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    • 46. 发明授权
    • Method and apparatus for reviewing defects of semiconductor device
    • 检查半导体器件缺陷的方法和装置
    • US08581976B2
    • 2013-11-12
    • US12986475
    • 2011-01-07
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • H04N7/18
    • G06T7/001G06T2207/30148H01J37/222H01J37/28H01J2237/2817
    • A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.
    • 提供了一种用于检查半导体器件缺陷的方法和装置,其涉及检测在低放大倍率下拍摄的SEM图像上的缺陷,并且以高倍放大倍数检查SEM图像上的缺陷,并且可以检查在 短时间内可以提高缺陷检查的效率。 在本发明中,用于检查半导体器件的缺陷的方法包括以下步骤:通过使用扫描电子显微镜以第一放大率获得由检测装置检测的半导体器件上的缺陷的图像,从而 所述图像包括在第一放大处获得的缺陷,通过将包括在第一放大获得的缺陷的图像与由包含第一放大率的缺陷构成的图像进行比较的图像进行比较来检测缺陷,并且获取检测到的缺陷的图像 在大于第一放大率的第二放大倍率下。
    • 49. 发明授权
    • Method and apparatus for reviewing defects of semiconductor device
    • 检查半导体器件缺陷的方法和装置
    • US07873202B2
    • 2011-01-18
    • US11488636
    • 2006-07-19
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • G06K9/00
    • G06T7/001G06T2207/30148H01J37/222H01J37/28H01J2237/2817
    • An apparatus for reviewing defects of a semiconductor device is provided to review a lot of defects in a short period of time thereby to improve the efficiency of defect review. A method for reviewing defects of a semiconductor device includes obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.
    • 提供一种用于检查半导体器件的缺陷的装置,以在短时间内检查大量缺陷,从而提高缺陷检查的效率。 一种用于检查半导体器件的缺陷的方法包括:利用扫描电子显微镜以第一倍率获得包括由检测装置检测到的半导体器件的图像的图像,从包括在第 第一放大率,通过将包括在第一放大率获得的缺陷的图像与由包括第一放大率的缺陷构成的图像制成的参考图像进行比较来检测缺陷,并且以大于第二倍率的第二倍率拍摄检测到的缺陷的图像 第一放大。
    • 50. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE AND IMAGING SYSTEM
    • 光电转换器和成像系统
    • US20100066876A1
    • 2010-03-18
    • US12555086
    • 2009-09-08
    • Masaki Kurihara
    • Masaki Kurihara
    • H04N5/335H01L31/0232H01L31/0216
    • H04N5/2254H01L27/14621H01L27/14627H01L27/14636H01L27/14685
    • A photoelectric conversion device comprises a semiconductor substrate; a multilayer wiring structure; a first color filter layer including a plurality of first color filters which are arranged above a first photoelectric conversion units to allow light of a first color to enter the first photoelectric conversion units, each first color filter being connected to an adjacent first color filter; and a second color filter layer including a plurality of second color filters which are arranged above a second photoelectric conversion units to allow light of a second color to enter the second photoelectric conversion units, wherein the multilayer wiring structure including an uppermost wiring layer which defines the aperture regions corresponding to the respective photoelectric conversion units, and an insulation film arranged to cover the uppermost wiring layer, and wherein the first color filter layer and the second color filter layer are arranged to cover the insulation film.
    • 光电转换装置包括半导体衬底; 多层布线结构; 第一滤色器层,包括多个第一滤色器,其布置在第一光电转换单元上方,以允许第一颜色的光进入第一光电转换单元,每个第一滤色器连接到相邻的第一滤色器; 以及第二滤色器层,其包括多个第二滤色器,所述第二滤色器布置在第二光电转换单元的上方,以允许第二颜色的光进入第二光电转换单元,其中所述多层布线结构包括最上布线层, 对应于各个光电转换单元的孔径区域以及布置成覆盖最上层布线层的绝缘膜,并且其中第一滤色器层和第二滤色器层布置成覆盖绝缘膜。