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51. 发明申请

US20020030825A1 Optical metrology system and method employing laser-server supplying laser energy to distributed slave metrology heads 有权
标题翻译：光学计量系统和方法采用激光服务器为分布式计量头提供激光能量
公开(公告)号：US20020030825A1
公开(公告)日：2002-03-14
申请号：US09750996
申请日：2000-12-29
申请人： Rudolph Technologies, Inc.
发明人： R. Gregory Wolf
IPC分类号： G01B011/04
CPC分类号： G01B11/00
摘要： A metrology system has one or more central nullmetrology serversnull and one or more nullmetrology slavesnull The server delivers metrology nullpump/probenull signals to multiple slave systems allowing a reduction in the number of high-cost metrology components in the master system. In certain cases, multiple metrology components in the nullmasternull system may provide redundancy while still maintaining a beneficial cost benefit. Reliability can also be improved by using multiple lasers and multiple delay paths with a cross-point switch between them. If one sub-system goes down, the system may nullserializenull metrology operations and thereby maintain all systems running, although at somewhat of a reduced throughput. An important element of this invention is grouping all or most of the costly components in a centralized laser server, and issuing pump-probe pulse pairs to remote metrology heads through a light pipe or other conveyance, such as optical fiber. The remote metrology heads can thus be reduced in cost and complexity.
摘要翻译：测量系统具有一个或多个中央“计量服务器”和一个或多个“计量从站”服务器将测量“泵/探测”信号提供给多个从系统，从而可以减少主系统中高成本度量部件的数量在某些情况下，“主”系统中的多个测量组件可能提供冗余，同时仍然保持有益的成本效益。还可以通过使用多个激光器和多个延迟路径与它们之间的交叉点开关来提高可靠性。如果一个子系统出现故障，则系统可以“串行化”计量操作，从而维持所有系统的运行，尽管在某种程度上降低了吞吐量。本发明的一个重要因素是将集中式激光器中的所有或大部分昂贵的组件分组服务器，并通过诸如光纤之类的光管或其它传送装置向远程计量头发出泵浦 - 探针脉冲对，从而可以降低远程计量头的成本和复杂性。

52. 发明申请

US20200225278A1 WAFER CRACK DETECTION 审中-公开
公开(公告)号：US20200225278A1
公开(公告)日：2020-07-16
申请号：US16744621
申请日：2020-01-16
申请人： Rudolph Technologies, Inc.
发明人： Hartmut SEEGER
IPC分类号： G01R31/265 , G06T7/00
摘要： A method for identifying cracks in non-planar substrates is herein disclosed. Images of a substrate in a relaxed state are captured and assessed to identify cracks, if any. Assessment may be conducted optically using broad band illumination, laser illumination, or infrared illumination. Mechanisms for carrying out the method are also disclosed.

53. 发明授权

US10173249B2 Calibration of semiconductor metrology systems 有权
公开(公告)号：US10173249B2
公开(公告)日：2019-01-08
申请号：US14881847
申请日：2015-10-13
申请人： Rudolph Technologies, Inc.
发明人： Jian Ding , Priya Mukundhan , James Kane , Steven Peterson , Fei Shen
IPC分类号： B08B7/00 , B08B7/04 , H01L21/02 , G01D18/00 , H01L21/67
摘要： A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.

54. 发明申请

US20180173984A1 SUBSTRATE HANDLING AND IDENTIFICATION MECHANISM 审中-公开
公开(公告)号：US20180173984A1
公开(公告)日：2018-06-21
申请号：US15850869
申请日：2017-12-21
申请人： Rudolph Technologies, Inc.
发明人： Kevin Barr
IPC分类号： G06K9/18 , G03F7/20 , G03F9/00
CPC分类号： G06K9/183 , G03F7/70541 , G03F7/70775 , G03F9/7034 , G06K9/2063 , G06K2209/19 , H01L23/544 , H01L2223/54433
摘要： A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

55. 发明授权

US09952041B2 Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process 有权
公开(公告)号：US09952041B2
公开(公告)日：2018-04-24
申请号：US14762613
申请日：2014-01-23
申请人： Rudolph Technologies, Inc.
发明人： Rajiv Roy , David Grant , David S. Marx , Hanh Chu
IPC分类号： G01B11/02 , G01B11/27 , G01B9/02 , H01L21/66 , G01N21/956
CPC分类号： G01B11/272 , G01B9/02044 , G01B9/0209 , G01N21/95692 , H01L22/12 , H01L2224/16 , H01L2924/15311
摘要： A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.

56. 发明授权

US09658169B2 System and method of characterizing micro-fabrication processes 有权
公开(公告)号：US09658169B2
公开(公告)日：2017-05-23
申请号：US14213451
申请日：2014-03-14
申请人： Rudolph Technologies, Inc.
发明人： John Thornell , Steven Knauber , Jatinder Dhaliwal , Justin Miller , Michael Grant , Kenneth Durden
IPC分类号： G01N21/88
CPC分类号： G01N21/8803 , G01N21/88
摘要： A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.

