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    • 42. 发明授权
    • Horizontal polysilicon-germanium heterojunction bipolar transistor
    • 水平多晶硅 - 锗异质结双极晶体管
    • US08441084B2
    • 2013-05-14
    • US13048342
    • 2011-03-15
    • Jin CaiKevin K. ChanWilfried E. HaenschTak H. Ning
    • Jin CaiKevin K. ChanWilfried E. HaenschTak H. Ning
    • H01L29/66H01L29/04
    • H01L29/737H01L29/0808H01L29/0821H01L29/66242H01L29/66265
    • A horizontal heterojunction bipolar transistor (HBT) includes doped single crystalline Ge having a doping of the first conductivity type as the base having an energy bandgap of about 0.66 eV, and doped polysilicon having a doping of a second conductivity type as a wide-gap-emitter having an energy bandgap of about 1.12 eV. In one embodiment, doped polysilicon having a doping of the second conductivity type is employed as the collector. In other embodiments, a single crystalline Ge having a doping of the second conductivity type is employed as the collector. In such embodiments, because the base and the collector include the same semiconductor material, i.e., Ge, having the same lattice constant, there is no lattice mismatch issue between the collector and the base. In both embodiments, because the emitter is polycrystalline and the base is single crystalline, there is no lattice mismatch issue between the base and the emitter.
    • 水平异质结双极晶体管(HBT)包括具有第一导电类型的掺杂的掺杂单晶Ge作为具有约0.66eV的能带隙的基极,以及掺杂有第二导电类型的掺杂多晶硅作为宽间隙 - 发射体具有约1.12eV的能带隙。 在一个实施例中,采用具有第二导电类型掺杂的掺杂多晶硅作为集电极。 在其它实施例中,采用具有第二导电类型掺杂的单晶Ge作为集电极。 在这样的实施例中,由于基极和集电极包括具有相同晶格常数的相同的半导体材料即Ge,所以在集电极和基极之间不存在晶格失配问题。 在两个实施例中,由于发射极是多晶的并且基极是单晶的,所以在基极和发射极之间不存在晶格失配问题。
    • 44. 发明授权
    • SOI SiGe-base lateral bipolar junction transistor
    • SOI SiGe基极横向双极结晶体管
    • US08288758B2
    • 2012-10-16
    • US12958647
    • 2010-12-02
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • H01L29/06H01L31/109H01L31/0328H01L31/117
    • H01L29/7317H01L27/0821H01L27/1203H01L29/0808H01L29/165H01L29/66265
    • A lateral heterojunction bipolar transistor (HBT) is formed on a semiconductor-on-insulator substrate. The HBT includes a base including a doped silicon-germanium alloy base region, an emitter including doped silicon and laterally contacting the base, and a collector including doped silicon and laterally contacting the base. Because the collector current is channeled through the doped silicon-germanium base region, the HBT can accommodate a greater current density than a comparable bipolar transistor employing a silicon channel. The base may also include an upper silicon base region and/or a lower silicon base region. In this case, the collector current is concentrated in the doped silicon-germanium base region, thereby minimizing noise introduced to carrier scattering at the periphery of the base. Further, parasitic capacitance is minimized because the emitter-base junction area is the same as the collector-base junction area.
    • 在绝缘体上半导体衬底上形成横向异质结双极晶体管(HBT)。 HBT包括基底,其包括掺杂的硅 - 锗合金基底区域,包括掺杂硅并且横向接触基底的发射体,以及包括掺杂硅并且横向接触基底的收集器。 因为集电极电流被引导通过掺杂的硅 - 锗基区,所以与使用硅沟道的可比较的双极晶体管相比,HBT可以容纳更大的电流密度。 基底还可以包括上硅基区和/或下硅基区。 在这种情况下,集电极电流集中在掺杂的硅 - 锗基区域中,从而最小化引入到基极周边的载流子散射的噪声。 此外,寄生电容被最小化,因为发射极 - 基极结面积与集电极 - 基极结面积相同。
    • 45. 发明授权
    • Metal-semiconductor intermixed regions
    • 金属半导体混合区域
    • US08278200B2
    • 2012-10-02
    • US13012043
    • 2011-01-24
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • H01L21/20
    • H01L21/28518
    • In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.
