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41. 发明授权

US06420787B1 Semiconductor device and process of producing same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US06420787B1
公开(公告)日：2002-07-16
申请号：US09591785
申请日：2000-06-12
申请人： Tsuyoshi Kobayashi , Mitsutoshi Higashi , Hiroko Koike , Kei Murayama , Hideaki Sakaguchi
发明人： Tsuyoshi Kobayashi , Mitsutoshi Higashi , Hiroko Koike , Kei Murayama , Hideaki Sakaguchi
IPC分类号： H01L2348
CPC分类号： H01L24/73 , H01L23/3128 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/16145 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2225/06513 , H01L2225/06527 , H01L2225/06575 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2224/05647 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.
摘要翻译：一种具有第一电子部件和第二电子部件的半导体器件，所述第一电子部件大于所述第二电子部件的面积，并且所述多个连接端子焊盘包括焊盘形电极端子，以及外部连接端子或其它连接端子连接端子焊盘，其中第一和第二电子部件彼此相对设置，相应的焊盘形成表面彼此面对并且通过倒装芯片焊接彼此电连接; 并且弹性线形连接端子固定在第一电子部件的连接端子焊盘上，而不是连接到第二电子部件的连接端子焊盘的连接端子焊盘。

42. 发明授权

US06404070B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06404070B1
公开(公告)日：2002-06-11
申请号：US09627976
申请日：2000-07-28
申请人： Mitsutoshi Higashi , Kei Murayama , Hideaki Sakaguchi , Hiroko Koike
发明人： Mitsutoshi Higashi , Kei Murayama , Hideaki Sakaguchi , Hiroko Koike
IPC分类号： H01L2328
CPC分类号： D03D15/0088 , H01L23/36 , H01L23/3733 , H01L2224/73253 , H01L2924/15311
摘要： A semiconductor device having a heat dissipation plate which is lighter in weight and smaller in thickness than the conventional metal plate while ensuring a good thermal dissipation and mechanical support, which comprises: a semiconductor chip having a back surface bonded to a lower surface of a heat dissipation plate having an area larger than that of the semiconductor chip; a wiring board composed of a substrate having an upper surface with conductor patterns formed thereon, the conductor patterns having first ends connected to external connection terminals downwardly penetrating through the substrate via through holes extending through the substrate, the external connection terminals being disposed between a periphery of the semiconductor chip and a periphery of the wiring substrate; the semiconductor chip and the wiring board being bonded to each other so that electrode terminals formed on an active surface of the semiconductor chip are electrically connected to second ends of the conductor patterns; and the heat dissipation plate being composed of a fabric of carbon fibers and a resin impregnated in the fabric.
摘要翻译：一种具有散热板的半导体器件，其具有比常规金属板重量轻且厚度小于散热板，同时确保良好的散热和机械支撑，该半导体器件包括：半导体芯片，其具有结合到热表面的下表面散热板的面积大于半导体芯片的面积; 由具有形成有导体图案的上表面的基板构成的布线板，所述导体图案具有连接到外部连接端子的第一端，所述外部连接端子通过穿过所述基板的通孔向下穿过所述基板，所述外部连接端子设置在周边和所述布线基板的周围; 半导体芯片和布线板彼此接合，使得形成在半导体芯片的有源表面上的电极端子电连接到导体图案的第二端; 散热板由碳纤维织物和浸渍在织物中的树脂构成。

43. 发明授权

US6147311A Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same 失效
标题翻译：使用各向异性导电粘合剂层的多层电路板及其制造方法
公开(公告)号：US6147311A
公开(公告)日：2000-11-14
申请号：US909594
申请日：1997-08-12
申请人： Mitsutoshi Higashi
发明人： Mitsutoshi Higashi
IPC分类号： H05K3/46 , H01L21/56 , H01L23/12 , H01L23/498 , H05K3/32 , H05K3/40
CPC分类号： H01L21/563 , H01L23/49827 , H01L23/49833 , H05K3/4084 , H01L2224/0231 , H01L2224/0401 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K2203/0195 , H05K2203/1189 , H05K3/323
摘要： An anisotropic electro-conductive adhesive layer 14 including an adhesive 15 made of a thermosetting or thermoplastic resin containing electro-conductive particles 16 dispersed therein is formed on a basic circuit board 11 carrying a first circuit pattern 12. A second circuit pattern 18 is formed on the anisotropic electro-conductive adhesive layer 14. An end of the second circuit pattern 18 is curved into the anisotropic electro-conductive adhesive layer 14 to be electrically connected with first circuit pattern 12 via the electro-conductive particles 16. Thereby, the production process can be simplified and the production cost can be reduced. Also, the micro-circuit patterns can be arranged at a high density.
摘要翻译：在承载第一电路图案12的基本电路板11上形成包括由其中分散有导电颗粒16的热固性或热塑性树脂制成的粘合剂15的各向异性导电粘合剂层14.第二电路图案18形成在各向异性导电粘合剂层14.第二电路图案18的端部弯曲成各向异性导电粘合剂层14，以经由导电颗粒16与第一电路图案12电连接。由此，制造工艺可以简化，降低生产成本。此外，微电路图案可以以高密度布置。

