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    • 41. 发明申请
    • Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits
    • 用于单片硅基光电路的设计,仿真和验证的综合方法
    • US20050289490A1
    • 2005-12-29
    • US11159283
    • 2005-06-22
    • Kalpendu ShastriSoham PathakPrakash GothoskarPaulius MosinskisBipin Dama
    • Kalpendu ShastriSoham PathakPrakash GothoskarPaulius MosinskisBipin Dama
    • G06F17/50G06G7/62
    • G06F17/5036G06F17/5068
    • Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: (1) digital electronic integrated circuit elements; (2) analog/mixed signal electronic integrated circuit elements; and (3) opto-electronic elements (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated. A physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified, to assess the properties of the overall physical design. The results of the co-simulation are compared to the results of the co-verification, with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considered to provide a final product (“tape out”).
    • 计算机辅助设计(CAD)工具用于在单片硅基电光芯片中执行电气和光学部件的集成设计,验证和布局。 为最终的硅基单片结构中包含的三种不同类型的元件准备了独立的顶级行为逻辑设计:(1)数字电子集成电路元件; (2)模拟/混合信号电子集成电路元件; 和(3)光电元件(包括无源和有源光学元件)。 一旦行为逻辑设计完成,结果将被合并并共同模拟。 为电路中的每种不同类型的元件开发和验证物理布局设计。 然后将单独的物理布局共同验证,以评估整体物理设计的属性。 将共模拟的结果与协同验证的结果进行比较,在逻辑设计和/或物理布局中进行改变,直到获得所需的操作参数。 一旦产生期望的结果,则常规晶圆级制造操作被认为是提供最终产品(“磁带输出”)。
    • 45. 发明申请
    • Silicon-Based Schottky Barrier Detector With Improved Responsivity
    • 具有改善响应性的硅基肖特基势垒检测器
    • US20110221019A1
    • 2011-09-15
    • US13038470
    • 2011-03-02
    • Vipulkumar PatelPrakash GothoskarMark WebsterChristopher J. Lang
    • Vipulkumar PatelPrakash GothoskarMark WebsterChristopher J. Lang
    • H01L31/108
    • H01L31/101H01L31/1085
    • A planar, waveguide-based silicon Schottky barrier photodetector includes a third terminal in the form of a field plate to improve the responsivity of the detector. Preferably, a silicide used for the detection region is formed during a processing step where other silicide contact regions are being formed. The field plate is preferably formed as part of the first or second layer of CMOS metallization and is controlled by an applied voltage to modify the electric field in the vicinity of the detector's silicide layer. By modifying the electric field, the responsivity of the device is “tuned” so as to adjust the momentum of “hot” carriers (electrons or holes, depending on the conductivity of the silicon) with respect to the Schottky barrier of the device. The applied potential functions to align with the direction of momentum of the “hot” carriers in the preferred direction “normal” to the silicon-silicide interface, allowing for an increased number to move over the Schottky barrier and add to the generated photocurrent.
    • 平面的基于波导的硅肖特基势垒光电检测器包括场板形式的第三端子,以提高检测器的响应度。 优选地,在其中形成其它硅化物接触区域的处理步骤期间形成用于检测区域的硅化物。 场板优选地形成为第一或第二CMOS金属化层的一部分,并且通过施加的电压来控制,以修改检测器硅化物层附近的电场。 通过修改电场,器件的响应度被“调谐”,以相对于器件的肖特基势垒调节“热”载流子(电子或空穴,取决于硅的导电性)的动量。 所施加的电位功能与“硅”载体的优势方向“正常”硅硅化物界面的动量方向相一致,允许增加的数量移动到肖特基势垒上并增加产生的光电流。
    • 47. 发明授权
    • SOI-based tunable laser
    • 基于SOI的可调谐激光器
    • US07701985B2
    • 2010-04-20
    • US12291246
    • 2008-11-06
    • Mark WebsterDavid PiedePrakash Gothoskar
    • Mark WebsterDavid PiedePrakash Gothoskar
    • H01S3/10H01S3/13
    • H01S5/141H01S5/021H01S5/02248H01S5/02268H01S5/06256
    • A silicon-on-insulator (SOI)-based tunable laser is formed to include the gain medium (such as a semiconductor optical amplifier) disposed within a cavity formed within the SOI substrate. A tunable wavelength reflecting element and associated phase matching element are formed on the surface of the SOI structure, with optical waveguides formed in the surface SOI layer providing the communication between these components. The tunable wavelength element is controlled to adjust the optical wavelength. Separate discrete lensing elements may be disposed in the cavity with the gain medium, providing efficient coupling of the optical signal into the SOI waveguides. Alternatively, the gain medium itself may be formed to include spot converting tapers on its endfaces, the tapers used to provide mode matching into the associated optical waveguides.
