会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 42. 发明授权
    • Waveguide group branching filter
    • 波导组分支滤波器
    • US06847270B2
    • 2005-01-25
    • US10018573
    • 2001-03-15
    • Naofumi YonedaMoriyasu MiyazakiKousaku Yamagata
    • Naofumi YonedaMoriyasu MiyazakiKousaku Yamagata
    • H01P1/161H01P1/17H01P1/207H01P1/208H01P1/211H01P1/213H01P5/12
    • H01P1/2138
    • The waveguide group branching filter according to the present invention is formed by boring out of two metal blocks constituent circuits including a circular-to-square waveguide multistage transformer 1, the branch waveguide polarizer/branching filter 4, a rectangular waveguide multistage transform 9, the rectangular waveguide H-plane T-branch circuit 10, and waveguide band-pass filters 8, 14 and 18; radio waves V1 and H1, which have their polarization planes vertical and horizontal, respectively, to the branching plane of the branch waveguide polarizer/branching filter 4 in a certain frequency band f1, and a radio wave V2 of the same polarization plane as that of the radio wave V1 in a frequency band f2 higher than the frequency band f1 are incident to an input port P1, and the radio wave V1 is emitted from an output port P2, the radio wave H1 from an output port P3 and the radio wave V2 from an output port P4.
    • 根据本发明的波导组分支滤波器通过从包括圆形到正方形波导多级变压器1,分支波导偏振器/分支滤波器4,矩形波导多级变换9的两个金属块构成电路中, 矩形波导H平面T分支电路10和波导带通滤波器8,14和18; 分别将偏振面垂直和水平的无线电波V1和H1分别连接到一定频带f1中的分支波导偏振器/分波器4的分支平面,以及与 高于频带f1的频带f2中的无线电波V1入射到输入端口P1,并且从输出端口P2发出无线电波V1,从输出端口P3发射无线电波H1和无线电波V2 从输出端口P4。
    • 44. 发明授权
    • RF circuit module
    • RF电路模块
    • US06335669B1
    • 2002-01-01
    • US09361213
    • 1999-07-27
    • Moriyasu MiyazakiHidenori YukawaHideyuki Oh-HashiMasatoshi Nii
    • Moriyasu MiyazakiHidenori YukawaHideyuki Oh-HashiMasatoshi Nii
    • H03H1100
    • H01L25/0657H01L23/66H01L24/48H01L24/73H01L25/162H01L2224/05599H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/48235H01L2224/73265H01L2224/85399H01L2225/0651H01L2225/0652H01L2225/06572H01L2225/06582H01L2924/00014H01L2924/01079H01L2924/15153H01L2924/1517H01L2924/15192H01L2924/16152H01L2924/16195H01L2924/1627H01L2924/19041H01L2924/3025H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099
    • An RF circuit module comprising a first RF semiconductor device 19 mounted within a cavity 4 surrounded by a wall 3 of a first dielectric circuit board 1, and a second RF semiconductor device 29 mounted to a second dielectric circuit board 2 placed on the wall 3. A metal base 11 is disposed on the first circuit board 1 and a number of embedded conductors 13 such as via holes are embedded within the wall 3 and arranged to surround the cavity 4 so that each having one end electrically connected to the metal base 11 and the other end exposed and arranged to surround the cavity 4. A metal cover 12 is sealingly attached to the first circuit board 1 to cover the second circuit board 2 and the second RF semiconductor device 29 and electrically connected at the upper surface of the wall 3. Therefore, the first and second RF semiconductor devices are electrically shielded and hermetically sealed, providing an RF circuit module of small-sized and high-performance. The metal cover may have a plate-like shape, the first circuit board may be a high-temperature burned circuit board and the second circuit board may be a low-temperature burned circuit board, the electrical connection between the first circuit board and the second circuit board may be made through a solder bump or an anisotropic conductive sheet. The metal base 11 may be exposed to the cavity, the first circuit board may have mounted thereon a transmission circuit and the second circuit board may have mounted thereon a reception circuit, and a high-frequency circuit device, which is not necessary to be hermetically sealed, may be mounted on the first circuit board outside of the metal cover.
    • 一种RF电路模块,包括安装在由第一介电电路板1的壁3围绕的空腔4内的第一RF半导体器件19和安装到放置在壁3上的第二介质电路板2的第二RF半导体器件29。 金属基体11设置在第一电路板1上,并且诸如通孔的多个嵌入式导体13嵌入在壁3内并且被布置成围绕空腔4,使得每个具有一端电连接到金属基座11和 另一端露出并布置成围绕空腔4.金属盖12密封地附接到第一电路板1以覆盖第二电路板2和第二RF半导体器件29并且电连接在壁3的上表面 因此,第一和第二RF半导体器件被电屏蔽和气密密封,提供小尺寸和高性能的RF电路模块。 金属盖可以具有板状形状,第一电路板可以是高温烧伤电路板,第二电路板可以是低温烧毁电路板,第一电路板和第二电路板之间的电连接 电路板可以通过焊料凸块或各向异性导电片制成。 金属基座11可以暴露于空腔中,第一电路板可以安装有传输电路,并且第二电路板可以安装有接收电路和不需要密封的高频电路装置 密封,可以安装在金属盖外面的第一个电路板上。
    • 45. 发明授权
    • High frequency filter having a plurality of serially coupled first
resonators and a second resonator
    • 高频滤波器具有多个串联耦合的第一谐振器和第二谐振器
    • US5896073A
    • 1999-04-20
    • US808987
    • 1997-02-20
    • Moriyasu MiyazakiNaofumi YonedaTamotsu Nishino
    • Moriyasu MiyazakiNaofumi YonedaTamotsu Nishino
    • H01P1/203H01P1/205
    • H01P1/20336H01P1/2056
    • A high frequency filter includes a dielectric plate 8, an outer conductor 9 formed on the one surface of the dielectric plate 8, a plurality of strip conductors 10a-10d formed approximately in parallel on the other surface of the dielectric plate 8, a strip conductor 15 formed in a direction crossing the strip conductors 10a-10d, short-circuiting portions 11 and 16 connecting the one ends of the strip conductors 10a-10d and the strip conductor to the outer conductor 9, respectively, and further comprises a plurality of resonators 110a-110d constructed by the strip conductors 10, a plurality of capacitors (gaps) 12 coupling the resonators to each other to be connected in series, capacitors 13 connecting the strip conductors 10a, 10d to an input terminal and an outer conductor, respectively, a resonator 200 constructed by the strip conductor 15, and a plurality of capacitors (gaps) 33 connecting the strip conductors 10a, 10d to the resonator 200.
    • 高频滤波器包括电介质板8,形成在电介质板8的一个表面上的外部导体9,在电介质板8的另一个表面上大致平行地形成的多个条形导体10a-10d, 15形成在与带状导体10a-10d交叉的方向上,分别将带状导体10a-10d的一端和带状导体连接到外部导体9的短路部分11和16,还包括多个谐振器 由条形导体10构成的多个电容器(间隙)12,将谐振器彼此串联连接的多个电容器(间隙)12分别连接到输入端子和外部导体的电容器13, 由带状导体15构成的谐振器200以及将带状导体10a,10d连接到谐振器200的多个电容器(间隙)33。