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    • 51. 发明授权
    • Method of depositing materials on a non-planar surface
    • 在非平面表面上沉积材料的方法
    • US08318609B2
    • 2012-11-27
    • US12633589
    • 2009-12-08
    • Dan MarohlTimothy J. FranklinRatson Morad
    • Dan MarohlTimothy J. FranklinRatson Morad
    • H01L21/31
    • H01L21/67706C23C14/505H01L21/6776
    • A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
    • 公开了一种用于在非平面基板上实现半导体处理的载体。 载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底,并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。 随着非平面基板同时旋转并且向下平移处理室,旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺,从而允许根据需要均匀沉积。 或者,任何预定图案能够暴露在非平面基板的表面上。 这种载体实现非平面半导体器件的制造,包括但不限于非平面发光二极管,非平面光伏电池等。
    • 54. 发明申请
    • Elongated photovoltaic cells in casings with a filling layer
    • 具有填充层的壳体中的细长的光伏电池
    • US20110000534A1
    • 2011-01-06
    • US11821524
    • 2007-06-22
    • Benyamin BullerChris M. GronetRatson MoradMarkus E. Beck
    • Benyamin BullerChris M. GronetRatson MoradMarkus E. Beck
    • H01L31/0203H01L31/0352
    • H01L31/035281Y02E10/50Y02E10/52Y02E10/541Y02P70/521
    • A solar cell unit comprising a cylindrical shaped solar cell and a transparent tubular casing is provided. The tubular shaped solar cell comprises a back-electrode, a semiconductor junction circumferentially disposed on the back-electrode and a transparent conductive layer disposed on the semiconductor junction. The transparent tubular casing is circumferentially sealed onto the transparent conductive layer of the cylindrical shaped solar cell. A solar cell unit comprising a cylindrical shaped solar cell, a filler layer, and a transparent tubular casing is provided. The cylindrical shaped solar cell comprises a cylindrical substrate, a back-electrode circumferentially disposed on the cylindrical substrate, a semiconductor junction circumferentially disposed on the back-electrode, and a transparent conductive layer disposed on the semiconductor junction. The filler layer is circumferentially disposed on the transparent conductive layer and the transparent tubular casing is circumferentially disposed onto the filler layer.
    • 提供了一种包括圆柱形太阳能电池和透明管状外壳的太阳能电池单元。 管状太阳能电池包括背面电极,周向设置在背面电极上的半导体结和设置在半导体结上的透明导电层。 透明管状壳体周向地密封在圆柱形太阳能电池的透明导电层上。 提供了包括圆柱形太阳能电池,填充层和透明管状壳体的太阳能电池单元。 圆筒形太阳能电池包括圆柱形基板,周向设置在圆柱形基板上的背面电极,周向设置在背面电极上的半导体结,以及设置在半导体结上的透明导电层。 填充层周向地设置在透明导电层上,透明管状壳体周向地设置在填充层上。
    • 55. 发明申请
    • Carrier used for deposition of materials on a non-planar surface
    • 用于在非平面表面上沉积材料的载体
    • US20090011573A1
    • 2009-01-08
    • US11983239
    • 2007-11-07
    • Dan MarohlTimothy J. FranklinRatson Morad
    • Dan MarohlTimothy J. FranklinRatson Morad
    • B05C13/00B23H7/26H01L21/36
    • H01L21/67706C23C14/505H01L21/6776
    • A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
    • 公开了一种用于在非平面基板上实现半导体处理的载体。 载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底,并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。 随着非平面基板同时旋转并且向下平移处理室,旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺,从而允许根据需要均匀沉积。 或者,任何预定图案能够暴露在非平面基板的表面上。 这种载体实现非平面半导体器件的制造,包括但不限于非平面发光二极管,非平面光伏电池等。
    • 57. 发明申请
    • Elongated photovoltaic cells in tubular casings
    • 管状肠衣中的细长的光伏电池
    • US20070215195A1
    • 2007-09-20
    • US11378847
    • 2006-03-18
    • Benyamin BullerChris GronetRatson MoradMarkus Beck
    • Benyamin BullerChris GronetRatson MoradMarkus Beck
    • H02N6/00
    • H01L31/035281Y02E10/50Y02E10/52Y02E10/541Y02P70/521
    • A solar cell unit comprising a cylindrical shaped solar cell and a transparent tubular casing is provided. The tubular shaped solar cell comprises a back-electrode, a semiconductor junction circumferentially disposed on the back-electrode and a transparent conductive layer disposed on the semiconductor junction. The transparent tubular casing is circumferentially sealed onto the transparent conductive layer of the cylindrical shaped solar cell. A solar cell unit comprising a cylindrical shaped solar cell, a filler layer, and a transparent tubular casing is provided. The cylindrical shaped solar cell comprises a cylindrical substrate, a back-electrode circumferentially disposed on the cylindrical substrate, a semiconductor junction circumferentially disposed on the back-electrode, and a transparent conductive layer disposed on the semiconductor junction. The filler layer is circumferentially disposed on the transparent conductive layer and the transparent tubular casing is circumferentially disposed onto the filler layer.
    • 提供了一种包括圆柱形太阳能电池和透明管状外壳的太阳能电池单元。 管状太阳能电池包括背面电极,周向设置在背面电极上的半导体结和设置在半导体结上的透明导电层。 透明管状壳体周向地密封在圆柱形太阳能电池的透明导电层上。 提供了包括圆柱形太阳能电池,填充层和透明管状壳体的太阳能电池单元。 圆筒形太阳能电池包括圆柱形基板,周向设置在圆柱形基板上的背面电极,周向设置在背面电极上的半导体结,以及设置在半导体结上的透明导电层。 填充层周向地设置在透明导电层上,透明管状壳体周向地设置在填充层上。