    • 形成绝缘体上硅(SOI)的可调谐激光器以包括设置在形成于SOI衬底内的空腔内的增益介质(例如半导体光放大器)。 在SOI结构的表面上形成可调波长反射元件和相关的相位匹配元件,其中形成在表面SOI层中的光波导提供这些部件之间的连通。 可调波长元件被控制以调节光学波长。 单独的离散透镜元件可以用增益介质设置在空腔中,从而提供光信号到SOI波导的有效耦合。 或者,增益介质本身可以被形成为包括其端面上的点变换锥度,用于向相关联的光波导提供模式匹配的锥度。
    • 48. 发明申请
    • Coupling between free space and optical waveguide using etched coupling surfaces
    • 使用蚀刻的耦合表面在自由空间和光波导之间耦合
    • US20090162013A1
    • 2009-06-25
    • US12316540
    • 2008-12-11
    • Mark WebsterVipulkumar PatelMary NadeauPrakash GothoskarDavid Piede
    • Mark WebsterVipulkumar PatelMary NadeauPrakash GothoskarDavid Piede
    • G02B6/42
    • G02B6/32G02B6/305G02B6/327
    • A plasma-based etching process is used to specifically shape the endface of an optical substrate supporting an optical waveguide into a contoured facet which will improve coupling efficiency between the waveguide and a free space optical signal. The ability to use standard photolithographic techniques to pattern and etch the optical endface facet allows for virtually any desired facet geometry to be formed—and replicated across the surface of a wafer for the entire group of assemblies being fabricated. A lens may be etched into the endface using a properly-defined photolithographic mask, with the focal point of the lens selected with respect to the parameters of the optical waveguide and the propagating free space signal. Alternatively, an angled facet may be formed along the endface, with the angle sufficient to re-direct reflected/scattered signals away from the optical axis.
    • 使用基于等离子体的蚀刻工艺来将支撑光波导的光学基板的端面特别地成形为轮廓刻面,这将提高波导与自由空间光信号之间的耦合效率。 使用标准光刻技术对光学端面小平面进行图案化和刻蚀的能力允许形成任何所需的刻面几何形状,并跨越制造的整组组件在晶片的表面上复制。 可以使用适当限定的光刻掩模将透镜蚀刻到端面中,相对于光波导的参数和传播的自由空间信号选择透镜的焦点。 或者,可以沿着端面形成成角度的小面,其角度足以将反射/散射信号重新引导远离光轴。
    • 49. 发明授权
    • Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits
    • 用于单片硅基光电路的设计,仿真和验证的综合方法
    • US07269809B2
    • 2007-09-11
    • US11159283
    • 2005-06-22
    • Kalpendu ShastriSoham PathakPrakash GothoskarPaulius MosinskisBipin Dama
    • Kalpendu ShastriSoham PathakPrakash GothoskarPaulius MosinskisBipin Dama
    • G06F17/50G06F17/10
    • G06F17/5036G06F17/5068
    • Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: (1) digital electronic integrated circuit elements; (2) analog/mixed signal electronic integrated circuit elements; and (3) opto-electronic elements (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated. A physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified, to assess the properties of the overall physical design. The results of the co-simulation are compared to the results of the co-verification, with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considered to provide a final product (“tape out”).
    • 计算机辅助设计(CAD)工具用于在单片硅基电光芯片中执行电气和光学部件的集成设计,验证和布局。 为最终的硅基单片结构中包含的三种不同类型的元件准备了独立的顶级行为逻辑设计:(1)数字电子集成电路元件; (2)模拟/混合信号电子集成电路元件; 和(3)光电元件(包括无源和有源光学元件)。 一旦行为逻辑设计完成,结果将被合并并共同模拟。 为电路中的每种不同类型的元件开发和验证物理布局设计。 然后将单独的物理布局共同验证,以评估整体物理设计的属性。 将共模拟的结果与协同验证的结果进行比较,在逻辑设计和/或物理布局中进行改变,直到获得所需的操作参数。 一旦产生期望的结果,则常规晶圆级制造操作被认为是提供最终产品(“磁带输出”)。