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    • 42. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20060131608A1
    • 2006-06-22
    • US11288117
    • 2005-11-29
    • Toru Sugiyama
    • Toru Sugiyama
    • H01L31/109H01L29/06
    • H01L29/7304H01L27/0605H01L29/7371
    • Disclosed is a semiconductor device including an n+-type semiconductor layer formed on a substrate, a first n-type semiconductor layer formed on the n+-type semiconductor layer, a p-type semiconductor layer formed on the first n-type semiconductor layer and having a material having a first band gap, a second n-type semiconductor layer formed on the p-type semiconductor layer, being smaller than the p-type semiconductor layer in area and having a material having a second band gap larger than the first band gap, an implant portion formed to penetrate the p-type semiconductor layer, the first n-type semiconductor layer, and the n+-type semiconductor layer in a region where the second n-type semiconductor layer is not formed and to divide these layers into two regions, and an electrode formed on a region of the p-type semiconductor layer where the second n-type semiconductor layer is not formed, so as to bridge over the implant portion.
    • 公开了一种半导体器件,包括形成在衬底上的n + +型半导体层,形成在n + +型半导体层上的第一n型半导体层, 形成在第一n型半导体层上并且具有第一带隙的材料的p型半导体层,形成在p型半导体层上的第二n型半导体层小于p型半导体层中的p型半导体层 并且具有比第一带隙大的第二带隙的材料,形成为穿透p型半导体层,第一n型半导体层和n型半导体层的注入部分, 在没有形成第二n型半导体层的区域中形成半导体层,并将这些层分成两个区域,以及形成在第二n型半导体层不是的p型半导体层的区域上的电极 形成,以便桥接在植入部分上。