44. 发明申请

US20130121009A1 Light Emitting Device 有权
标题翻译：发光装置
公开(公告)号：US20130121009A1
公开(公告)日：2013-05-16
申请号：US13670536
申请日：2012-11-07
申请人： Yasuaki Tsutsumi , Masanobu Mizuno , Yasutaka Sasaki , Mitsutoshi Higashi , Akinori Shiraishi , Rie Arai
发明人： Yasuaki Tsutsumi , Masanobu Mizuno , Yasutaka Sasaki , Mitsutoshi Higashi , Akinori Shiraishi , Rie Arai
IPC分类号： H01L33/50 , F21V7/05
CPC分类号： H01L33/46 , H01L33/44 , H01L33/507 , H01L2224/14 , H01L2933/0091
摘要： A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.
摘要翻译：发光器件设置有半导体发光元件和波长转换部分。波长转换部分包括在输入表面和输出表面之间的外周部分。外周部包括在输入面侧的第一倾斜部和输出面一侧的第二倾斜部。第一倾斜部分和第二倾斜部分限定突出在外周部分上的突出部分。

45. 发明授权

US08338289B2 Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole 有权
标题翻译：制造半导体芯片的方法，该半导体芯片包括设置在通孔中的半导体基板和贯通孔
公开(公告)号：US08338289B2
公开(公告)日：2012-12-25
申请号：US12901028
申请日：2010-10-08
申请人： Kei Murayama , Mitsutoshi Higashi
发明人： Kei Murayama , Mitsutoshi Higashi
IPC分类号： H01L21/4763
CPC分类号： H01L23/522 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip includes a semiconductor substrate, a through via provided in a through hole that passes through the semiconductor substrate, insulating layers laminated on the semiconductor substrate, a multi-layered wiring structure having a first wiring pattern and a second wiring pattern, and an external connection terminal provided on an uppermost layer of the multi-layered wiring structure, wherein the through via and the external connection terminal are connected electrically by the second wiring pattern.
摘要翻译：半导体芯片包括半导体衬底，设置在穿过半导体衬底的通孔中的通孔，层叠在半导体衬底上的绝缘层，具有第一布线图案和第二布线图案的多层布线结构，以及设置在所述多层布线结构的最上层的外部连接端子，其中所述贯通孔和所述外部连接端子通过所述第二布线图案电连接。

46. 发明授权

US08137497B2 Method of manufacturing wiring substrate 有权
标题翻译：制造布线基板的方法
公开(公告)号：US08137497B2
公开(公告)日：2012-03-20
申请号：US12409873
申请日：2009-03-24
申请人： Masahiro Sunohara , Kei Murayama , Mitsutoshi Higashi , Hideaki Sakaguchi
发明人： Masahiro Sunohara , Kei Murayama , Mitsutoshi Higashi , Hideaki Sakaguchi
IPC分类号： B29C37/00
CPC分类号： H05K1/185 , H01L21/568 , H01L21/6835 , H01L23/16 , H01L23/3107 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L25/105 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/30107 , H01L2924/3511 , H05K3/0052 , H05K3/205 , H05K3/423 , H05K3/4602 , H05K3/4644 , H05K2201/10674 , H05K2203/0152 , H05K2203/0156 , H05K2203/025 , H05K2203/0376 , H05K2203/0733 , H05K2203/1469 , H01L2924/00
摘要： A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing the stiffener substrate on the first tape base material, sealing the semiconductor chip and the stiffener substrate with a sealing resin, and removing the first tape base material and forming a build-up layer on a tape removing surface.
摘要翻译：一种方法包括以下步骤：在加强基板的单侧上提供第一带基材，在加强基板上形成用于容纳其中的半导体芯片的空腔，将加强基板插入空腔中并将加强基板设置在第一带状基材，用密封树脂密封半导体芯片和加强基板，并且去除第一带基材并在带剥离表面上形成堆积层。

