专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070003763A1 Release film for printed wiring board production 有权
标题翻译：印刷线路板生产用剥离膜
公开(公告)号：US20070003763A1
公开(公告)日：2007-01-04
申请号：US10550063
申请日：2004-04-15
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： B32B27/32 , B32B27/30
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

2. 发明授权

US07851271B2 Release film for printed wiring board production 有权
标题翻译：印刷线路板生产用剥离膜
公开(公告)号：US07851271B2
公开(公告)日：2010-12-14
申请号：US10550063
申请日：2004-04-15
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： H01L21/00
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

3. 发明授权

US08124694B2 Mold releasing film for printed circuit board production 有权
标题翻译：用于印刷电路板生产的脱模膜
公开(公告)号：US08124694B2
公开(公告)日：2012-02-28
申请号：US12458837
申请日：2009-07-23
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： C08L71/12
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

4. 发明申请

US20090292082A1 Mold releasing film for printed circuit board production 有权
标题翻译：用于印刷电路板生产的脱模膜
公开(公告)号：US20090292082A1
公开(公告)日：2009-11-26
申请号：US12458837
申请日：2009-07-23
申请人： Hiroshi Kamo , Yuuji Kusumi
发明人： Hiroshi Kamo , Yuuji Kusumi
IPC分类号： C08G65/38 , C08L71/10
CPC分类号： C08J5/18 , C08J2371/12 , C08L71/123 , C09D171/12 , Y10T428/31504 , Y10T428/31931 , Y10T428/31935
摘要： The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
摘要翻译：本发明涉及一种用于印刷电路板制造的脱模膜，其包括含有（A）50重量％以上的聚苯醚系树脂的树脂层（P）。根据本发明，可以提供一种适用于生产印刷电路板，特别是柔性印刷电路板的脱模膜，其脱模性优异，几乎没有热收缩，几乎不会对印刷电路板产生皱纹产品本身几乎不起皱，耐污染性优异，因为没有观察到渗出，并且还具有优异的抗吸湿性，形状跟随性，较少的粘合剂溢出，多层膜之间的粘附和滑动电影之间的财产。

5. 发明授权

US08916633B2 TAB leader tape made of polyphenylene ether-based resin 有权
标题翻译： TAB导电胶带，由聚苯醚系树脂制成
公开(公告)号：US08916633B2
公开(公告)日：2014-12-23
申请号：US12656609
申请日：2010-02-04
申请人： Hiroshi Kamo
发明人： Hiroshi Kamo
IPC分类号： H01L21/60 , C08K5/544 , C08K3/10 , C08L71/12 , C08G65/48 , C08L67/00 , H01L23/14 , H01L23/498 , H01L23/538
CPC分类号： H01L23/145 , C08G65/485 , C08L67/00 , C08L71/12 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , Y10T428/24405 , C08L2666/18 , H01L2924/00
摘要： A film is used as a TAB leader tape. The film comprises 45 parts by mass or more of a polyphenylene ether-based resin and 55 parts by mass or less of at least one component selected from a thermoplastic resin and a plasticizer based on 100 parts by mass of the film. The film optionally includes inorganic filler and other additional components.
摘要翻译：一部电影用作TAB领带。基于100质量份的膜，该膜包含45质量份以上的聚苯醚类树脂和55质量份以下的选自热塑性树脂和增塑剂中的至少一种成分。该膜任选地包括无机填料和其它附加组分。

6. 发明授权

US08691898B2 Resin composition 有权
标题翻译：树脂组成
公开(公告)号：US08691898B2
公开(公告)日：2014-04-08
申请号：US11665369
申请日：2005-10-07
申请人： Hiroshi Kamo , Tetsuo Kurihara
发明人： Hiroshi Kamo , Tetsuo Kurihara
IPC分类号： C07F7/18 , C08K5/13 , C08L71/12
CPC分类号： C08K5/13 , C08K3/22 , C08K5/01 , C08L101/00 , C08L2666/14
摘要： It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200° C., the organic compound being from 0.1 to 40 parts by weight based on 100 parts by weight of the resin component (A).
摘要翻译：本发明的目的是提供一种树脂组合物，其中保持高耐热性非结晶性树脂的高耐热性而赋予流动性，异物量大大降低，没有模具沉积，计量稳定性为优异，透明性也良好，并且既能获得良好的耐热性和流动性的树脂组合物，也减少异物的量，减少细粉的产生，并且不会渗出。根据本发明，提供一种树脂组合物，其包含：（A）树脂组分，其包含70至100重量％的至少一种选自聚苯醚树脂，聚碳酸酯树脂，聚砜树脂，聚醚砜树脂，聚芳酯树脂，聚酰胺 - 酰亚胺树脂聚醚酰亚胺树脂和热塑性聚酰亚胺树脂; 和（B）熔点不低于200℃的有机化合物，相对于树脂成分（A）100重量份，有机化合物为0.1〜40重量份。

