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51. 发明申请

US20080293215A1 Method of fabricating a semiconductor device having a single gate electrode corresponding to a pair of fin-type channel regions 有权
公开(公告)号：US20080293215A1
公开(公告)日：2008-11-27
申请号：US12219737
申请日：2008-07-28
申请人： Suk-Pil Kim , Yoon-Dong Park , Won-Joo Kim , Dong-Gun Park , Eun-Suk Cho , Suk-Kang Sung , Byung-Yong Choi , Tae-Yong Kim , Choong-Ho Lee
发明人： Suk-Pil Kim , Yoon-Dong Park , Won-Joo Kim , Dong-Gun Park , Eun-Suk Cho , Suk-Kang Sung , Byung-Yong Choi , Tae-Yong Kim , Choong-Ho Lee
IPC分类号： H01L21/76
CPC分类号： H01L29/785 , H01L21/28273 , H01L21/28282 , H01L21/84 , H01L27/10873 , H01L27/10879 , H01L27/1159 , H01L27/2436 , H01L29/66795
摘要： Provided are methods for fabricating semiconductor devices incorporating a fin-FET structure that provides body-bias control, exhibits some characteristic advantages associated with SOI structures, provides increased operating current and/or reduced contact resistance. The methods for fabricating semiconductor devices include forming insulating spacers on the sidewalls of a protruding portion of a first insulation film; forming a second trench by removing exposed regions of the semiconductor substrate using the insulating spacers as an etch mask, and thus forming fins in contact with and supported by the first insulation film. After forming the fins, a third insulation film is formed to fill the second trench and support the fins. A portion of the first insulation film is then removed to open a space between the fins in which additional structures including gate dielectrics, gate electrodes and additional contact, insulating and storage node structures may be formed.

52. 发明申请

US20080157182A1 Semiconductor device and method of fabricating the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20080157182A1
公开(公告)日：2008-07-03
申请号：US11980632
申请日：2007-10-31
申请人： Seung-hwan Song , Suk-pil Kim , Yoon-dong Park , Won-joo Kim , June-mo Koo , Kyoung-Iae Cho , Jae-Woong Hyun , Sung-jae Byun
发明人： Seung-hwan Song , Suk-pil Kim , Yoon-dong Park , Won-joo Kim , June-mo Koo , Kyoung-Iae Cho , Jae-Woong Hyun , Sung-jae Byun
IPC分类号： H01L29/788 , H01L21/336
CPC分类号： H01L29/785 , H01L21/76897 , H01L29/41791 , H01L29/66795 , H01L29/66825 , H01L29/66833 , H01L29/7851 , H01L29/7881 , H01L29/792 , H01L2029/7858
摘要： Example embodiments relate to a semiconductor device including a fin-type channel region and a method of fabricating the same. The semiconductor device includes a semiconductor substrate, a semiconductor pillar and a contact plug. The semiconductor substrate includes at least one pair of fins used (or functioning) as an active region. The semiconductor pillar may be interposed between portions of the fins to connect the fins. The contact plug may be disposed (or formed) on the semiconductor pillar and electrically connected to top surfaces of the fins.
摘要翻译：示例性实施例涉及包括鳍型沟道区的半导体器件及其制造方法。半导体器件包括半导体衬底，半导体柱和接触插塞。半导体衬底包括至少一对使用（或功能）作为活性区的翅片。半导体柱可以插入翅片的部分之间以连接散热片。接触插塞可以设置（或形成）在半导体柱上并电连接到散热片的顶表面。

