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    • 43. 发明授权
    • Corrosion inhibitor of NiCu for high performance writers
    • NiCu防腐剂用于高性能作者
    • US06395458B2
    • 2002-05-28
    • US09756015
    • 2001-01-08
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • G03F732
    • G03F7/322C23F1/02G11B5/3163H05K3/064
    • The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    • 通过保护所有暴露的铜轴承表面免受攻击,已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中,将苯并三唑(BTA)加入显影液中,然后以正常方式使用,显影时间不受该改性的影响。 在第二种方法中,首先将待接收光致抗蚀剂的表面浸入BTA溶液中,随后立即施加光刻胶并进行处理,包括正常进行。 对于这两种方法,结果是在开发过程中消除了所有的铜腐蚀。
    • 44. 发明授权
    • Corrosion inhibitor for NiCu for high performance writers
    • NiCu用于高性能作者的防腐蚀剂
    • US06207350B1
    • 2001-03-27
    • US09483931
    • 2000-01-18
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • Xuehua WuYi-Chun LiuJei-Wei ChangKochan Ju
    • G03F732
    • G03F7/322C23F1/02G11B5/3163H05K3/064
    • The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    • 通过保护所有暴露的铜轴承表面免受攻击,已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中,将苯并三唑(BTA)加入显影液中,然后以正常方式使用,显影时间不受该改性的影响。 在第二种方法中,首先将待接收光致抗蚀剂的表面浸入BTA的溶液中,随后立即施加光致抗蚀剂,并且包括显影在内的处理正常进行。 对于这两种方法,结果是在开发过程中消除了所有的铜腐蚀。
    • 45. 发明授权
    • High track density dual stripe magnetoresistive (DSMR) head
    • 高轨道密度双条磁阻(DSMR)头
    • US5684658A
    • 1997-11-04
    • US727264
    • 1996-10-07
    • Xizeng ShiYimin GuoKochan JuCherng-Chyi HanYimin HsuJei-Wei Chang
    • Xizeng ShiYimin GuoKochan JuCherng-Chyi HanYimin HsuJei-Wei Chang
    • G11B5/012G11B5/39G11B5/48
    • G11B5/3954G11B5/012G11B5/3967G11B5/488
    • A method for forming a dual stripe magnetoresistive (DSMR) sensor element, and the dual stripe magnetoresistive (DSMR) sensor element formed through the method. To practice the method, there is formed upon a substrate a first magnetoresistive (MR) layer, where the first magnetoresistive (MR) layer has a first sensor region longitudinally magnetically biased in a first longitudinal bias direction through a patterned first longitudinal magnetic biasing layer. There is then formed a second magnetoresistive (MR) layer parallel with and separated from the first magnetoresistive (MR) layer by an insulator layer. The second magnetoresistive (MR) layer has a second sensor region longitudinally magnetically biased in a second longitudinal bias direction through a patterned second longitudinal magnetic biasing layer. The first longitudinal bias direction and the second longitudinal bias direction are substantially parallel. In addition, the first sensor region and the second sensor region are physically offset. Finally, the first magnetoresistive (MR) layer is electromagnetically biased with a first bias current in a first bias current direction and the second magnetoresistive (MR) layer is electromagnetically biased with a second bias current in a second bias current direction, where the first bias current direction and the second bias current direction are substantially parallel.
