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    • 53. 发明申请
    • OPTICAL NETWORK TERMINAL OF THE GIGABIT PASSIVE OPTICAL NETWORK AND FRAME TREATMENT METHOD OF THE ONT
    • 技术的光网络终端被动光网络和帧的处理方法
    • US20100260498A1
    • 2010-10-14
    • US12747330
    • 2009-04-28
    • Kwang-ok KimYong-tae KimDong-soo Lee
    • Kwang-ok KimYong-tae KimDong-soo Lee
    • H04J14/00
    • H04J3/1694H04Q11/0067H04Q2011/0064
    • A gigabit passive optical network (GPON) system for fiber to the home (FTTH) service must provide a down-stream data rate of an optical band to provide IPTV service with hundreds of channels to subscribers, and must be able to provide an upstream data rate of an optical band using a currently available BM-IC chip. A currently available BM-IC chip for a GPON has 1.244 Gbps and 2.488 Gbps modes. Accordingly, an optical network terminal (ONT) for a GPON that is capable of providing a downstream transmission band of 10-Gbps and an upstream transmission band of 1.244 Gbps or 2.488 Gbps, and a method for processing an upstream frame in the terminal, are provided. The GPON ONT can provide 20 Mbps, high-definition IPTV service with 500 channels and can provide both upstream data rates of 1.244 Gbps and 2.488 Gbps according to a user's selection without using an additional device.
    • 用于光纤到家庭(FTTH)业务的千兆无源光网络(GPON)系统必须提供光带的下行数据速率,以向用户提供数百个信道的IPTV服务,并且必须能够提供上行数据 使用当前可用的BM-IC芯片的光学带宽率。 目前用于GPON的BM-IC芯片具有1.244 Gbps和2.488 Gbps模式。 因此,能够提供10Gbps的下行传输频带和1.244Gbps或2.488Gbps的上行传输频带的GPON的光网络终端(ONT)以及用于处理终端中的上行帧的方法是 提供。 GPON ONT可以提供具有500个通道的20 Mbps高清晰度IPTV服务,并可根据用户的选择提供1.244 Gbps和2.488 Gbps的上行数据速率,而无需使用其他设备。
    • 55. 发明授权
    • High voltage transistor and method of manufacturing the same
    • 高压晶体管及其制造方法
    • US07221028B2
    • 2007-05-22
    • US10899371
    • 2004-07-26
    • Tae-kwang YuHee-seog JeonSeung-beom YoonYong-tae Kim
    • Tae-kwang YuHee-seog JeonSeung-beom YoonYong-tae Kim
    • H01L29/72
    • H01L29/66659H01L21/26586H01L21/28114H01L29/42376H01L29/665H01L29/7835
    • The present invention relates to a high voltage transistor and method of manufacturing the same. The high voltage transistor includes: a channel region which is formed in a semiconductor substrate; a gate insulating film which is formed on the channel region of the semiconductor substrate; a low concentration source region and a low concentration drain region having the channel region interposed therebetween and each being formed in the semiconductor substrate; a high concentration source region which is formed to be spaced away from the channel region by a first distance; a high concentration drain region which is formed to be spaced away from the channel region by a second distance that is larger than the first distance; a gate electrode which has a gate bottom portion interfacing with the gate insulating film over the channel region, and a gate top portion integrated with the gate bottom portion and protruding by a predetermined length from a top of the gate bottom portion to extend over the low concentration drain region; a first metal silicide layer which is formed on the high concentration source region; and a second metal silicide layer which is formed on the high concentration drain region.
    • 本发明涉及高压晶体管及其制造方法。 高压晶体管包括:形成在半导体衬底中的沟道区; 形成在半导体衬底的沟道区上的栅极绝缘膜; 低浓度源极区和低浓度漏极区,其间具有沟道区,并且各自形成在半导体衬底中; 高浓度源区,其形成为与沟道区隔开第一距离; 高浓度漏区,其形成为与沟道区隔开距离大于第一距离的第二距离; 栅极电极,其具有与沟道区域上的栅极绝缘膜接合的栅极底部,以及与栅极底部一体化并且从栅极底部的顶部突出预定长度的栅极顶部,以在低于 浓度排水区; 形成在高浓度源区上的第一金属硅化物层; 以及形成在高浓度漏极区上的第二金属硅化物层。
    • 57. 发明授权
    • Split gate type nonvolatile semiconductor memory device, and method of fabricating the same
    • 分路型非易失性半导体存储器件及其制造方法
    • US07029974B2
    • 2006-04-18
    • US11083130
    • 2005-03-17
    • Heeseog JeonSeung-beom YoonYong-tae KimYong-suk Choi
    • Heeseog JeonSeung-beom YoonYong-tae KimYong-suk Choi
    • H01L21/336
    • H01L27/115H01L21/28273H01L27/11521H01L29/42324H01L29/513H01L29/7881
    • A split gate type nonvolatile semiconductor memory device and a method of fabricating a split gate type nonvolatile semiconductor memory device are provided. A gate insulating layer and a floating-gate conductive layer are formed on a semiconductor substrate. A mask layer pattern is formed on the floating-gate conductive layer to define a first opening extending in a first direction. First sacrificial spacers having a predetermined width are formed on both sidewalls corresponding to the mask layer pattern. An inter-gate insulating layer is formed on the floating-gate conductive layer. The first sacrificial spacers are removed, and the floating-gate conductive layer is etched until the gate insulating layer is exposed. A tunneling insulating layer is formed on an exposed portion of the floating-gate conductive layer. A control-gate conductive layer is formed on a surface of the semiconductor substrate. Second sacrificial spacers having predetermined widths are formed on the control-gate conductive layer. A split control gate is formed in the first opening, by etching the exposed control-gate conductive layer. The remaining mask layer pattern and inter-gate insulating layer are etched until the floating-gate conductive layer is exposed. The exposed floating-gate conductive layer is etched to form a split floating gate in the first opening.
    • 提供一种分离栅极型非易失性半导体存储器件及其制造分离栅型非易失性半导体存储器件的方法。 在半导体衬底上形成栅绝缘层和浮栅导电层。 掩模层图案形成在浮栅导电层上以限定沿第一方向延伸的第一开口。 具有预定宽度的第一牺牲间隔物形成在对应于掩模层图案的两个侧壁上。 栅极间绝缘层形成在浮栅导电层上。 去除第一牺牲间隔物,并且蚀刻浮栅导电层,直到露出栅极绝缘层。 隧道绝缘层形成在浮栅导电层的露出部分上。 在半导体衬底的表面上形成控制栅导电层。 在控制栅极导电层上形成具有预定宽度的第二牺牲间隔物。 通过蚀刻暴露的控制栅极导电层,在第一开口中形成分裂控制栅极。 蚀刻剩余的掩模层图案和栅极间绝缘层,直到浮栅导电层露出。 蚀刻暴露的浮栅导电层,以在第一开口中形成分离浮栅。