47. 发明申请

US20110260744A1 PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD 审中-公开
标题翻译：探针卡和制造探针卡的方法
公开(公告)号：US20110260744A1
公开(公告)日：2011-10-27
申请号：US13089522
申请日：2011-04-19
申请人： Akinori Shiraishi , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： G01R31/00 , H05K3/00
CPC分类号： G01R1/07307 , G01R1/07314 , G01R1/0735 , G01R1/07364 , H05K3/4007 , H05K2201/0314 , H05K2201/0367 , H05K2201/10378 , H05K2203/1572 , Y10T29/49155
摘要： A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.
摘要翻译：用于对受试对象进行电气测试的探针卡包括：衬底主体，包括朝向被测试对象的第一表面;以及与第一表面相对的第二表面。通孔在第一表面和第二表面之间延伸穿过基底本体。与电极焊盘对应地形成接触凸块，并且电连接到贯通电极。弹性体填充在容纳部分中，该容纳部分形成在从第一表面向第二表面延伸的基底主体中。接触凸块形成在弹性体上。

48. 发明申请

US20110227218A1 SILICON SUBSTRATE FOR PACKAGE 有权
标题翻译：用于包装的硅基材
公开(公告)号：US20110227218A1
公开(公告)日：2011-09-22
申请号：US13116623
申请日：2011-05-26
申请人： Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
IPC分类号： H01L23/498
CPC分类号： H01L23/147 , H01L23/13 , H01L23/49827 , H01L24/48 , H01L33/486 , H01L2224/11334 , H01L2224/1134 , H01L2224/48091 , H01L2224/48235 , H01L2224/85455 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/12043 , H01L2924/1461 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.
摘要翻译：在用于封装的硅衬底中，设置有通孔，其中填充有用于容纳电子器件的芯片的空腔的底表面的通孔到衬底的背面。在空腔的底面侧的贯通电极的端部具有与形成包括电子器件的芯片的电路的布线的连接部。用于封装的硅衬底的特征在于，（1）包括薄膜布线作为布线，并且连接部分被连接到薄膜布线的导体加强和/或（2）引线接合部分被包括为通过在空腔的底面侧引线接合贯通电极的端部而形成布线和连接部。

49. 发明授权

US07960820B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US07960820B2
公开(公告)日：2011-06-14
申请号：US12265203
申请日：2008-11-05
申请人： Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
IPC分类号： H01L23/14
CPC分类号： H01L33/04 , B81B2207/012 , B81C1/0023 , B81C2203/031 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/167 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/4911 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01018 , H01L2924/01033 , H01L2924/01046 , H01L2924/0107 , H01L2924/01074 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/20752 , H01L2224/05599
摘要： A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.
摘要翻译：一种半导体封装件，其中电子器件芯片设置在通过堆叠多个硅衬底而构成的硅衬底堆叠产品的空腔中。

50. 发明授权

US07952191B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07952191B2
公开(公告)日：2011-05-31
申请号：US12187636
申请日：2008-08-07
申请人： Masahiro Sunohara , Mitsutoshi Higashi
发明人： Masahiro Sunohara , Mitsutoshi Higashi
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/0655 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H01L2924/00
摘要： A semiconductor device of the present invention includes a wiring substrate, a plurality of semiconductor chips mounted on the wiring substrate, and a radiation plate arranged over a plurality of semiconductor chips, and having a cooling passage to flow water in a horizontal direction to the wiring substrate. A plurality of semiconductor chips are arranged along the cooling passage, and out of the plurality of semiconductor chips, the semiconductor chip arranged on an inflow side of the cooling passage, has a smaller amount of heat generation than the semiconductor chip arranged on an outflow side of the cooling passage. For example, a memory chip is arranged on the inflow side of the cooling passage, and a logic chip is arranged on the outflow side of the cooling passage.
摘要翻译：本发明的半导体器件包括布线基板，安装在布线基板上的多个半导体芯片和布置在多个半导体芯片上的辐射板，并且具有将水沿水平方向流向布线的冷却通道基质。沿着冷却通道布置多个半导体芯片，并且在多个半导体芯片中，布置在冷却通道的流入侧上的半导体芯片的发热量比布置在流出侧的半导体芯片的热量少的冷却通道。例如，存储芯片布置在冷却通道的流入侧，逻辑芯片布置在冷却通道的流出侧。

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