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    • 52. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08735940B2
    • 2014-05-27
    • US12965640
    • 2010-12-10
    • Woo Chul JeonKi Yeol ParkYoung Hwan ParkJung Hee Lee
    • Woo Chul JeonKi Yeol ParkYoung Hwan ParkJung Hee Lee
    • H01L29/66
    • H01L29/7786H01L29/2003H01L29/66462
    • There are provided a semiconductor device and a method for manufacturing the same. The semiconductor device according to the present invention includes a base substrate; a semiconductor layer that includes a receiving groove and a protrusion part formed on the base substrate, a first carrier injection layer and at least two insulating layers formed to traverse the first carrier injection layer formed in the semiconductor layer, and a second carrier injection layer spaced apart from the first carrier injection layer formed on the protrusion part; a source electrode and a drain electrode that are disposed to be spaced apart from each other on the semiconductor layer; and a gate electrode that is insulated from the source electrode and the drain electrode and has a recess part recessed into the receiving groove, wherein the lowest end portion of the receiving groove contacts the uppermost layer of the first carrier injection layer and the insulating pattern disposed at the innermost side of the semiconductor layer among the insulating patterns traverses the entire layer forming the first carrier injection layer and is disposed at the outer side of both side end portions in the thickness direction of the receiving groove.
    • 提供了一种半导体器件及其制造方法。 根据本发明的半导体器件包括:基底; 半导体层,其包括形成在所述基底基板上的接收槽和突出部,第一载流子注入层和形成为穿过形成在所述半导体层中的所述第一载流子注入层的至少两个绝缘层,以及间隔开的第二载流子注入层 除了形成在突出部上的第一载流子注入层之外; 源电极和漏电极,其设置成在半导体层上彼此间隔开; 以及与源电极和漏电极绝缘并且具有凹入到接收槽中的凹部的栅电极,其中接收槽的最低端部接触第一载流子注入层的最上层,并且布置的绝缘图案 在绝缘图案中的半导体层的最内侧穿过形成第一载流子注入层的整个层,并且设置在接收槽的厚度方向上的两个侧端部的外侧。
    • 54. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08525231B2
    • 2013-09-03
    • US12965649
    • 2010-12-10
    • Ki Yeol ParkWoo Chul JeonYoung Hwan ParkJung Hee Lee
    • Ki Yeol ParkWoo Chul JeonYoung Hwan ParkJung Hee Lee
    • H01L29/66
    • H01L29/7786H01L29/0649H01L29/2003H01L29/365H01L29/4236H01L29/66462H01L29/78681
    • There is provided a semiconductor device and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer having a receiving groove, a protrusion part, a first carrier injection layer, at least two insulating patterns, and a second carrier injection layer provided on the base substrate, the insulating patterns being disposed to traverse the first carrier injection layer and the second carrier injection layer being spaced apart from the first carrier injection layer and disposed on a lower portion of the protrusion part; a source electrode and a drain electrode disposed to be spaced apart from each other on the semiconductor layer; and a gate electrode insulated from the source electrode and the drain electrode and having a recess part recessed into the receiving groove, wherein a lowest portion of the receiving groove contacts an uppermost layer of the first carrier injection layer or is disposed above the uppermost layer thereof, and an insulating pattern, disposed at an innermost portion of the semiconductor layer among the insulating patterns, traverses the first carrier injection layer and is disposed at the outside of both sides of the receiving groove in a thickness direction thereof.
    • 提供了一种半导体器件及其制造方法。 半导体器件包括:基底; 具有接收槽的半导体层,突起部分,第一载流子注入层,至少两个绝缘图案和设置在基底基板上的第二载流子注入层,绝缘图案设置成穿过第一载流子注入层和 第二载体注入层与第一载体注入层间隔开并设置在突出部分的下部; 源电极和漏电极,设置成在半导体层上彼此间隔开; 以及与源电极和漏电极绝缘的栅电极,并且具有凹入到所述接收槽中的凹部,其中所述接收槽的最下部接触所述第一载流子注入层的最上层,或者设置在所述第一载流子注入层的最上层 并且绝缘图案设置在绝缘图案中的半导体层的最内部,穿过第一载流子注入层,并且沿着其厚度方向设置在容纳槽的两侧的外侧。
    • 55. 发明授权
    • Method and apparatus for analyzing fault behavior of a software design model
    • 分析软件设计模型的故障行为的方法和装置
    • US08381145B2
    • 2013-02-19
    • US12912429
    • 2010-10-26
    • Sachoun ParkJung Hee Lee
    • Sachoun ParkJung Hee Lee
    • G06F17/50
    • G06F11/3608
    • An apparatus for analyzing a fault behavior, includes a satisfiability modulo theories (SMT) conversion block for performing SMT conversion with respect to a protocol state machine diagram and a sequence diagram of a software design model. Further, the apparatus for analyzing the fault behavior includes an SMT processing block for performing a SMT processing using respective logic formulas corresponding to the protocol state machine diagram and the sequence diagram and outputted from the SMT conversion block, and determining whether the result of the SMT processing is satisfied to output an occurrable behavior scenario when the result of the SMT processing is satisfied.
    • 用于分析故障行为的装置包括用于执行关于协议状态机图的SMT转换的可满足的模理论(SMT)转换块和软件设计模型的序列图。 此外,用于分析故障行为的装置包括:SMT处理块,用于使用与协议状态机图和序列图对应的各自的逻辑公式执行SMT处理,并从SMT转换块输出,并且确定SMT的结果 当满足SMT处理的结果时,满足输出可发生的行为场景的处理。
    • 60. 发明申请
    • METHOD AND APPARATUS FOR ANALYZING FAULT BEHAVIOR
    • 用于分析故障行为的方法和装置
    • US20110246954A1
    • 2011-10-06
    • US12912429
    • 2010-10-26
    • Sachoun PARKJung Hee LEE
    • Sachoun PARKJung Hee LEE
    • G06F17/50
    • G06F11/3608
    • An apparatus for analyzing a fault behavior, includes a satisfiability modulo theories (SMT) conversion block for performing SMT conversion with respect to a protocol state machine diagram and a sequence diagram of a software design model. Further, the apparatus for analyzing the fault behavior includes an SMT processing block for performing a SMT processing using respective logic formulas corresponding to the protocol state machine diagram and the sequence diagram and outputted from the SMT conversion block, and determining whether the result of the SMT processing is satisfied to output an occurrable behavior scenario when the result of the SMT processing is satisfied.
    • 用于分析故障行为的装置包括用于执行关于协议状态机图的SMT转换的可满足的模理论(SMT)转换块和软件设计模型的序列图。 此外,用于分析故障行为的装置包括:SMT处理块,用于使用与协议状态机图和序列图对应的各自的逻辑公式执行SMT处理,并从SMT转换块输出,并且确定SMT的结果 当满足SMT处理的结果时,满足输出可发生的行为场景的处理。