserting a cam for moving a socket connector's contacts outwardly so that they will not make contact with a card's edge when it is inserted between the contacts of the sockets connector as it is inserted, and after the printed circuit card is inserted the printed circuit card moving the printed circuit card until it makes contact with a stop in the socket connector, and after the printed circuit card has contacted the stop in the socket connector, moving the cam to a closed position allowing the printed circuit card to be seated, and seating the printed circuit card by moving it to cause and allow for an amount of wipe to clean the connector's contacts without contaminating or damaging the socket connector's contacts during the insertion of said printed circuit card.
摘要翻译：将插入印刷电路卡插入到插座连接器中以防止在插入印刷电路卡期间插座受到污染或损坏的插入方法包括以下步骤：插入用于向外移动插座连接器触头的凸轮，使得它们不会接触当插入插座连接器的触点之间时插入卡的边缘，并且在印刷电路卡插入印刷电路卡之后移动印刷电路卡直到其与插座连接器中的止动件接触，并且在印刷电路卡已经与插座连接器中的停止点接触之后，将凸轮移动到关闭位置，允许印刷电路卡就座，并且通过移动印刷电路卡来安置印刷电路板，并允许擦拭量清洁连接器的触点在插入所述印刷电路卡期间不会污染或损坏插座连接器的触头。

58. 发明授权

US4998885A Elastomeric area array interposer 失效
标题翻译：弹性体阵列插入片
公开(公告)号：US4998885A
公开(公告)日：1991-03-12
申请号：US427548
申请日：1989-10-27
申请人： Brian S. Beaman
发明人： Brian S. Beaman
IPC分类号： H01R11/01 , H01L23/538 , H01R12/04 , H01R12/16 , H01R13/24 , H01R43/00 , H05K1/14 , H05K3/36
CPC分类号： H01R13/2414 , H01L23/5385 , H01L2924/0002
摘要： This invention provides an interposer for electrically connecting two substrates with high density interconnections. The interposer comprises an elastomeric material surrounding fine metal wires which extend through the elastomeric material. The elastomeric material provides mechanical support and electrical isolation for the wires which connect the two opposing surfaces of the interposer with mating substrates. One surface of the interposed has scribes cut into it which mechanically isolate the individual wires. This mechanical isolation between wires reduces the stress placed on the substrates from being connected when the interposer is compressed between the substrates. The support given individual wires by the elastomeric material is controlled, by adjusting the spacing and widths of the scribes, to provide uniform compression across the substrates. Reducing the differentials in compression across the substrates reduces the stress on the substrates and their connections, and therefore, maintains substrate reliability when the substrates are exposed to extended time periods under compression.

59. 发明授权

US08752284B2 Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer 有权
标题翻译：利用金属弹性体制造平面栅格阵列（LGA）插入器的方法
公开(公告)号：US08752284B2
公开(公告)日：2014-06-17
申请号：US12047552
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机

60. 发明授权

US08505200B2 Land grid array interposer producing method 有权
标题翻译： Land Grid阵列中介制作方法
公开(公告)号：US08505200B2
公开(公告)日：2013-08-13
申请号：US12208581
申请日：2008-09-11
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R43/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：一种制造模块装置的方法，其包括包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机

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