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1. 发明授权

US08564077B2 Package for electronic component, manufacturing method thereof and sensing apparatus 有权
标题翻译：电子部件用包装及其制造方法以及感应装置
公开(公告)号：US08564077B2
公开(公告)日：2013-10-22
申请号：US12643391
申请日：2009-12-21
申请人： Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Masahiro Sunohara , Hideaki Sakaguchi , Yuichi Taguchi , Mitsutoshi Higashi
IPC分类号： H01L29/84 , H01L23/52 , H01L21/50
CPC分类号： G01P1/023 , B81B7/0074 , B81B2201/0235 , G01D11/245 , H01L2224/05001 , H01L2224/05009 , H01L2224/05548 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15156 , H01L2924/153 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.
摘要翻译：一种电子部件用包装体，具有矩形包装体，该矩形包装体具有与安装基板的平坦安装面抵接的平坦切割面，与该平坦切断面交叉的第一侧面，以及形成在上述平切面和第一侧表面，安装在封装主体中的电子部件，以及电连接到电子部件并形成在第一凹口部分的内壁表面上的第一焊盘。

2. 发明授权

US08299370B2 Wiring board and method of manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08299370B2
公开(公告)日：2012-10-30
申请号：US12709838
申请日：2010-02-22
申请人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
IPC分类号： H05K1/11
CPC分类号： H05K3/4647 , G01R1/07307 , G01R3/00 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K3/423 , H05K3/4608 , H05K2201/10674 , H05K2203/063 , H05K2203/0733 , Y10T29/49155 , Y10T428/24917 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
摘要翻译：布线基板包括在垂直方向上包括第一馈通导体部分的第一基板部分，设置在第一基板部分上的第二基板部分，并且在第二基板部分的相应部分的垂直方向上包括第二馈通导体部分第一馈通导体部分和包括第一馈通导体部分和第二馈通导体部分的馈通电极。

3. 发明授权

US07981798B2 Method of manufacturing substrate 有权
标题翻译：制造基板的方法
公开(公告)号：US07981798B2
公开(公告)日：2011-07-19
申请号：US12233875
申请日：2008-09-19
申请人： Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H01L21/44
CPC分类号： H01L33/486 , B81B2207/096 , B81C1/00301 , H01L24/97 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/12041 , H01L2924/15788 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要： The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film.
摘要翻译：本公开涉及一种制造衬底的方法。该方法包括：（a）通过从硅衬底的第一表面向硅衬底施加各向异性蚀刻形成通孔; （b）形成第一绝缘膜以覆盖硅衬底的第一表面，从通孔露出的硅衬底的表面和与第一表面相对的硅衬底的第二表面; （c）在设置在第二表面上的第一绝缘膜的一部分中形成开口，第一绝缘膜的与形成通孔的区域相对应的部分; （d）使用设置在第二表面上的第一绝缘膜作为掩模蚀刻硅衬底，从而在硅衬底中形成空腔; 和（e）去除第一绝缘膜。

4. 发明授权

US07708613B2 Method of producing light emitting apparatus 有权
标题翻译：制造发光装置的方法
公开(公告)号：US07708613B2
公开(公告)日：2010-05-04
申请号：US11656580
申请日：2007-01-23
申请人： Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
发明人： Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
IPC分类号： H01J1/62
CPC分类号： H01L33/507 , H01L24/97 , H01L2224/16225 , H01L2924/16195 , H01L2933/0041
摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.
摘要翻译：公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

5. 发明授权

US07494898B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07494898B2
公开(公告)日：2009-02-24
申请号：US11641336
申请日：2006-12-19
申请人： Masahiro Sunohara , Yuichi Taguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Masahiro Sunohara , Yuichi Taguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： H01L21/00
CPC分类号： H01L33/483 , B81B7/0067 , H01L2224/16225
摘要： A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.
摘要翻译：公开的制造半导体器件的半导体器件的方法，其中半导体元件安装在第一衬底上，包括以下步骤：将其上安装有半导体元件的第一衬底和由不同于第一衬底以封装半导体元件; 在所述第一基板中形成第一凹槽，在所述第二基板中形成第二凹槽; 并且在第一凹槽和第二凹槽之间切割一部分，以使半导体器件单独化。

6. 发明授权

US09052341B2 Probe card and manufacturing method thereof 有权
标题翻译：探针卡及其制造方法
公开(公告)号：US09052341B2
公开(公告)日：2015-06-09
申请号：US13403227
申请日：2012-02-23
申请人： Akinori Shiraishi , Hideaki Sakaguchi , Mitsutoshi Higashi
发明人： Akinori Shiraishi , Hideaki Sakaguchi , Mitsutoshi Higashi
IPC分类号： G01R3/00 , G01R1/073 , G01R31/28
CPC分类号： G01R3/00 , G01R1/07378 , G01R31/2889 , Y10T29/49117
摘要： In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.
摘要翻译：在一个实施例中，提供探针卡。探针卡包括：具有第一表面和与第一表面相对的第二表面的基底; 穿过所述基板形成并在所述第一表面和所述第二表面之间延伸的通孔; 形成在所述通孔中以延伸到所述第一表面的弹性构件; 形成在通孔中以延伸到第二表面的通孔; 所述弹性构件的表面上的与所述贯通电极电连接的第一迹线; 以及经由所述第一迹线在所述弹性构件上的接触凸块以电连接到所述第一迹线，其中当对所述DUT进行电测试时，所述接触凸块电连接到形成在DUT（待测器件）上的电极焊盘）使用探针卡。

