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41. 发明申请

US20130131269A1 HIGH-VISCOSITY POLYAMIDE COMPOSITION 有权
标题翻译：高粘度聚酰胺组合物
公开(公告)号：US20130131269A1
公开(公告)日：2013-05-23
申请号：US13639073
申请日：2011-04-04
申请人： Magali Davezac , Wojciech Bzducha
发明人： Magali Davezac , Wojciech Bzducha
IPC分类号： C08L77/00
CPC分类号： C08L77/00 , C08L35/06 , C08L51/06 , C08L63/00 , C08L77/02 , C08L77/06 , C08L2666/02 , C08L2666/04 , C08L2666/22 , C08L2666/24
摘要： A high-viscosity polyamide composition including a branched polyamide is described. Also described, is a relationship between a high-viscosity polyamide composition and a composition including a copolyamide of a statistical tree type resulting from a reaction between a multifunctional monomer including at least three reactive functions in order to form an amide function. Further described, are three reactive functions of two different types and bifunctional monomers used in the manufacture of linear polyamides. A resulting copolyamide can have a very low melt flow index relative to the linear polyamide and improved impact resistance properties. Lastly, use of such a composition for extrusion blow-molding articles is described.
摘要翻译：描述了包含支链聚酰胺的高粘度聚酰胺组合物。还描述了高粘度聚酰胺组合物和包含由包含至少三个反应性官能团的多官能单体反应形成酰胺官能团而产生的统计树型共聚酰胺的组合物之间的关系。进一步描述的是两种不同类型的三种反应性官能团和用于制备线性聚酰胺的双功能单体。所得到的共聚酰胺可以具有相对于线性聚酰胺非常低的熔体流动指数和改善的抗冲击性能。最后，描述了使用这种组合物用于挤出吹塑制品。

42. 发明申请

US20130115472A1 HALOGEN-FREE RESIN COMPOSITION, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME 有权
标题翻译：无卤素树脂组合物和铜层压板和印刷电路板使用相同
公开(公告)号：US20130115472A1
公开(公告)日：2013-05-09
申请号：US13680568
申请日：2012-11-19
申请人： Elite Material Co., Ltd.
发明人： Li-Chih YU , Tse-An LEE
IPC分类号： C08L65/00 , B32B15/08
CPC分类号： C08L65/00 , B32B15/08 , C08G73/0655 , C08K3/013 , C08K3/26 , C08K3/36 , C08K5/09 , C08K5/5399 , C08L35/06 , C08L71/12 , C08L79/04 , H05K1/0353 , H05K3/022 , H05K2201/012 , Y10T428/31699 , C08K3/0033
摘要： The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.
摘要翻译：无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆层压板或印刷电路板。

43. 发明申请

US20120208913A1 Use of Polar Additives for Enhancing Blowing Agent Solubility in Polystyrene 有权
标题翻译：使用极性添加剂提高聚苯乙烯中的发泡剂溶解度
公开(公告)号：US20120208913A1
公开(公告)日：2012-08-16
申请号：US13347704
申请日：2012-01-11
申请人： Wei Wang , Jose M. Sosa , David W. Knoeppel
发明人： Wei Wang , Jose M. Sosa , David W. Knoeppel
IPC分类号： C08J9/00 , C08L25/18
CPC分类号： C08J9/0014 , C08J9/12 , C08J9/142 , C08J2203/06 , C08J2203/12 , C08J2325/04 , C08J2325/08 , C08L25/06 , C08L35/06
摘要： Foamable polystyrene compositions with enhanced blowing agent solubility and methods of making such polystyrene compositions by incorporating a polar additive in styrenic polymer or copolymers.
摘要翻译：具有增强的发泡剂溶解度的可发泡聚苯乙烯组合物和通过将极性添加剂掺入苯乙烯聚合物或共聚物中制备这种聚苯乙烯组合物的方法。