57. 发明授权

US09638782B2 Probe card analysis system and method 有权
公开(公告)号：US09638782B2
公开(公告)日：2017-05-02
申请号：US13921057
申请日：2013-06-18
申请人： Rudolph Technologies, Inc.
发明人： Eric Endres , John T. Strom , Christian Kuwasaki , Christopher McLaughlin
IPC分类号： G01R31/00 , G01R35/00 , G01R31/28
CPC分类号： G01R35/00 , G01R31/2846 , G01R31/2891
摘要： A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.

58. 发明授权

US09625832B2 Planar motor system with increased efficiency 有权
公开(公告)号：US09625832B2
公开(公告)日：2017-04-18
申请号：US14432912
申请日：2013-09-27
申请人： Rudolph Technologies, Inc.
发明人： J. Casey Donaher , Craig Simpson , Peter John Gerard Dufault
IPC分类号： H02K41/02 , G03F7/20 , H02K41/03
CPC分类号： G03F7/70716 , G03F7/70758 , H02K41/02 , H02K41/031 , H02K2201/18
摘要： A planar motor system comprises a platen with a first planar motor component and a stage with a second planar motor component. The stage can move along a first cardinal axis or a second cardinal axis. The planar motor system further comprises a drive system. When the drive system is energized in a first drive configuration, it applies a first force and a second force. The first force and the second force are not parallel to any cardinal axis. A vector sum of the first force and the second force is parallel to the first cardinal axis. When the drive system is energized in a second drive configuration, it applies a third force and a fourth force. The third force and the fourth force are not parallel to any cardinal axis. A vector sum of the third force and the fourth force is parallel to the second cardinal axis.

59. 发明授权

US09587932B2 System for directly measuring the depth of a high aspect ratio etched feature on a wafer 有权
标题翻译：用于直接测量晶片上的高纵横比蚀刻特征的深度的系统
公开(公告)号：US09587932B2
公开(公告)日：2017-03-07
申请号：US15142864
申请日：2016-04-29
申请人： Rudolph Technologies, Inc.
发明人： David S. Marx , David L. Grant
IPC分类号： G01N21/55 , G01B11/22 , G01B11/06
CPC分类号： G01B11/22 , G01B11/0633 , G01B11/0675 , G01B2210/56
摘要： A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).
摘要翻译：一种用于直接测量包括蚀刻表面（82）和非蚀刻表面（84）的晶片（80）上的高纵横比蚀刻特征的深度的系统（10）。系统（10）利用红外反射计（12），在优选实施例中，扫描激光器（14），光纤循环器（16），光电检测器（22）和组合准直仪（18）和物镜（20））。从物镜（20），产生被施加到晶片（80）的未蚀刻表面（84）的聚焦入射光（23）。从晶片（80）产生的反射光（25）通过反射计（12）处理并被施加到产生相应的数字数据信号（29）的ADC（24）。数字数据信号（29）被应用于与软件（32）组合的计算机（30），其测量在显示器（34）上被观看的蚀刻特征的深度。

60. 发明授权

US09464992B2 Automated wafer defect inspection system and a process of performing such inspection 有权
标题翻译：自动晶圆缺陷检测系统及进行此类检查的过程
公开(公告)号：US09464992B2
公开(公告)日：2016-10-11
申请号：US15093130
申请日：2016-04-07
申请人： Rudolph Technologies, Inc.
发明人： Jeffrey L. O'Dell , Thomas Verburgt , Mark Harless , Cory Watkins
IPC分类号： G06K9/00 , G01N21/95 , G01N21/88 , G06T7/00 , H04N5/225
CPC分类号： G01N21/9501 , G01N21/8803 , G01N21/8806 , G01N2021/8838 , G01N2201/06113 , G01N2201/0696 , G01N2201/0697 , G01N2201/12 , G06T7/0004 , G06T2207/30148 , H01L21/67242 , H01L21/67271 , H01L21/67288 , H01L22/12 , H01L2924/0002 , H04N5/2256 , H01L2924/00
摘要： An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
摘要翻译：已经发明了一种自动化缺陷检查系统，并且用于图案化晶片，整个晶片，破碎的晶片，部分晶片，锯状晶片，例如胶片框架，JEDEC托盘，Auer船，凝胶或华夫饼包，MCM等中，并且专门用于第二光学晶片检查，例如金属化缺陷（例如划痕，空隙，腐蚀和桥接），扩散缺陷，钝化层缺陷，划线缺陷，玻璃化缺陷，切屑和锯切裂纹等缺陷凸起缺陷和焊盘区域缺陷。

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