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41. 发明申请

US20170190837A1 MODIFIED POLYPHENYLENE ETHER RESIN, METHOD OF MAKING THE SAME AND RESIN COMPOSITION 审中-公开
公开(公告)号：US20170190837A1
公开(公告)日：2017-07-06
申请号：US15234478
申请日：2016-08-11
申请人： Elite Electronic Material (KunShan) Co., Ltd.
发明人： Chen Yu HSIEH , Yan ZHANG
IPC分类号： C08G65/48 , H05K1/03 , C08J5/24 , C09D171/12 , C08K5/53 , C08L71/12
CPC分类号： C08G65/485 , C08J5/10 , C08J5/24 , C08J2371/12 , C08K5/53 , C08K5/5313 , C08L71/126 , C09D171/12 , H05K1/024 , H05K1/0326 , H05K1/0353 , H05K1/0373 , H05K2201/0129 , H05K2201/068 , C08L25/10 , C08L23/16 , C08L79/085
摘要： Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties. RY-PPE-Z]c (I)

42. 发明申请

US20170174835A1 FLUORENYLIDENE-DIPHENOL-CONTAINING POLYPHENYLENE OXIDE 有权
公开(公告)号：US20170174835A1
公开(公告)日：2017-06-22
申请号：US15220934
申请日：2016-07-27
申请人： Elite Electronic Material (KunShan) Co., Ltd.
发明人： Chen Yu HSIEH , Yan ZHANG
IPC分类号： C08G65/48 , H05K1/03 , C09D171/02 , C08K5/53 , C08J5/24
CPC分类号： C08G65/485 , C08J5/24 , C08J2371/12 , C08K5/53 , C08K5/5313 , C08L71/126 , C09D171/02 , C09D171/12 , H05K1/0373
摘要： Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.

43. 发明授权

US09644069B2 Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the same 有权
公开(公告)号：US09644069B2
公开(公告)日：2017-05-09
申请号：US14792639
申请日：2015-07-07
申请人： National Sun Yat-sen University
发明人： Wen-yao Huang , Hsu-feng Lee , Benjamin Britton , Chun-che Lee , Steven Holdcroft , Jun-jie Pang , Yi-yun Hsu , Yu-chao Tseng
IPC分类号： C08G14/00 , C08G65/48 , C09D171/12 , B01J39/20
CPC分类号： H01M8/1067 , B01J39/19 , B01J39/20 , C08G65/40 , C08G65/4025 , C08G65/48 , C08G2650/02 , C08G2650/48 , C08J5/2262 , C08J2371/10 , C09D171/12 , H01M8/1025 , H01M8/1039 , H01M2008/1095
摘要： A polymer of fluorine-containing sulfonated poly(arylene ether)s and a manufacturing method thereof are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluorine-containing monomer having an electron-withdrawing group and a multi-phenyl monomer. A main structure of the polymer of fluorine-containing sulfonated poly(arylene ether)s has a first portion with fluoro or trifluoromethyl substituted phenyl groups, and a second portion with sulfonated phenyl groups.

44. 发明申请

US20170051109A1 POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME 有权
标题翻译：具有N-取代的马来酰亚胺基团的聚苯醚衍生物，和可固化树脂组合物，树脂变性，PREPREG，金属层压板和使用相同的多层印刷线路板
公开(公告)号：US20170051109A1
公开(公告)日：2017-02-23
申请号：US15301655
申请日：2015-04-06
申请人： HITACHI CHEMICAL COMPANY, LTD.
发明人： Yasuyuki MIZUNO , Tomio FUKUDA , Takao TANIGAWA , Yuki NAGAI , Hikari MURAI
IPC分类号： C08G65/48 , H05K1/03 , C09D171/12 , C08L71/12 , C08J5/24
CPC分类号： C08G65/485 , C08G65/48 , C08G73/1071 , C08J5/24 , C08J2371/12 , C08J2400/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L63/04 , C08L71/12 , C08L71/126 , C08L2201/02 , C08L2201/08 , C08L2203/20 , C09D171/12 , H05K1/0326 , H05K1/0373
摘要： A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein R1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A1 represents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.
摘要翻译：其中R1各自独立地表示氢原子，碳原子数为1〜5的脂肪族烃基或卤素原子，R2各自独立地表示氢原子，碳原子数1〜5的脂肪族烃基或卤素原子，A1 表示由特定通式表示的残基，m为结构单元数的1以上的整数，x和y各自为1〜4的整数。

