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    • 43. 发明申请
    • MOLD AND SUBSTRATE FOR USE WITH MOLD
    • 模具和基材用于模具
    • US20110244637A1
    • 2011-10-06
    • US13097066
    • 2011-04-29
    • Poh Leng EUBoon Yew LowWai Keong Wong
    • Poh Leng EUBoon Yew LowWai Keong Wong
    • H01L21/56B29C33/10
    • B29C45/14655B29C45/14836B29C45/34H01L2924/14H01L2924/1433
    • A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).
    • 包括第一模具部件(12)和第二模具部件(14)的模具(10)在它们之间限定模具腔(16)。 在第一和第二模具部件(12)和(14)中的至少一个模具部件(14)中形成有浇口(18),使得浇口(18)与模腔(16)连通。 具有收缩部分(22)的排气口(20)被布置成与模腔(16)连通。 可以在模具(10)中容纳包括基底(30)和形成在基底(30)上的导电图案(32)和(34)的基底(28)。 在基底基板(30)和导电图案(32)的一部分上形成阻焊层(36)。 多个凹槽(38)和(40)以围绕衬底(28)上的模制区域(42)的周边的交错布置形成。