44. 发明申请

US20120156490A1 SYSTEMS AND METHODS FOR MANUFACTURING QUANTUM DOT-DOPED POLYMER MICROBEADS 有权
标题翻译：制造量子聚合物微粒的系统和方法
公开(公告)号：US20120156490A1
公开(公告)日：2012-06-21
申请号：US12666112
申请日：2008-06-23
申请人： Sebastien Fournier-Bidoz , Warren Che Wor Chan
发明人： Sebastien Fournier-Bidoz , Warren Che Wor Chan
IPC分类号： B32B5/16 , B29B9/00
CPC分类号： C40B20/04 , B01J2219/005 , B01J2219/00551 , B01J2219/00576 , C08L25/14 , C08L35/06
摘要： In a method and system for forming microbeads, a polymer solution includes particles and a polymer dissolved in a solvent. A stream of the polymer solution flows into a chamber. A focusing fluid contacts and focuses the polymer stream in the chamber. The focusing fluid and the focused polymer stream flow, as a single flow stream, out from the chamber. Pendant droplets detach from a leading end of the single flow stream to form the microbeads. The focusing fluid reacts with the polymer solution to form functional groups at a surface of the microbeads for binding with biorecognition molecules. In the system, a flow focusing apparatus includes a flow focusing body shaped to define the chamber. Microbeads formed according to the methods and systems are also disclosed.
摘要翻译：在用于形成微珠的方法和系统中，聚合物溶液包括溶解在溶剂中的颗粒和聚合物。聚合物溶液流流入室中。聚焦流体将聚合物流接触并聚焦在室中。聚焦流体和聚焦聚合物流作为单一流动流从腔室流出。悬滴从单流流的前端分离形成微珠。聚焦流体与聚合物溶液反应以在微珠的表面形成官能团，用于与生物识别分子结合。在该系统中，流动聚焦装置包括成形为限定腔室的流动聚焦体。还公开了根据方法和系统形成的微珠。

45. 发明授权

US08129455B2 Flame retardant thermoplastic molding compositions 失效
标题翻译：阻燃热塑性成型组合物
公开(公告)号：US08129455B2
公开(公告)日：2012-03-06
申请号：US12668304
申请日：2008-07-08
申请人： Piyada Charoensirisomboon , Maarten Staal , Michel Pepers , Christoph Link
发明人： Piyada Charoensirisomboon , Maarten Staal , Michel Pepers , Christoph Link
IPC分类号： C08K5/00 , C08K5/52
CPC分类号： C08L51/04 , C08F257/02 , C08F279/02 , C08F279/04 , C08K3/04 , C08K5/523 , C08L25/12 , C08L27/18 , C08L33/20 , C08L35/06 , C08L53/02 , C08L55/02 , C08L2201/02 , C08L2666/24 , C08L2666/02 , C08L2666/04
摘要： A flame retardant thermoplastic molding composition containing a thermoplastic copolymer A, a graft copolymer B, and a flame retardant component C, wherein the molding composition contains: A: from 40 to 80% by weight of a thermoplastic copolymer A, obtainable e.g. from acrylonitrile and styrene; B: from 15 to 50% by weight of a graft ABS copolymer B, and C: from 15 to 30% by weight of the flame retardant component C, comprising at least an expandable graphite component (C1) and a phosphorous flame retardant component (C2) and a perfluorinated polymer (C3); has a high fire protection and improved mechanical properties.
摘要翻译：含有热塑性共聚物A，接枝共聚物B和阻燃剂组分C的阻燃热塑性模塑组合物，其中模塑组合物含有：A：40-80％重量的热塑性共聚物A，来自丙烯腈和苯乙烯; B：15〜50重量％的接枝ABS共聚物B，C：15〜30重量％的阻燃组分C，至少包含可膨胀石墨组分（C1）和磷阻燃组分（ C2）和全氟化聚合物（C3）; 具有较高的防火性能和改善的机械性能。

46. 发明授权

US08114508B2 Composition of modified maleic anhydride and epdxy resin 有权
标题翻译：改性马来酸酐和环氧树脂的组成
公开(公告)号：US08114508B2
公开(公告)日：2012-02-14
申请号：US12582012
申请日：2009-10-20
申请人： Ming Jen Tzou
发明人： Ming Jen Tzou
IPC分类号： B32B27/04 , B32B27/28 , B32B27/38 , C08L25/04 , C08L63/00 , C08G59/40
CPC分类号： C08J5/24 , C08G59/4261 , C08J2325/18 , C08J2335/00 , C08J2363/00 , C08L35/06 , C08L63/00 , Y10T428/24994 , Y10T428/31511
摘要： The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C). According to the present invention, the modified maleic anhydride copolymer curing agent is prepared by reacting styrene/maleic anhydride copolymer with a modifier having hydroxy groups (OH), wherein the modifier having hydroxy groups (OH) can be a brominated, phosphorus-based or halogen-free material; the epoxy resin composition of the present invention shows good heat resistance and outstanding electrical properties, is suitable for the production of prepreg material, bonding films and copper clad laminates, thus can be used in the field of the general or high-frequency printed circuit boards.
摘要翻译：本发明提供改性马来酸酐和环氧树脂的组合物，包括（A）一种或多种环氧树脂混合物，（B）改性马来酸酐共聚物，（C）添加剂和（D）无机填料材料，其中组分（A）环氧树脂混合物占组合物固体重量的35％〜56％，组分（B）改性马来酸酐共聚物占组合物固体重量的44％〜65％，基于100％的总成分（A），（B）和（C）。根据本发明，改性马来酸酐共聚物固化剂通过使苯乙烯/马来酸酐共聚物与具有羟基（OH）的改性剂反应制备，其中具有羟基（OH）的改性剂可以是溴化的，磷的或基于无卤材料; 本发明的环氧树脂组合物显示出良好的耐热性和优异的电性能，适用于生产预浸材料，接合膜和铜包层压板，因此可用于一般或高频印刷电路板领域。