53. 发明申请

US20080157176A1 Nonvolatile memory device and method of fabricating the same 失效
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20080157176A1
公开(公告)日：2008-07-03
申请号：US11902511
申请日：2007-09-21
申请人： Won-joo Kim , Yoon-dong Park , June-mo Koo , Suk-pil Kim , Sung-jae Byun
发明人： Won-joo Kim , Yoon-dong Park , June-mo Koo , Suk-pil Kim , Sung-jae Byun
IPC分类号： H01L27/115 , H01L21/8247
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11568 , H01L29/42336 , H01L29/66803
摘要： A nonvolatile memory device having lower bit line contact resistance and a method of fabricating the same is provided. In the nonvolatile memory device, a semiconductor substrate of a first conductivity type may include first and second fins. A common bit line electrode may connect one end of the first fin to one end of the second fin. A plurality of control gate electrodes may cover the first and second fins and expand across the top surface of each of the first and second fins. A first string selection gate electrode may be positioned between the common bit line electrode and the plurality of control gate electrodes. The first string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. A second string selection gate electrode may be positioned between the first string selection gate electrode and the plurality of control gate electrodes. The second string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. The first fin under the first string selection gate electrode and the second fin under the second string selection gate electrode may have a second conductivity type opposite to the first conductivity type.
摘要翻译：提供一种具有较低位线接触电阻的非易失性存储器件及其制造方法。在非易失性存储器件中，第一导电类型的半导体衬底可以包括第一和第二鳍片。公共位线电极可将第一鳍片的一端连接到第二鳍片的一端。多个控制栅极电极可以覆盖第一和第二鳍片并且跨越第一和第二鳍片中的每一个的顶表面膨胀。第一串选择栅极可以位于公共位线电极和多个控制栅电极之间。第一串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。第二串选择栅电极可以位于第一串选择栅电极和多个控制栅电极之间。第二串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。第一串选择栅电极下的第一鳍和第二串选择栅电极下的第二鳍可以具有与第一导电类型相反的第二导电类型。

54. 发明申请

US20080135916A1 Non-volatile memory device and method of fabricating the same 失效
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20080135916A1
公开(公告)日：2008-06-12
申请号：US11987008
申请日：2007-11-26
申请人： Won-joo Kim , Yoon-dong Park , June-mo Koo , Suk-pil Kim
发明人： Won-joo Kim , Yoon-dong Park , June-mo Koo , Suk-pil Kim
IPC分类号： H01L21/336 , H01L29/788
CPC分类号： H01L29/7885 , H01L21/28273 , H01L21/28282 , H01L27/115 , H01L29/42328 , H01L29/42332 , H01L29/42336 , H01L29/42344 , H01L29/42352 , H01L29/7887 , H01L29/792 , H01L29/7923
摘要： Provided are example embodiments of a non-volatile memory device and a method of fabricating the same. The non-volatile memory device may include a control gate electrode arranged on a semiconductor substrate, a gate insulating layer interposed between the semiconductor substrate and the control gate electrode, a storage node layer interposed between the gate insulating layer and the control gate electrode, a blocking insulating layer interposed between the storage node layer and the control gate electrode, first dopant doping regions along a first side of the control gate electrode, and second dopant doping regions along a second side of the control gate electrode. The first dopant doping regions may alternate with the second dopant doping regions. Stated differently, each of the second dopant doping regions may be arranged in a region on the second side of the control gate electrode that is adjacent to one of the first dopant doping regions.
摘要翻译：提供了非易失性存储器件的示例性实施例及其制造方法。非易失性存储器件可以包括布置在半导体衬底上的控制栅电极，介于半导体衬底和控制栅电极之间的栅极绝缘层，介于栅极绝缘层和控制栅电极之间的存储节点层，插入在所述存储节点层和所述控制栅电极之间的阻挡绝缘层，沿着所述控制栅电极的第一侧的第一掺杂剂掺杂区域和沿着所述控制栅电极的第二侧的第二掺杂剂掺杂区域。第一掺杂剂掺杂区域可以与第二掺杂剂掺杂区域交替。换句话说，每个第二掺杂剂掺杂区域可以被布置在与第一掺杂剂掺杂区域中的一个相邻的控制栅电极的第二侧上的区域中。

