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    • 43. 发明授权
    • Applications of cascading DSP slices
    • 级联DSP片的应用
    • US07567997B2
    • 2009-07-28
    • US11019518
    • 2004-12-21
    • James M. SimkinsSteven P. YoungJennifer WongBernard J. NewAlvin Y. Ching
    • James M. SimkinsSteven P. YoungJennifer WongBernard J. NewAlvin Y. Ching
    • G06F7/48
    • G06F7/5443
    • In one embodiment an IC is disclosed which includes a plurality of cascaded digital signal processing slices, wherein each slice has a multiplier coupled to an adder via a multiplexer and each slice has a direct connection to an adjoining slice; and means for configuring the plurality of digital signal processing slices to perform one or more mathematical operations, via, for example, opmodes. This IC allows for the implementation of some basic math functions, such as add, subtract, multiply and divide. Many other applications may be implemented using the one or more DSP slices, for example, accumulate, multiply accumulate (MACC), a wide multiplexer, barrel shifter, counter, and folded, decimating, and interpolating FIRs to name a few.
    • 在一个实施例中,公开了一种IC,其包括多个级联的数字信号处理片,其中每个片具有经由多路复用器耦合到加法器的乘法器,并且每个片与直接连接到相邻片; 以及用于通过例如opmode来配置多个数字信号处理片以执行一个或多个数学运算的装置。 该IC允许实现一些基本的数学函数,例如加,减,乘和除。 可以使用一个或多个DSP片段来实现许多其它应用,例如,累加,乘法累加(MACC),宽多路复用器,桶形移位器,计数器和折叠,抽取和内插FIR等等。
    • 46. 发明授权
    • Self-repairing redundancy for memory blocks in programmable logic devices
    • 可编程逻辑器件中的存储器块的自修复冗余
    • US07216277B1
    • 2007-05-08
    • US10717040
    • 2003-11-18
    • Tony K. NgaiJennifer WongWayson J. Lowe
    • Tony K. NgaiJennifer WongWayson J. Lowe
    • G01R31/28G11C29/00
    • G11C29/44G11C29/4401G11C29/846
    • Programmable logic devices (PLDs) including self-repairing RAM circuits, and methods of automatically replacing defective columns in RAM arrays. A RAM circuit including redundant columns is tested during the PLD configuration sequence using a built in self test (BIST) procedure. If a defective column is detected, an error flag is stored in an associated volatile memory circuit. After the BIST procedure is complete, the PLD configuration process continues. The presence of the error flag causes the configuration data to bypass the defective column and to be passed directly into a replacement column. The configuration process continues until the remainder of the circuit is configured, including the redundant column. In other embodiments, the BIST procedure is initiated independently from the PLD configuration process. When a defective column is detected, user operation resumes with data being shunted from the defective column to a redundant column in a fashion transparent to the user.
    • 可编程逻辑器件(PLD),包括自修复RAM电路,以及自动替换RAM阵列中有缺陷的列的方法。 包括冗余列的RAM电路在PLD配置顺序期间使用内置的自检(BIST)过程进行测试。 如果检测到有缺陷的列,则错误标志被存储在相关联的易失性存储器电路中。 BIST程序完成后,PLD配置过程继续。 错误标志的存在导致配置数据绕过故障列,并直接传递到替换列。 配置过程继续,直到电路的其余部分被配置,包括冗余列。 在其他实施例中,独立于PLD配置过程启动BIST过程。 当检测到有缺陷的列时,以对用户透明的方式,将数据从有缺陷的列分流到冗余列的用户操作恢复。
    • 50. 发明授权
    • Low voltage interface circuit with a high voltage tolerance
    • 具有高电压容差的低压接口电路
    • US5933025A
    • 1999-08-03
    • US784163
    • 1997-01-15
    • Scott S. NanceMohammad R. TamjidiRichard C. LiJennifer WongHassan K. Bazargan
    • Scott S. NanceMohammad R. TamjidiRichard C. LiJennifer WongHassan K. Bazargan
    • H03K19/003H03K19/0185H03K19/094
    • H03K19/09429H03K19/00315H03K19/018521
    • A low voltage interface circuit with a high voltage tolerance enables devices with different power supply levels to be efficiently coupled together without significant leakage current or damage to the circuits. One embodiment of the present invention comprises a tri-state control circuit, a data path, a reference voltage circuit, and an isolation circuit. The interface circuit provides a high impedance receive mode. In this mode, when a voltage is applied to the I/O pin of the interface circuit which is sufficiently greater than the interface circuit power supply voltage, the isolation circuit isolates the power supply from the I/O pin. The interface circuit also protects all of the transistors from gate to bulk, gate to source and gate to drain voltage drops of greater than a specified voltage, for example 3.6V for a nominal 3V power supply when up to 5.5V is being externally applied to the I/O pin. In high impedance mode when the externally applied voltage at the I/O pin is sufficiently below the interface circuit supply voltage, the isolation circuit is driven to approximately the interface circuit supply voltage. In low impedance mode the isolation circuitry is disabled and the logic level at the data terminal is transmitted to the I/O pin. One embodiment of the present invention provides a buffered data path from the data terminal to the I/O pin.
    • 具有高电压公差的低压接口电路使得具有不同电源电平的器件能够有效耦合在一起,而不会有明显的漏电流或电路损坏。 本发明的一个实施例包括三态控制电路,数据通路,参考电压电路和隔离电路。 接口电路提供高阻抗接收模式。 在这种模式下,当接口电路的I / O引脚施加的电压足够大于接口电路电源电压时,隔离电路会将电源与I / O引脚隔离开来。 接口电路还保护所有的晶体管从栅极到体积,栅极到源极和漏极到大于指定电压的电压降,例如对于额定3V电源的3.6V,当高达5.5V被外部施加到 I / O引脚。 在高阻抗模式下,当I / O引脚的外部施加电压足够低于接口电路电源电压时,隔离电路被驱动到大致接口电路电源电压。 在低阻模式下,隔离电路被禁用,数据端子的逻辑电平被传输到I / O引脚。 本发明的一个实施例提供从数据终端到I / O引脚的缓冲数据路径。