7. 发明授权

US08777638B2 Wiring board and method of manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08777638B2
公开(公告)日：2014-07-15
申请号：US13606747
申请日：2012-09-07
申请人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
发明人： Hideaki Sakaguchi , Akinori Shiraishi , Mitsutoshi Higashi
IPC分类号： H05K1/11
CPC分类号： H05K3/4647 , G01R1/07307 , G01R3/00 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K3/423 , H05K3/4608 , H05K2201/10674 , H05K2203/063 , H05K2203/0733 , Y10T29/49155 , Y10T428/24917 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
摘要翻译：布线基板包括在垂直方向上包括第一馈通导体部分的第一基板部分，设置在第一基板部分上的第二基板部分，并且在第二基板部分的相应部分的垂直方向上包括第二馈通导体部分第一馈通导体部分和包括第一馈通导体部分和第二馈通导体部分的馈通电极。

8. 发明授权

US08304862B2 Semiconductor package and manufacturing method of the same 有权
标题翻译：半导体封装及其制造方法相同
公开(公告)号：US08304862B2
公开(公告)日：2012-11-06
申请号：US12644390
申请日：2009-12-22
申请人： Yuichi Taguchi , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
发明人： Yuichi Taguchi , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
IPC分类号： H01L23/52 , H01L21/60 , H01L23/48
CPC分类号： H01L21/76898 , H01L21/7682 , H01L23/481 , H01L23/49822 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05568 , H01L2224/0557 , H01L2224/05599 , H01L2224/05644 , H01L2224/05655 , H01L2224/13025 , H01L2224/131 , H01L2224/16 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05552
摘要： A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.
摘要翻译：半导体封装包括：布线板; 以及形成在所述布线板上的半导体器件; 其中所述半导体器件包括：半导体芯片; 以及贯通电极，其一端固定在半导体芯片的一个平面上，另一端穿过半导体芯片并固定在半导体芯片的另一平面上，穿透电极穿透半导体芯片穿透电极不通过形成在半导体芯片中的空间部分与半导体芯片的壁面接触的方式; 并且布线板和半导体器件经由穿透电极电连接。

9. 发明授权

US07876036B2 Light emitting apparatus and manufacturing method therefor 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US07876036B2
公开(公告)日：2011-01-25
申请号：US11645581
申请日：2006-12-27
申请人： Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
发明人： Yuichi Taguchi , Masahiro Sunohara , Hideaki Sakaguchi , Akinori Shiraishi , Naoyuki Koizumi , Kei Murayama , Mitsutoshi Higashi
IPC分类号： H01J1/62
CPC分类号： H01L33/507 , H01L33/486 , H01L33/501 , H01L2224/16225 , H01L2924/16195 , H01L2933/0041
摘要： A light emitting apparatus, includes: a light emitting device accommodating body, which has a recessed portion wherein a light emitting device is accommodated; a wiring pattern, which is provided for the light emitting device accommodating body 11 and is electrically connected to the light emitting device; a light transmitting substrate, which is mounted on the light emitting device accommodating body and completely closes the recessed portion; and a phosphor-containing, ultraviolet curing resin, which is so deposited that, opposite to the light emitting device accommodating body, the face of the light transmitting member is covered.
摘要翻译：发光装置包括：发光装置容纳主体，其具有容纳发光装置的凹部; 布线图案，其被设置用于发光装置容纳主体11并且电连接到发光装置; 透光基板，其安装在发光装置容纳体上并完全封闭凹部; 和含有荧光体的紫外线固化树脂，其被沉积成与发光装置容纳体相对的透光部件的表面被覆盖。

10. 发明申请

US20100155928A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100155928A1
公开(公告)日：2010-06-24
申请号：US12644390
申请日：2009-12-22
申请人： Yuichi Taguchi , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
发明人： Yuichi Taguchi , Mitsutoshi Higashi , Akinori Shiraishi , Hideaki Sakaguchi , Masahiro Sunohara
IPC分类号： H01L23/52 , H01L21/60 , H01L23/48
CPC分类号： H01L21/76898 , H01L21/7682 , H01L23/481 , H01L23/49822 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05568 , H01L2224/0557 , H01L2224/05599 , H01L2224/05644 , H01L2224/05655 , H01L2224/13025 , H01L2224/131 , H01L2224/16 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05552
摘要： A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.
摘要翻译：半导体封装包括：布线板; 以及形成在所述布线板上的半导体器件; 其中所述半导体器件包括：半导体芯片; 以及贯通电极，其一端固定在半导体芯片的一个平面上，另一端穿过半导体芯片并固定在半导体芯片的另一平面上，穿透电极穿透半导体芯片穿透电极不通过形成在半导体芯片中的空间部分与半导体芯片的壁面接触的方式; 并且布线板和半导体器件经由穿透电极电连接。

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