    • 在一个示例性实施例中,一种可由机器读取的程序存储设备,其有形地体现了可由机器执行的用于执行操作的指令程序,所述操作包括:在半导体结构的表面上沉积具有第一金属的第一层, 第一层在第一层和半导体结构的界面处形成第一混合区; 去除沉积的第一层的一部分以暴露第一混合区; 在所述第一混合区域上沉积具有第二金属的第二层,其中沉积所述第二层在所述第二层和所述第一混合区的界面处产生第二混合区; 去除沉积的第二层的一部分以暴露第二混合区; 以及在所述半导体结构上执行至少一个退火。
    • 47. 发明授权
    • SOI CMOS circuits with substrate bias
    • SOI CMOS电路具有衬底偏置
    • US08106458B2
    • 2012-01-31
    • US12348391
    • 2009-01-05
    • Jin CaiWilfried E. HaenschTak H. Ning
    • Jin CaiWilfried E. HaenschTak H. Ning
    • H01L27/12
    • H01L21/84H01L27/1203H01L29/78648
    • The present invention relates to methods and devices for reducing the threshold voltage difference between an n-type field effect transistor (n-FET) and a p-type field effect transistor (p-FET) in a complementary metal-oxide-semiconductor (CMOS) circuit located on a silicon-on-insulator (SOI) substrate. Specifically, a substrate bias voltage is applied to the CMOS circuit for differentially adjusting the threshold voltages of the n-FET and the p-FET. For example, a positive substrate bias voltage can be used to reduce the threshold voltage of the n-FET but increase that of the p-FET, while a negative substrate bias voltage can be used to increase the threshold voltage of the n-FET but reduce that of the p-FET. Further, two or more substrate bias voltages of different magnitudes and/or directions can be used for differentially adjusting the n-FET and p-FET threshold voltages in two or more different CMOS circuits or groups of CMOS circuits.
    • 本发明涉及用于降低互补金属氧化物半导体(CMOS)中的n型场效应晶体管(n-FET)和p型场效应晶体管(p-FET)之间的阈值电压差的方法和装置 )电路,其位于绝缘体上硅(SOI)衬底上。 具体地,将衬底偏置电压施加到CMOS电路以差分调节n-FET和p-FET的阈值电压。 例如,可以使用正衬底偏置电压来降低n-FET的阈值电压,但是增加p-FET的阈值电压,而负衬底偏置电压可以用于增加n-FET的阈值电压,但是 减少p-FET的电流。 此外,可以使用不同幅度和/或方向的两个或更多个衬底偏置电压来差分调节两个或更多个不同CMOS电路或CMOS电路组中的n-FET和p-FET阈值电压。
    • 49. 发明申请
    • SOI CMOS CIRCUITS WITH SUBSTRATE BIAS
    • 具有基极偏置的SOI CMOS电路
    • US20090108355A1
    • 2009-04-30
    • US12348391
    • 2009-01-05
    • Jin CaiWilfried E. HaenschTak H. Ning
    • Jin CaiWilfried E. HaenschTak H. Ning
    • H01L27/092
    • H01L21/84H01L27/1203H01L29/78648
    • The present invention relates to methods and devices for reducing the threshold voltage difference between an n-type field effect transistor (n-FET) and a p-type field effect transistor (p-FET) in a complementary metal-oxide-semiconductor (CMOS) circuit located on a silicon-on-insulator (SOI) substrate. Specifically, a substrate bias voltage is applied to the CMOS circuit for differentially adjusting the threshold voltages of the n-FET and the p-FET. For example, a positive substrate bias voltage can be used to reduce the threshold voltage of the n-FET but increase that of the p-FET, while a negative substrate bias voltage can be used to increase the threshold voltage of the n-FET but reduce that of the p-FET. Further, two or more substrate bias voltages of different magnitudes and/or directions can be used for differentially adjusting the n-FET and p-FET threshold voltages in two or more different CMOS circuits or groups of CMOS circuits.
    • 本发明涉及用于降低互补金属氧化物半导体(CMOS)中的n型场效应晶体管(n-FET)和p型场效应晶体管(p-FET)之间的阈值电压差的方法和装置 )电路,其位于绝缘体上硅(SOI)衬底上。 具体地,将衬底偏置电压施加到CMOS电路以差分调节n-FET和p-FET的阈值电压。 例如,可以使用正衬底偏置电压来降低n-FET的阈值电压,但是增加p-FET的阈值电压,而负衬底偏置电压可以用于增加n-FET的阈值电压,但是 减少p-FET的电流。 此外,可以使用不同幅度和/或方向的两个或更多个衬底偏置电压来差分调节两个或更多个不同CMOS电路或CMOS电路组中的n-FET和p-FET阈值电压。