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    • 51. 发明申请
    • Solid state imaging device, method for driving the same and camera using the same
    • 固态成像装置,其驱动方法及使用其的相机
    • US20050088557A1
    • 2005-04-28
    • US10990724
    • 2004-11-17
    • Takao KurodaSei SuzukiAkito Kidera
    • Takao KurodaSei SuzukiAkito Kidera
    • H01L27/148H04N3/14H04N5/357H04N5/376
    • H04N5/3728H04N5/357H04N5/3597
    • In making solid state imaging devices smaller and increasing their number of pixels, it is desirable to increase the charge amount that can be handled per unit area of the transfer portions. It is possible to achieve this by making the insulating film thinner, but this leads to electric fields in the semiconductor substrate that are too strong, and causes problems such as the generation of noise and the deterioration of the transfer efficiency. This invention relaxes potential steps in the transfer region by applying, when a signal charge 1 is being read out (t=t2), a high voltage to the electrode 43 for reading out the signal charge, a low voltage to at least one of the electrodes 41, 45-47 for preventing unnecessary mixing of signal charges, and an intermediate voltage between the high voltage and the low voltage to the electrodes 42 and 44, which are adjacent to the electrode 43 to which the high voltage is applied.
    • 在使固态成像装置更小并且其像素数量增加的情况下,期望增加可以在转印部分的每单位面积处理的电荷量。 可以通过使绝缘膜更薄而实现这一点,但是这导致半导体衬底中的电场太强,并且引起噪声的产生和传输效率的劣化等问题。 本发明通过在读出信号电荷1(t = t 2 2)时施加向读出信号电荷的电极43施加的高电压,放松了转印区域中的潜在步骤, 低电压至至少一个电极41,45-47,用于防止信号电荷的不必要的混合,以及与电极43相邻的电极42和44的高电压和低电压之间的中间电压, 施加高电压。
    • 52. 发明授权
    • Method for estimating yield of integrated circuit device
    • 集成电路器件产量估算方法
    • US06311139B1
    • 2001-10-30
    • US09061088
    • 1998-04-16
    • Takao KurodaHideki Ishida
    • Takao KurodaHideki Ishida
    • G06F1500
    • H01L22/20H01L2924/0002H01L2924/00
    • The necessary information such as chip area A, number of elements, and defect density D is inputted to calculate element density TD and mean element density TDM. The inverse operation chip area A′ is calculated from the estimation equation: Y=f(A) such as Stapper's equation showing the dependence of the yield on the defect density D and chip area A. Next, for various kinds of integrated circuit devices in a diffusion process, the functional relation g (TD/TDM) which is considered to be most correct is determined from the data of the relationship between the ratio (A′/A) and the ratio (TD/TDM), and from the relational expression g (TD/TDM), the correction factor K is calculated. Finally, the values of the correction factor K and the chip area A are substituted into Y=f(A×K) to calculate the expected yield Y.
    • 输入芯片面积A,元件数量和缺陷密度D等必要的信息来计算元件密度TD和平均元件密度TDM。 根据估计方程:Y = f(A)计算反向运算芯片面积A',例如显示产量对缺陷密度D和芯片面积A的依赖性的Stapper方程。接下来,对于各种集成电路器件 考虑到扩散过程,从比率(A'/ A)和比率(TD / TDM)之间的关系的数据中确定被认为是最正确的功能关系g(TD / TDM),并且从关系 表达式g(TD / TDM),计算校正因子K. 最后,将校正因子K和芯片面积A的值代入Y = f(AxK)来计算预期的产量Y.
    • 53. 发明授权
    • Solid state imaging device and a method of driving the same
    • 固态成像装置及其驱动方法
    • US06248133B1
    • 2001-06-19
    • US08631834
    • 1996-04-10
    • Hiroyoshi KomobuchiAkira FukumotoTakahiro YamadaTakao KurodaYuji Matsuda
    • Hiroyoshi KomobuchiAkira FukumotoTakahiro YamadaTakao KurodaYuji Matsuda
    • H04M5335
    • H01L27/14806
    • A solid state imaging device has: a first polysilicon layer 901; a second polysilicon layer 902; a photoelectric converting portion or PD 903; a read gate 904; a read channel 905 (in this case, an N-layer) which is formed in a semiconductor below the read gate; a P-layer 906 which prevents a signal charge from erroneously entering a VCCD of a unit pixel adjacent in a horizontal direction; a P-layer 907 which defines the transfer channel region of a VCCD; and a VCCD 908 which transfers a signal charge in the direction of the arrows. A unit pixel 900 is indicated by a one-dot chain line. The two-dimensionally arrayed solid state imaging device is driven by driving pulses of eight phases in total, namely, a driving pulse &phgr;V1 911, a driving pulse &phgr;V2 912, a driving pulse &phgr;V3 913, a driving pulse &phgr;V4 914, a driving pulse &phgr;V5 915, a driving pulse &phgr;V6 916, a driving pulse &phgr;V7 917, and a driving pulse &phgr;V8 918.
