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    • 41. 发明授权
    • Substrate handling chamber
    • 基板处理室
    • US06550158B2
    • 2003-04-22
    • US09727736
    • 2000-12-01
    • Allan DoleyDennis GoodwinKenneth O'NeillGerben VrijburgDavid RodriguezRavinder Aggarwal
    • Allan DoleyDennis GoodwinKenneth O'NeillGerben VrijburgDavid RodriguezRavinder Aggarwal
    • F26B300
    • C30B29/14C23C16/4401C23C16/4408C30B25/08Y10S414/139
    • An apparatus and method for reducing particles in reactors. The apparatus includes an enclosure with a wafer handling chamber connected by an isolation gate valve to a processing chamber. Pipes deliver purge gas into the wafer handling chamber to eliminate particles from the enclosure. A pilot operated back pressure regulator regulates the delivery and removal of the purge gas. The apparatus actuates the isolation gate valve in a controlled rate to reduce disturbances from the purge gas entering into the enclosure. A Bernoulli wand is provided for lifting and holding a single semiconductor wafer. A dome loaded regulator actuated by a pilot gas is used to control the ramp rates of gas to the Bernoulli wand. The ramping rates of the Bernoulli wand gas can be controlled by restrictions and check valves in the pilot gas line. The apparatus also utilizes ionizers in the purge gas lines entering the wafer handling chamber and load locks. Through the use of an alpha particle emission source in the purge gas line prior to the load lock and wafer handling chamber, the purged gas molecules are ionized. The ionized gas is conductive and therefore discharges static so that wafers are no longer attracted to each other by electrostatic force. In addition, the apparatus includes means for reducing gas flow turbulence when switching valves within the reactor.
    • 用于还原反应器中的颗粒的装置和方法。 该装置包括具有通过隔离闸阀连接到处理室的晶片处理室的外壳。 管道将净化气体输送到晶片处理室中以消除外壳中的颗粒。 先导操作的背压调节器调节吹扫气体的输送和去除。 该设备以受控的速率驱动隔离闸阀,以减少进入外壳的吹扫气体的干扰。 提供伯努利棒用于提升和保持单个半导体晶片。 使用由先导气体驱动的圆顶加载式调节器来控制伯努利魔杖的气体斜坡速率。 伯努利魔杖气体的斜率可以通过先导气体管线中的限制和止回阀来控制。 该设备还在进入晶片处理室的清洗气体管线和负载锁定中使用电离器。 通过在负载锁定和晶片处理室之前在吹扫气体管线中使用α粒子发射源,将净化的气体分子电离。 电离气体是导电的,因此放电静电,使得晶片不再被静电力彼此吸引。 另外,该设备包括当在反应器内切换阀时减少气流湍流的装置。
    • 46. 发明授权
    • Redundant temperature sensor for semiconductor processing chambers
    • 用于半导体处理室的冗余温度传感器
    • US07993057B2
    • 2011-08-09
    • US11961671
    • 2007-12-20
    • Ravinder AggarwalMark KleshockLoren Jacobs
    • Ravinder AggarwalMark KleshockLoren Jacobs
    • G01K7/00
    • G01K7/04G01K13/00G01K15/00H01L21/67248
    • Systems are provided for measuring temperature in a semiconductor processing chamber. Embodiments provide a multi-junction thermocouple comprising a first junction and a second junction positioned to measure temperature at substantially the same portion of a substrate. A controller may detect failures in the first junction, the second junction, a first wire pair extending from the first junction, or a second wire pair extending from the second junction. The controller desirably responds to a detected failure of the first junction or first wire pair by selecting the second junction and second wire pair. Conversely, the controller desirably responds to a detected failure of the second junction or second wire pair by selecting the first junction and first wire pair. Systems taught herein may permit accurate and substantially uninterrupted temperature measurement despite failure of a junction or wire pair in a thermocouple.
    • 提供用于测量半导体处理室中的温度的系统。 实施例提供了一种多结热电偶,其包括第一接头和第二接头,其定位成测量基板的基本相同部分处的温度。 控制器可以检测第一连接点,第二接头,从第一接头延伸的第一线对或从第二接头延伸的第二线对的故障。 控制器期望地通过选择第二连接点和第二线对来响应检测到的第一结或第一线对的故障。 相反,控制器期望地通过选择第一连接点和第一线对来响应检测到的第二连接点或第二线对的故障。 尽管本文教导的系统可能允许精确和基本上不间断的温度测量,尽管热电偶中的接头或线对失效。
    • 49. 发明申请
    • REDUNDANT TEMPERATURE SENSOR FOR SEMICONDUCTOR PROCESSING CHAMBERS
    • 用于半导体处理器的冗余温度传感器
    • US20090159000A1
    • 2009-06-25
    • US11961671
    • 2007-12-20
    • Ravinder AggarwalMark KleshockLoren Jacobs
    • Ravinder AggarwalMark KleshockLoren Jacobs
    • B05C11/00G01K7/02
    • G01K7/04G01K13/00G01K15/00H01L21/67248
    • Systems are provided for measuring temperature in a semiconductor processing chamber. Embodiments provide a multi-junction thermocouple comprising a first junction and a second junction positioned to measure temperature at substantially the same portion of a substrate. A controller may detect failures in the first junction, the second junction, a first wire pair extending from the first junction, or a second wire pair extending from the second junction. The controller desirably responds to a detected failure of the first junction or first wire pair by selecting the second junction and second wire pair. Conversely, the controller desirably responds to a detected failure of the second junction or second wire pair by selecting the first junction and first wire pair. Systems taught herein may permit accurate and substantially uninterrupted temperature measurement despite failure of a junction or wire pair in a thermocouple.
    • 提供用于测量半导体处理室中的温度的系统。 实施例提供了一种多结热电偶,其包括第一接头和第二接头,其定位成测量基板的基本相同部分处的温度。 控制器可以检测第一连接点,第二接头,从第一接头延伸的第一线对或从第二接头延伸的第二线对的故障。 控制器期望地通过选择第二连接点和第二线对来响应检测到的第一结或第一线对的故障。 相反,控制器期望地通过选择第一连接点和第一线对来响应检测到的第二连接点或第二线对的故障。 尽管本文教导的系统可能允许精确和基本上不间断的温度测量,尽管热电偶中的接头或线对失效。