45. 发明申请

US20160244610A1 RESIN COMPOSITION AND USES THEREOF IN HIGH FREQUENCY CIRCUIT BOARDS 审中-公开
标题翻译：树脂组合物及其在高频电路板中的应用
公开(公告)号：US20160244610A1
公开(公告)日：2016-08-25
申请号：US15027365
申请日：2014-08-11
申请人： Shengyi Technology Co., Ltd.
发明人： Guangbing CHEN , Xianping ZENG
IPC分类号： C08L71/12 , C09D171/12 , H05K1/03 , C08J5/24
CPC分类号： C08L71/126 , B32B15/08 , B32B27/04 , C08J5/24 , C08J2371/12 , C08J2483/04 , C08L71/12 , C09D171/12 , H05K1/03 , H05K1/038
摘要： The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.
摘要翻译：本发明公开了一种树脂组合物，其包含不饱和热固性改性聚苯醚树脂和含有不饱和双键并具有三维网状结构并由单官能硅氧烷单元（M单元）和四官能二氧化硅单元（Q单元）水解缩合的MQ有机硅树脂）。本发明还公开了由上述树脂组合物制备的高频电路基片和本领域中上述树脂组合物的用途。本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高分层粘合力，低介电常数和低介电损耗角正切，并且非常适合作为高频电路基板电子设备。

46. 发明授权

US09158215B2 Seamless intermediate transfer belt 有权
标题翻译：无缝中间转印带
公开(公告)号：US09158215B2
公开(公告)日：2015-10-13
申请号：US14176592
申请日：2014-02-10
申请人： XEROX CORPORATION
发明人： Robert C. U. Yu
IPC分类号： G03G15/16 , C08L71/12 , C09D171/12 , C08K3/04 , G03G7/00 , C09D5/24
CPC分类号： G03G7/0053 , C08K3/04 , C08L71/12 , C09D5/24 , C09D171/12 , G03G15/162 , G03G2215/0132 , C08L71/126
摘要： An image forming apparatus comprising a seamless intermediate transfer belt, and methods for making the same. The seamless intermediate transfer belt comprises a carbon black dispersion and a mechanically robust polymer material having very high molecular weight.
摘要翻译：一种包括无缝中间转印带的图像形成装置及其制造方法。无缝中间转印带包含炭黑分散体和具有非常高分子量的机械坚固的聚合物材料。

47. 发明授权

US09139750B2 Halogen-free resin composition and method for preparation of copper clad laminate with same 有权
标题翻译：无卤素树脂组合物及其制备方法
公开(公告)号：US09139750B2
公开(公告)日：2015-09-22
申请号：US14239045
申请日：2011-09-02
申请人： Yueshan He
发明人： Yueshan He
IPC分类号： C09D163/10 , B32B15/08 , C08K5/5399 , C08K5/00 , H05K1/03 , B32B37/10 , B32B38/08 , C09D143/02 , C09D145/00 , C09D171/12 , B32B15/14 , B32B15/20 , C08K3/00 , H05K3/02
CPC分类号： C09D163/10 , B32B15/08 , B32B15/14 , B32B15/20 , B32B37/10 , B32B38/08 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/076 , C08K3/013 , C08K5/0025 , C08K5/5399 , C09D143/02 , C09D145/00 , C09D171/12 , H05K1/0346 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , Y10T156/1075 , C08L63/00
摘要： A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
摘要翻译：无卤素树脂组合物及其制备方法，其中基于总重量份的固体组分，无卤树脂组合物包含5-50的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈部件，15-85份的热固性树脂，1-35份交联固化剂，0-5份交联固化促进剂和0-100份填料。在本发明中，具有非常低吸水性的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈引入到热固性树脂中，满足无卤素和抗泡沫性要求，并且改善了体系的电性能，并且使得可以制备无卤素高频高速基板材料。所得到的覆铜层压板满足无卤素要求，具有优异的耐热湿性和低介电损耗。

48. 发明授权

US08124694B2 Mold releasing film for printed circuit board production 有权
标题翻译：用于印刷电路板生产的脱模膜
公开(公告)号：US08124694B2
公开(公告)日：2012-02-28
申请号：US12458837
申请日：2009-07-23
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： C08L71/12
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

49. 发明申请

US20090292082A1 Mold releasing film for printed circuit board production 有权
标题翻译：用于印刷电路板生产的脱模膜
公开(公告)号：US20090292082A1
公开(公告)日：2009-11-26
申请号：US12458837
申请日：2009-07-23
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： C08G65/38 , C08L71/10
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

50. 发明授权

US06989420B2 Coating liquid for producing insulating film having low dielectric constant 失效
公开(公告)号：US06989420B2
公开(公告)日：2006-01-24
申请号：US10302946
申请日：2002-11-25
申请人： Yuji Yoshida , Naoya Satoh
发明人： Yuji Yoshida , Naoya Satoh
IPC分类号： C08L71/12
CPC分类号： C09D171/12 , C08G65/40 , C08G65/4012 , C08G2650/20 , C08G2650/40 , C08G2650/60 , C08L2312/00 , C09D171/00 , H01B3/427 , Y10T428/31663
摘要： Coating liquid for producing insulating film having low dielectric constant is provided. It was achieved by coating liquid for producing insulating film having low dielectric constant comprising a thermosetting resin having carbon-carbon unsaturated bond, an organic solvent, and less than two molecular equivalents of water to the carbon-carbon unsaturated bond.

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