    • 固态成像装置具有:第一多晶硅层901; 第二多晶硅层902; 光电转换部分或PD 903; 读门904; 在读取栅极下方形成半导体的读通道905(在这种情况下为N层); P层906,其防止信号电荷错误地进入水平方向相邻的单位像素的VCCD; 限定VCCD的传输通道区域的P层907; 以及VCCD 908,其沿箭头方向传送信号电荷。 单位像素900由单点划线表示。 二维排列的固态成像装置由驱动脉冲phiV1 911,驱动脉冲phiV2 912,驱动脉冲phiV3 913,驱动脉冲phiV4 914,驱动脉冲phiV5 驱动脉冲phiV6 916,驱动脉冲phiV7 917,驱动脉冲phiV8 918。
    • 54. 发明授权
    • Semiconductor device
    • 半导体器件
    • US5831296A
    • 1998-11-03
    • US235155
    • 1994-04-28
    • Takao KurodaYasuhiro Shiraki
    • Takao KurodaYasuhiro Shiraki
    • H01L29/812H01L21/20H01L21/338H01L29/201H01L29/205H01L29/778H01L29/80
    • H01L29/205H01L29/7783Y10S438/938
    • Disclosed is a semiconductor device comprising an undoped GaAs layer, an intermediate undoped layer and an undoped Ga.sub.1-x Al.sub.x As layer which are successively provided on a substrate made of a semiinsulating GaAs crystal; the intermediate undoped layer being an undoped In.sub.y Ga.sub.1-y As layer, an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs layer, or a superlattice layer which includes an undoped GaAs.sub.1-z Sb layer and an undoped GaAs layer. When applied to a high electron mobility transistor, this semiconductor device affords a high current and a high speed and has the merit of a small dispersion in the threshold voltage thereof.
    • 公开了一种半导体器件,其包括未掺杂的GaAs层,中间未掺杂层和未掺杂的Ga1-xAlxAs层,其连续地设置在由半绝缘GaAs晶体制成的衬底上; 中间未掺杂层是未掺杂的In y Ga 1-y As层,未掺杂的GaAs1-zSbz层,包含未掺杂的In y Ga 1-y As层的超晶格层和未掺杂的GaAs1-zSbz层,包含未掺杂的In y Ga 1-y As层的超晶格层和 未掺杂的GaAs层或包含未掺杂的GaAs1-zSb层和未掺杂的GaAs层的超晶格层。 当施加到高电子迁移率晶体管时,该半导体器件提供高电流和高速度,并且其阈值电压具有小的色散。
    • 59. 发明授权
    • Phase-locked semiconductor laser device
    • 锁相半导体激光器件
    • US4509173A
    • 1985-04-02
    • US366324
    • 1982-04-07
    • Jun-ichi UmedaHisao NakashimaTakashi KajimuraTakao Kuroda
    • Jun-ichi UmedaHisao NakashimaTakashi KajimuraTakao Kuroda
    • H01S5/00H01S5/40H01S3/19
    • H01S5/4068
    • A semiconductor laser device is provided with a semiconductor substrate and at least a semiconductor assembly for optical confinement formed on the substrate which includes an active layer and cladding layers. A first electrode is disposed on the semiconductor assembly and a second electrode is disposed on the semiconductor substrate. To provide a phase-locked semiconductor laser device of high quality, a plurality of regions are provided in the semiconductor assembly which, in effect, cause a variation of a complex refractive index for a laser beam in a direction intersecting with a traveling direction of the laser beam. These regions can be discretely disposed over or under the active layer and give rise to a nonlinear interaction between adjacent laser emission regions formed by the plurality of regions.
    • 半导体激光装置设置有半导体基板和至少一个形成在基板上的用于光学限制的半导体组件,该半导体组件包括有源层和包层。 第一电极设置在半导体组件上,第二电极设置在半导体衬底上。 为了提供高质量的锁相半导体激光器件,在半导体组件中设置多个区域,其实际上导致激光束在与行进方向相交的方向上的复合折射率的变化 激光束。 这些区域可以离散地设置在有源层上或下方,并产生由多个区域形成的相邻激光发射区域之间的非线性相互作用。