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    • 58. 发明授权
    • Method of forming a thin film transistor
    • 形成薄膜晶体管的方法
    • US5595923A
    • 1997-01-21
    • US467986
    • 1995-06-06
    • Hongyong ZhangHideki UochiToru TakayamaYasuhiko TakemuraMutsuo Yamamoto
    • Hongyong ZhangHideki UochiToru TakayamaYasuhiko TakemuraMutsuo Yamamoto
    • G02F1/1362H01L21/20H01L21/336H01L21/8238H01L27/092H01L27/12H01L29/786H01L21/84
    • H01L27/1251H01L21/2022H01L21/8238H01L27/0922H01L27/1237H01L27/1277H01L29/66757H01L29/78618H01L29/78675G02F1/13454Y10S148/016
    • A substance containing a catalyst element is formed so as to closely contact with an amorphous silicon film, or a catalyst element is introduced into the amorphous silicon film. The amorphous silicon film is annealed at a temperature which is lower than a crystallization temperature of usual amorphous silicon, thereby selectively crystallizing the amorphous silicon film. The crystallized region is used as a crystalline silicon TFT which can be used in a peripheral driver circuit of an active matrix circuit. The region which remains amorphous is used as an amorphous silicon TFT which can be used in a pixel circuit. A relatively small amount of a catalyst element for promoting crystallization is added to an amorphous silicon film, and an annealing process is conducted at a temperature which is lower than the distortion temperature of a substrate, thereby crystallizing the amorphous silicon film. A gate insulating film, and a gate electrode are then formed, and an impurity is implanted in a self-alignment manner. A film containing a catalyst element for promoting crystallization is closely contacted with the impurity region, or a relatively large amount of a catalyst element is introduced into the impurity region by an ion implantation or the like. Then, an annealing process is conducted at a temperature which is lower than the distortion temperature of the substrate, thereby activating the doping impurity.
    • 形成含有催化剂元素的物质,以与非晶硅膜紧密接触,或将催化剂元素引入到非晶硅膜中。 非晶硅膜在比通常的非晶硅的结晶温度低的温度下退火,从而选择性地使非晶硅膜结晶。 结晶区域用作可用于有源矩阵电路的外围驱动电路的晶体硅T​​FT。 保持非晶形的区域用作可用于像素电路中的非晶硅TFT。 在非晶硅膜中添加相对少量的促进结晶的催化剂元素,并且在比基板的变形温度低的温度下进行退火处理,从而使非晶硅膜结晶。 然后形成栅极绝缘膜和栅电极,并以自对准的方式注入杂质。 含有促进结晶的催化剂元素的膜与杂质区紧密接触,或者通过离子注入等将相对大量的催化剂元素引入杂质区。 然后,在比基板的变形温度低的温度下进行退火处理,从而激活掺杂杂质。
    • 59. 发明授权
    • Method for manufacturing a thin film transistor device
    • 制造薄膜晶体管器件的方法
    • US07622335B2
    • 2009-11-24
    • US10926059
    • 2004-08-26
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/00
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。