7. 发明申请

US20120071599A1 AUTOMOTIVE LAMP PERIPHERAL PARTS 有权
标题翻译：汽车灯外围部件
公开(公告)号：US20120071599A1
公开(公告)日：2012-03-22
申请号：US13320812
申请日：2010-05-21
申请人： Toru Yamaguchi , Hiroshi Kamo , Hiroshi Nishino , Hiroyuki Shinryu
发明人： Toru Yamaguchi , Hiroshi Kamo , Hiroshi Nishino , Hiroyuki Shinryu
IPC分类号： C08L71/12 , C08L25/12 , C08K3/34 , C08G65/38 , C08K5/42
CPC分类号： C08L71/08 , C08L25/04 , C08L53/025 , C08L71/02 , C08L71/12 , C08L2666/04 , C08L53/02
摘要： [Problem to be Solved]There is provided automotive lamp peripheral parts excellent in the heat resistance, rigidity and fogging property.[Solution]The automotive lamp peripheral part according to the present invention is obtained from a resin composition containing 70% by mass or more of a polyphenylene ether (A), and has a haze value of a glass plate of 1.0% or less after the glass plate is subjected to a following fogging test using an apparatus according to ISO 6452: 60 g of a pellet or a molded article obtained from the resin composition is put in a glass-made sample bottle; the sample bottle is covered with a glass plate as a lid, and heated at 170° C. for 24 hours to thereby generate fogging on the glass plate.
摘要翻译： [待解决的问题]提供了耐热性，刚性和起雾性优异的汽车灯周边部件。 [方案]根据本发明的汽车用灯具周边部件由含有70质量％以上的聚苯醚（A）的树脂组合物得到，玻璃板的雾度值为1.0％以下使用根据ISO 6452的装置对玻璃板进行以下的起雾试验：<雾化试验>将60g由树脂组合物得到的颗粒或成型制品放入玻璃制的样品瓶中; 将样品瓶用玻璃板作为盖子覆盖，并在170℃下加热24小时，从而在玻璃板上产生起雾。

8. 发明申请

US20100168303A1 TAB leader tape made of polyphenylene ether-based resin 有权
标题翻译： TAB导电胶带，由聚苯醚系树脂制成
公开(公告)号：US20100168303A1
公开(公告)日：2010-07-01
申请号：US12656609
申请日：2010-02-04
申请人： Hiroshi Kamo
发明人： Hiroshi Kamo
IPC分类号： C08K5/544 , C08L71/12 , C08K3/10
CPC分类号： H01L23/145 , C08G65/485 , C08L67/00 , C08L71/12 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , Y10T428/24405 , C08L2666/18 , H01L2924/00
摘要： The TAB leader tape of the present invention comprises 45 parts by mass or more of a polyphenylene ether-based resin based on 100 parts by mass of the resin component thereof.
摘要翻译：本发明的TAB前导带基于100质量份的树脂成分，含有45质量份以上的聚苯醚系树脂。

9. 发明申请

US20070290391A1 Inner Part Of Hard Disk Drive 有权
标题翻译：内部硬盘驱动器
公开(公告)号：US20070290391A1
公开(公告)日：2007-12-20
申请号：US11792492
申请日：2006-01-06
申请人： Hiroshi Kamo , Yukihiro Ban
发明人： Hiroshi Kamo , Yukihiro Ban
IPC分类号： G11B33/12 , C08K5/03 , C08L71/12
CPC分类号： G11B33/121 , C08K3/22 , C08L71/12 , G11B33/1446
摘要： A hard disk drive inner part formed of a resin which exhibits well-balanced low outgassing properties, ultrasonic cleaning resistance, low ionic contamination properties, low particulate contamination properties, repeated removability, heat resistance, specific gravity, and water-absorbing properties. The hard disk drive inner part includes a resin composition which includes a polyphenylene ether resin (A).
摘要翻译：由树脂形成的硬盘驱动器内部部件，其表现出良好平衡的低除气性能，超声波清洗能力，低离子污染特性，低颗粒污染性能，重复的可除去性，耐热性，比重和吸水性能。硬盘驱动器内部包括包含聚苯醚树脂（A）的树脂组合物。

10. 发明申请

US20080166523A1 Tab leader tape made of polyphenylene ether-based resin 审中-公开
标题翻译：由聚苯醚类树脂制成的标签带
公开(公告)号：US20080166523A1
公开(公告)日：2008-07-10
申请号：US11649162
申请日：2007-01-04
申请人： Hiroshi Kamo
发明人： Hiroshi Kamo
IPC分类号： D06N7/00
CPC分类号： H01L23/145 , C08G65/485 , C08L67/00 , C08L71/12 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , Y10T428/24405 , C08L2666/18 , H01L2924/00
摘要： The TAB leader tape of the present invention comprises 45 parts by mass or more of a polyphenylene ether-based resin based on 100 parts by mass of the resin component thereof.
摘要翻译：本发明的TAB前导带基于100质量份的树脂成分，含有45质量份以上的聚苯醚系树脂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式