55. 发明申请

US20080123390A1 Non-volatile memory device and method of fabricating the same 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20080123390A1
公开(公告)日：2008-05-29
申请号：US11882694
申请日：2007-08-03
申请人： Won-joo Kim , Suk-pil Kim , Yoon-dong Park , June-mo Koo
发明人： Won-joo Kim , Suk-pil Kim , Yoon-dong Park , June-mo Koo
IPC分类号： G11C11/00 , H01L21/16
CPC分类号： G11C11/5678 , G11C13/0004 , H01L27/24
摘要： A non-volatile memory device and a method of fabricating the same are provided. In the non-volatile memory device, at least one first semiconductor layer of a first conductivity type may be formed spaced apart from each other on a portion of a substrate. A plurality of first resistance variation storage layers may contact first sidewalls of each of the at least one first semiconductor layer. A plurality of second semiconductor layers of a second conductivity type, opposite to the first conductivity type, may be interposed between the first sidewalls of each of the at least one first semiconductor layer and the plurality of first resistance variation storage layers. A plurality of bit line electrodes may be connected to each of the plurality of first resistance variation storage layers.
摘要翻译：提供了一种非易失性存储器件及其制造方法。在非易失性存储器件中，第一导电类型的至少一个第一半导体层可以在衬底的一部分上彼此间隔开形成。多个第一电阻变化存储层可以接触至少一个第一半导体层中的每一个的第一侧壁。与第一导电类型相反的第二导电类型的多个第二半导体层可以插入在至少一个第一半导体层和多个第一电阻变化存储层中的每一个的第一侧壁之间。多个位线电极可以连接到多个第一电阻变化存储层中的每一个。

56. 发明授权

US07361554B2 Multi-bit non-volatile memory device, method of operating the same, and method of manufacturing the multi-bit non-volatile memory device 失效
标题翻译：多位非易失性存储器件，其操作方法以及制造多位非易失性存储器件的方法
公开(公告)号：US07361554B2
公开(公告)日：2008-04-22
申请号：US11812574
申请日：2007-06-20
申请人： Yoon-dong Park , Sun-ae Seo , Choong-rae Cho , Won-joo Kim , Sang-min Shin
发明人： Yoon-dong Park , Sun-ae Seo , Choong-rae Cho , Won-joo Kim , Sang-min Shin
IPC分类号： H01L21/336
CPC分类号： H01L29/7926 , H01L29/42332 , H01L29/7887 , H01L29/7923
摘要： Disclosed are a multi-bit non-volatile memory device, a method of operating the same, and a method of manufacturing the multi-bit non-volatile memory device. A unit cell of the multi-bit non-volatile memory device may be formed on a semiconductor substrate may include: a plurality of channels disposed perpendicularly to the upper surface of the semiconductor substrate; a plurality of storage nodes disposed on opposite sides of the channels perpendicularly the upper surface of the semiconductor substrate; a control gate surrounding upper portions of the channels and the storage nodes, and side surfaces of the storage nodes; and an insulating film formed between the channels and the storage nodes, between the channels and the control gate, and between the storage nodes and the control gate.
摘要翻译：公开了一种多位非易失性存储器件，其操作方法以及制造该多位非易失性存储器件的方法。多位非易失性存储器件的单元可以形成在半导体衬底上，可以包括：垂直于半导体衬底的上表面设置的多个沟道; 多个存储节点，其设置在所述通道的相对侧，垂直于所述半导体衬底的上表面; 围绕通道和存储节点的上部以及存储节点的侧表面的控制门; 以及形成在通道和存储节点之间，通道和控制栅极之间以及存储节点和控制门之间的绝缘膜。