    • 一种用于形成双条磁阻(DSMR)传感器元件的方法和通过该方法形成的双条带磁阻(DSMR)传感器元件。 为了实施该方法,在衬底上形成第一磁阻(MR)层,其中第一磁阻(MR)层具有通过图案化的第一纵向磁偏置层在第一纵向偏置方向上纵向磁偏置的第一传感器区。 然后通过绝缘体层形成与第一磁阻(MR)层平行并与第一磁阻(MR)层分离的第二磁阻(MR)层。 第二磁阻(MR)层具有通过图案化的第二纵向磁偏置层在第二纵向偏置方向上纵向磁偏置的第二传感器区。 第一纵向偏置方向和第二纵向偏置方向基本平行。 此外,第一传感器区域和第二传感器区域被物理偏移。 最后,第一磁阻(MR)层在第一偏置电流方向上以第一偏置电流进行电磁偏置,第二磁阻(MR)层在第二偏置电流方向上以第二偏置电流进行电磁偏置,其中第一偏置 电流方向和第二偏置电流方向基本上平行。
    • 49. 发明授权
    • Giant magnetoresistive (GMR) sensor element with enhanced magnetoresistive (MR) coefficient
    • 具有增强磁阻(MR)系数的巨磁阻(GMR)传感器元件
    • US06292336B1
    • 2001-09-18
    • US09408703
    • 1999-09-30
    • Cheng T. HorngRu-Ying TongKochan JuMao-Min ChenJei-Wei ChangSimon H. Liao
    • Cheng T. HorngRu-Ying TongKochan JuMao-Min ChenJei-Wei ChangSimon H. Liao
    • G11B5127
    • B82Y25/00B82Y10/00G01R33/093G11B5/3903G11B5/3967G11B2005/3996H01F10/3268
    • A method for forming a giant magnetoresistive (GMR) sensor element, and a giant magnetoresistive (GMR) sensor element formed in accord with the method. In accord with the method, there is first provided a substrate. There is then formed over the substrate a seed layer formed of a magnetoresistive (MR) resistivity sensitivity enhancing material selected from the group consisting or nickel-chromium alloys and nickel-iron-chromium alloys. There is then formed over the seed layer a nickel oxide material layer. Finally, there is then formed over the nickel oxide material layer a free ferromagnetic layer separated from a pinned ferromagnetic layer in turn formed thereover by a non-magnetic conductor spacer layer, where the pinned ferromagnetic layer in turn has a pinning material layer formed thereover. The method contemplates a giant magnetoresistive (GMR) sensor element formed in accord with the method. The nickel oxide material layer provides the giant magnetoresistive (GMR) sensor element with an enhanced magnetoresistive (MR) resistivity sensitivity.
    • 一种用于形成巨磁阻(GMR)传感器元件的方法,以及根据该方法形成的巨磁阻(GMR)传感元件。 根据该方法,首先提供基板。 然后在衬底上形成由选自镍铬合金和镍 - 铁 - 铬合金的磁阻(MR)电阻率敏感度增强材料形成的晶种层。 然后在种子层上形成氧化镍材料层。 最后,然后在氧化镍材料层上形成与被钉扎的铁磁性层分离的自由铁磁层,然后由非磁性导体间隔层形成,其中钉扎的铁磁层又形成有钉扎材料层。 该方法考虑了根据该方法形成的巨磁阻(GMR)传感器元件。 氧化镍材料层提供具有增强的磁阻(MR)电阻率敏感性的巨磁阻(GMR)传感器元件。
    • 50. 发明授权
    • Chemical approach to develop lift-off photoresist structure and passivate MR sensor
    • 化学方法开发剥离光致抗蚀剂结构和钝化MR传感器
    • US06274025B1
    • 2001-08-14
    • US09332433
    • 1999-06-14
    • Jei-Wei ChangShou-Chen KaoCherng-Chyi HanKochan JuMao-Min Chen
    • Jei-Wei ChangShou-Chen KaoCherng-Chyi HanKochan JuMao-Min Chen
    • C25D502
    • B82Y25/00B82Y10/00G11B5/3106G11B5/3163G11B5/3903G11B2005/3996
    • A method to form a passivation layer over a MR Sensor so that the passivation layer defines the track width. The passivation layer is formed simultaneously with the development of the lift off structure in a novel developing/oxidizing solution that oxidizes the MR sensor and develops the photoresist. The passivation layer is an electrical insulator that prevents sensor current from shunting through the overspray of the leads and a heat conductor to allow MR heat to dissipate through the overspray. The method comprises: spinning-on and printing a lift-off photoresist structure over the MR sensor. Next, the lift-off photoresist structure is developed. The MR sensor is anodized in a developing/oxidizing solution to: (1) remove portions of the lower photoresist and (2) to form a (e.g., thin NiFeO) passivation layer on the MR layer at least partially under the upper photoresist layer. The passivation layer is etched to remove the passivation layer not covered by the lift-off structure. Then, a lead layer is deposited over the passivation layer and MR sensor. The lift-off structure is removed.
    • 在MR传感器上形成钝化层的方法,使得钝化层限定轨道宽度。 钝化层与氧化MR传感器并显影光致抗蚀剂的新型显影/氧化溶液中的剥离结构的发展同时形成。 钝化层是电绝缘体,其防止传感器电流通过引线的过度喷射和热导体分流,以允许MR热量通过过喷器消散。 该方法包括:在MR传感器上旋转并打印剥离光致抗蚀剂结构。 接下来,开发剥离光致抗蚀剂结构。 将MR传感器在显影/氧化溶液中进行阳极氧化,以:(1)去除下部光致抗蚀剂的部分,和(2)在MR层上至少部分地在上部光致抗蚀剂层下形成(例如,薄的NiFeO)钝化层。 钝化层被蚀刻以除去未被剥离结构覆盖的钝化层。 然后,在钝化层和MR传感器上沉积引线层。 剥离结构被去除。