47. 发明授权

US08080618B2 Thermoplastic resin composition with good heat stability, light stability, and impact strength 有权
标题翻译：热塑性树脂组合物具有良好的热稳定性，光稳定性和冲击强度
公开(公告)号：US08080618B2
公开(公告)日：2011-12-20
申请号：US12477530
申请日：2009-06-03
申请人： Jun Myung Kim , Jin Hwan Choi , Jee Kwon Park , Jae Won Lee
发明人： Jun Myung Kim , Jin Hwan Choi , Jee Kwon Park , Jae Won Lee
IPC分类号： C08L67/02 , C08L63/00 , C08L63/10 , C08L25/08
CPC分类号： C08L25/14 , C08K5/1345 , C08K5/3462 , C08K5/3475 , C08K5/524 , C08L25/08 , C08L25/12 , C08L35/06 , C08L55/02 , C08L67/02 , C08L2666/02 , C08L2666/18
摘要： Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of a base resin comprising (A)+(B).
摘要翻译：本文公开了具有良好的热稳定性，光稳定性和冲击强度的热塑性树脂组合物。在一个示例性实施方案中，热塑性树脂组合物包含（A）约10至约99重量份的含环氧基的苯乙烯树脂; （B）约1至约90重量份的聚酯树脂; （C）约0.1至约10重量份的包含脂环族二醇如环己烷二甲醇的热塑性聚酯树脂，每100重量份包含（A）+（B）的基础树脂; （D）每100重量份包含（A）+（B）的基础树脂，约0.05至约2重量份的受阻酚化合物; （E）约0.05至约4重量份的亚磷酸酯化合物，每100重量份包含（A）+（B）的基础树脂; 和（F）约100至约6重量份的包含HALS化合物，苯并三唑基化合物或其组合的化合物，每100重量份包含（A）+（B）的基础树脂。

48. 发明授权

US08022146B2 Copolymers of para-alpha dimethylstyrene and thermoplastic compositions 有权
标题翻译：对 - α二甲基苯乙烯和热塑性组合物的共聚物
公开(公告)号：US08022146B2
公开(公告)日：2011-09-20
申请号：US12742843
申请日：2008-11-11
申请人： Gerrit Luinstra , Florian Becker , Matthias Müller , Dirk Meckelnburg , Jens Assmann
发明人： Gerrit Luinstra , Florian Becker , Matthias Müller , Dirk Meckelnburg , Jens Assmann
IPC分类号： C08F20/42 , C08L51/00
CPC分类号： C08F222/00 , C08F212/12 , C08F220/02 , C08F220/44 , C08L25/12 , C08L25/16 , C08L33/00 , C08L35/06 , C08L55/02 , C08L67/00 , C08L69/00 , C08L69/005 , C08L77/00 , C08L2205/02 , C08L2205/03 , C08L2666/02 , C08L2666/24 , C08L2666/04
摘要： A thermoplastic copolymer prepared from acrylonitrile and para-alpha-dimethylstyrene via bulk or solution polymerization has an improved heat distortion temperature and can be used together with graft copolymers and further components for the preparation of thermoplastic moldings.
摘要翻译：由丙烯腈和对 - α-二甲基苯乙烯通过本体或溶液聚合制备的热塑性共聚物具有改进的热变形温度，并且可与接枝共聚物和用于制备热塑性模制品的其它组分一起使用。