57. 发明授权

US07352037B2 Semiconductor device and random access memory having single gate electrode corresponding to a pair of channel regions 有权
标题翻译：具有对应于一对通道区域的单个栅电极的半导体器件和随机存取存储器
公开(公告)号：US07352037B2
公开(公告)日：2008-04-01
申请号：US11393750
申请日：2006-03-31
申请人： Won-joo Kim , Suk-pil Kim , Yoon-dong Park , Eun-Hong Lee , Jae-woong Hyun , Jung-hoon Lee , Sung-jae Byun
发明人： Won-joo Kim , Suk-pil Kim , Yoon-dong Park , Eun-Hong Lee , Jae-woong Hyun , Jung-hoon Lee , Sung-jae Byun
IPC分类号： H01L29/94
CPC分类号： H01L29/66795 , H01L27/10823 , H01L27/10826 , H01L27/10876 , H01L27/10879 , H01L27/11507 , H01L27/2436 , H01L29/785
摘要： A semiconductor device may include at least one pair of fins on a semiconductor substrate. A channel region may be formed in each fin. The semiconductor device may further include a gate electrode corresponding to each pair of channel regions, a source contact plug electrically connected to each of at least one source formed on a respective fin concurrently, and a drain contact plug electrically connected to each of at least one drain formed on a respective fin concurrently.
摘要翻译：半导体器件可以包括半导体衬底上的至少一对散热片。可以在每个鳍中形成沟道区。半导体器件还可以包括对应于每对沟道区的栅电极，同时电连接到形成在相应散热片上的至少一个源中的每一个的源极接触插塞以及电连接到至少一个漏斗同时形成在相应的翅片上。

58. 发明授权

US07247227B2 Buffer layer in flat panel display 有权
标题翻译：平板显示缓冲层
公开(公告)号：US07247227B2
公开(公告)日：2007-07-24
申请号：US09960912
申请日：2001-09-21
申请人： Robert J. Hanson , Won-Joo Kim , Mike E. Pugh
发明人： Robert J. Hanson , Won-Joo Kim , Mike E. Pugh
IPC分类号： C25D11/04 , C23C28/00
CPC分类号： H01J29/085 , G02F1/13439 , H01J9/20 , H01J31/127 , H01J2329/08 , H01J2329/865 , H01L51/5206
摘要： In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bonding and other fabrication steps. This aluminum oxide barrier layer is preferably formed either by: (1) partially or completely anodizing an aluminum layer formed over the ITO layer, or (2) an in situ process forming aluminum oxide either over the ITO layer or over an aluminum layer formed on the ITO layer. After either of these processes, an aluminum layer is then formed over the aluminum oxide layer.
摘要翻译：在诸如平板显示器的器件中，当这样的材料将被接触以保护ITO免受例如在阳极接合和其它制造期间的光学和电学缺陷时，在铝层和ITO层之间提供氧化铝层脚步。这种氧化铝阻挡层优选地通过以下方式形成：（1）部分或完全地阳极氧化形成在ITO层上的铝层，或者（2）在ITO层上或在形成在ITO层上的铝层上形成氧化铝的原位工艺 ITO层。在这些工艺中的任一种之后，然后在氧化铝层上形成铝层。

59. 发明申请

US20070103963A1 Non-volatile memory devices and method thereof 有权
标题翻译：非易失性存储器件及其方法
公开(公告)号：US20070103963A1
公开(公告)日：2007-05-10
申请号：US11490129
申请日：2006-07-21
申请人： Won-Joo Kim , Sung-Jae Byun , Yoon-Dong Park , Eun-Hong Lee , Suk-Pil Kim , Jae-Woong Hyun
发明人： Won-Joo Kim , Sung-Jae Byun , Yoon-Dong Park , Eun-Hong Lee , Suk-Pil Kim , Jae-Woong Hyun
IPC分类号： G11C11/00
CPC分类号： G11C13/0007 , G11C11/5678 , G11C11/5685 , G11C13/0004 , G11C16/0416 , G11C2213/31 , G11C2213/32 , G11C2213/72 , H01L27/11521 , H01L27/11568
摘要： Non-volatile memory devices and a method thereof are provided. A non-volatile memory device according to an example embodiment of the present invention may include a first transistor including a source, a drain, and a control gate, a first storage node coupled to the first transistor, the first storage node configured to store information in a first manner, a first diode having a first end connected to the source of the transistor, the first diode configured to rectify a flow of current from the source of the transistor and a second storage node connected to a second end of the first diode, the second storage node configured to store information in a second manner. Another non-volatile memory device according to another example embodiment of the present invention may include a semiconductor substrate having a first conductivity type including an active region defined by a device isolating layer, a source region and a drain region formed by doping an impurity having a second conductivity type in the active region, a control gate electrode insulated from the active region, the control gate electrode extending across the active region disposed between the source region and the drain region, a first storage node layer interposed between the active region and the control gate electrode configured to store information in a first manner, a second storage node layer disposed on the source region configured to store information in a second manner and a diode interposed between the source region and the second storage node layer to rectify a flow of current to the source region. The example method may be directed to obtaining a higher storage capacity per cell area in either of the above-described example non-volatile memory devices.
摘要翻译：提供了非易失性存储器件及其方法。根据本发明的示例性实施例的非易失性存储器件可以包括：第一晶体管，包括源极，漏极和控制栅极;耦合到第一晶体管的第一存储节点，第一存储节点，被配置为存储信息以第一方式，第一二极管具有连接到晶体管的源极的第一端，第一二极管被配置为对来自晶体管的源极的电流进行整流，以及连接到第一二极管的第二端的第二存储节点所述第二存储节点被配置为以第二方式存储信息。根据本发明的另一示例性实施例的另一非易失性存储器件可以包括具有第一导电类型的半导体衬底，该第一导电类型包括由器件隔离层限定的有源区，源区和漏区，有源区中的第二导电类型，与有源区绝缘的控制栅电极，跨越设置在源区和漏区之间的有源区延伸的控制栅电极，插入在有源区和控制区之间的第一存储节点层栅电极，其被配置为以第一方式存储信息;第二存储节点层，被布置在源区域上，被配置为以第二方式存储信息;以及二极管，插入在源区域和第二存储节点层之间，以将电流流向源区域。示例性方法可以针对在上述任一示例非易失性存储器件中获得每个单元区域的更高的存储容量。

60. 发明申请

US20070018237A1 Non-volatile memory device having fin-type channel region and method of fabricating the same 审中-公开
标题翻译：具有鳍型沟道区的非易失性存储器件及其制造方法
公开(公告)号：US20070018237A1
公开(公告)日：2007-01-25
申请号：US11489445
申请日：2006-07-20
申请人： Won-Joo Kim , Suk-Pil Kim , Yoon-Dong Park , Eun-Hong Lee , Jae-Woong Hyun , Sung-Jae Byun , Jung-Hoon Lee
发明人： Won-Joo Kim , Suk-Pil Kim , Yoon-Dong Park , Eun-Hong Lee , Jae-Woong Hyun , Sung-Jae Byun , Jung-Hoon Lee
IPC分类号： H01L29/792
CPC分类号： H01L29/7881 , G11C16/0483 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/40114 , H01L29/40117 , H01L29/7851 , H01L29/792
摘要： A non-volatile memory device with improved integration and/or improved performance by reducing an area per bit and controlling a body bias, and a method of fabricating the same. The non-volatile memory device may use surface portions of the outer side surfaces and/or the upper surfaces of at least one pair of fins protruding from a body and extending, spaced from each other along one direction, as at least one pair of channel regions. At least one control gate electrode may be formed across the channel regions, and at least one pair of storage nodes may be interposed in at least one portion between the control gate electrode and the channel regions.
摘要翻译：具有通过减少每位面积和控制体偏置而具有改进的集成度和/或改善性能的非易失性存储器件及其制造方法。非挥发性存储装置可以使用从主体突出的至少一对翅片的外侧表面和/或上表面的表面部分，并且沿着一个方向彼此间隔开，作为至少一对通道地区。可以在沟道区域之间形成至少一个控制栅电极，并且可以在控制栅电极和沟道区域之间的至少一个部分中插入至少一对存储节点。

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