49. 发明授权

US08021826B2 Copolymer and composition for organic and antireflective layer 有权
标题翻译：用于有机和抗反射层的共聚物和组合物
公开(公告)号：US08021826B2
公开(公告)日：2011-09-20
申请号：US12214430
申请日：2008-06-19
申请人： Myung-Woong Kim , Joo-Hyeon Park , Young-Taek Lim , Hyung-Gi Kim , Jun-Ho Lee , Jong-Don Lee , Seung-Duk Cho
发明人： Myung-Woong Kim , Joo-Hyeon Park , Young-Taek Lim , Hyung-Gi Kim , Jun-Ho Lee , Jong-Don Lee , Seung-Duk Cho
IPC分类号： G03F7/11 , C08F222/06 , C08L37/00
CPC分类号： C09D133/10 , C08F220/14 , C08F220/18 , C08F222/06 , C08K5/10 , C08K5/34924 , C08K5/42 , C08L31/02 , C08L33/10 , C08L35/06 , C09D131/02 , C09D135/06 , G03F7/091 , Y10S438/952 , C08L2666/04
摘要： The present invention provides an organic anti-reflection coating composition comprising a copolymer represented by the following Formula 1, a light absorbent, a thermal acid generating agent, and a curing agent: wherein R1, R2 and R3 are each independent to each; R1 represents hydrogen or an alkyl group having 1 to 10 carbon atoms; R2 represents hydrogen, an alkyl group having 1 to 10 carbon atoms or an arylalkyl group having 1 to 20 carbon atoms; R3 is hydrogen or a methyl group; m and n are repeating units in the main chain, while m+n=1, and they have values of 0.05
摘要翻译：本发明提供一种有机防反射涂料组合物，其包含由下式1表示的共聚物，光吸收剂，热酸产生剂和固化剂：其中R1，R2和R3各自独立; R1表示氢或碳原子数1〜10的烷基。 R 2表示氢，碳原子数1〜10的烷基或碳原子数1〜20的芳烷基。 R3是氢或甲基; m和n是主链中的重复单元，而m + n = 1，并且它们具有0.05

50. 发明授权

US07999021B2 Resin composition and molded article made thereof 有权
标题翻译：树脂组合物和由其制成的模塑制品
公开(公告)号：US07999021B2
公开(公告)日：2011-08-16
申请号：US11989836
申请日：2006-07-31
申请人： Sadanori Kumazawa , Akiyoshi Tamai , Hiroyuki Ohme , Sadayuki Kobayashi , Akinori Kanomata , Koji Yamauchi
发明人： Sadanori Kumazawa , Akiyoshi Tamai , Hiroyuki Ohme , Sadayuki Kobayashi , Akinori Kanomata , Koji Yamauchi
IPC分类号： C08K5/00 , C08L51/00
CPC分类号： C08L51/006 , C08K5/092 , C08L23/0853 , C08L25/12 , C08L33/06 , C08L33/12 , C08L35/06 , C08L51/04 , C08L53/00 , C08L55/02 , C08L67/04 , C08L2666/02 , C08L2666/04 , C08L2666/24 , C08L2666/14
摘要： A resin composition is described that is excellent in strength, impact resistance, heat resistance and moldability, while further allowing for a reduction in the amount of CO2 needed for its production. The resin composition includes a styrene-based resin (A), an aliphatic polyester (B) and at least one species selected from a compatibilizer (C) and a dicarboxylic anhydride (D), wherein the compatibilizer is preferably at least one species selected from: (C-1) a methyl methacrylate polymer; (C-2) a vinyl-based polymer which an epoxy unit or acid anhydride unit is copolymerized; (C-3) a graft polymer in which a methyl methacrylate unit is grafted to a rubbery polymer; and (C-4) a block copolymer having a polylactide segment and a vinyl-based polymer segment.
摘要翻译：描述了强度，耐冲击性，耐热性和成型性优异的树脂组合物，同时进一步允许其生产所需的二氧化碳的量的减少。树脂组合物包括苯乙烯类树脂（A），脂肪族聚酯（B）和选自增容剂（C）和二羧酸酐（D）中的至少一种，其中相容剂优选为选自以下的至少一种：：（C-1）甲基丙烯酸甲酯聚合物; （C-2）环氧单元或酸酐单元共聚的乙烯基类聚合物; （C-3）接枝聚合物，其中甲基丙烯酸甲酯单元接枝到橡胶状聚合物上; 和（C-4）具有聚丙交酯链段和乙烯基类聚合物链段的嵌段共聚物。

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