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41. 发明申请

US20100134234A1 SHIFT REGISTER APPARATUS 有权
标题翻译：移位寄存器
公开(公告)号：US20100134234A1
公开(公告)日：2010-06-03
申请号：US12342042
申请日：2008-12-22
申请人： Yi-Suei Liao , Chien-Liang Chen , Chen-Lun Chiu , Hao-Chieh Lee , Kuan-Yu Chen
发明人： Yi-Suei Liao , Chien-Liang Chen , Chen-Lun Chiu , Hao-Chieh Lee , Kuan-Yu Chen
IPC分类号： G11C19/28
CPC分类号： G11C19/28
摘要： A shift register apparatus is provided. The pull-down unit of each of the shift registers in the shift register apparatus is controlled by itself, previous, and next two shift registers to enhance the ability of pull-down and voltage regulating. Therefore, the circuit structure of each of the shift registers does not need to be designed a large compensation capacitor therein to substantially restrain the coupling noise effect caused by the clock signal, and thus permitting that each of the shift registers can be collocated with a small compensation capacitor to enhance the output capability thereof.
摘要翻译：提供一种移位寄存器装置。移位寄存器装置中每个移位寄存器的下拉单元由本身，前一个和下一个两个移位寄存器控制，以增强下拉和电压调节的能力。因此，每个移位寄存器的电路结构不需要在其中设计大的补偿电容器，以基本上抑制由时钟信号引起的耦合噪声效应，并且因此允许每个移位寄存器可以以小的补偿电容器，以提高其输出能力。

42. 发明授权

US07670191B2 Extension/expansion to universal serial bus connector 失效
标题翻译：扩展/扩展到通用串行总线连接器
公开(公告)号：US07670191B2
公开(公告)日：2010-03-02
申请号：US11788613
申请日：2007-04-20
申请人： Joseph Ortega , James M. Sabo , Kuan-Yu Chen , Chong Yi , Gary E. Biddle
发明人： Joseph Ortega , James M. Sabo , Kuan-Yu Chen , Chong Yi , Gary E. Biddle
IPC分类号： H01R24/00
CPC分类号： H01R24/62 , H01R27/00 , H01R31/005 , H01R31/06
摘要： An extension to USB includes an insulative tongue portion and a number of contacts held in the insulative tongue portion. The contacts have four conductive contacts and two pairs of differential contacts for transferring differential signals. The four conductive contacts consist of a power contact, a ground contact, a − data contact and a + data contact. One pair of the differential contacts is located between the power contact and the − data contact and the other pair of the differential contacts is located between the power contact and the + data contact. The four conductive contacts are for USB protocol and arrangement of the four conductive contacts with the insulative tongue portion is compatible to the standard USB connector. The two pairs of differential contacts are for non-USB protocol. The extension to USB is capable of mated with a commentary standard USB connector and a commentary extension to USB, alternatively.
摘要翻译： USB的延伸部包括绝缘舌部和保持在绝缘舌部中的多个触点。触点具有四个导电触点和两对差分触点，用于传输差分信号。四个导电触点由电源触点，接地触点，数据触点和+数据触点组成。一对差动触点位于电源触点和数据触点之间，另一对差动触点位于电源触点和+数据触点之间。四个导电触点用于USB协议，并且具有绝缘舌部分的四个导电触点的布置与标准USB连接器兼容。两对差分触点用于非USB协议。 USB的扩展能够与评论标准USB连接器和USB的评论扩展配合使用。

43. 外观设计

USD606945S1 Electrical connector 有权
公开(公告)号：USD606945S1
公开(公告)日：2009-12-29
申请号：US29308378
申请日：2008-06-13
申请人： Chong Yi , Kuan-Yu Chen , Pei Tsao
设计人： Chong Yi , Kuan-Yu Chen , Pei Tsao

44. 发明申请

US20090264001A1 High density connector assembly having two-leveled contact interface 失效
标题翻译：高密度连接器组件，具有两层触点接口
公开(公告)号：US20090264001A1
公开(公告)日：2009-10-22
申请号：US12157112
申请日：2008-06-06
申请人： Chong Yi , Kuan-Yu Chen
发明人： Chong Yi , Kuan-Yu Chen
IPC分类号： H01R13/642
CPC分类号： H01R24/84 , H01R12/712 , H01R13/514
摘要： A connector assembly (100) includes a first connector (10) and a mating second connector (30). Each connector includes a number of leadframes (21, 41) stacked one by one. Each leadframe has a first leadframe housing (211, 411) and a second leadframe housing (214, 414) attached to the first leadframe housing. Each connector includes an array of first terminals (5) and an array of second terminals (6) respectively mounted along the second and the first leadframe housings, and a pair of latching members (25, 45) mounted at opposite sides of the leadframes together with the first and second terminals to tie the plurality of stacked leadframes as a whole.
摘要翻译：连接器组件（100）包括第一连接器（10）和配合的第二连接器（30）。每个连接器包括多个逐个堆叠的引线框架（21,41）。每个引线框架具有连接到第一引线框壳体的第一引线框架壳体（211,411）和第二引线框架壳体（214,414）。每个连接器包括第一端子（5）的阵列和分别沿着第二引线框架壳体和第一引线框架壳体安装的第二端子阵列，以及一对安装在引线框架的相对侧的闩锁构件（25,45）其中第一和第二端子作为整体来连接多个堆叠的引线框架。

45. 发明申请

US20090149045A1 Electrical connector with improved ground piece 有权
标题翻译：具有改进接地片的电连接器
公开(公告)号：US20090149045A1
公开(公告)日：2009-06-11
申请号：US11999434
申请日：2007-12-05
申请人： Kuan-Yu Chen , Chong Yi , Jia-Yong He
发明人： Kuan-Yu Chen , Chong Yi , Jia-Yong He
IPC分类号： H01R13/648
CPC分类号： H01R13/6471 , H01R13/6589 , H01R24/64
摘要： An electrical connector includes an insulative housing, a plurality of first and second contacts retained in the insulative housing and a metallic ground. Each first contact comprises a first contact portion and a first mounting portion. Each second contact comprises a second contact portion and a second mounting portion. The first and second mounting portions are respectively arranged in first and second rows. The second contacts comprise a grounding contact. The ground piece comprises an elastic contact beam for abutting against the grounding contact so that the surface of the grounding contact is expanded. As a result, cross-talk occurred between the contacts can be decreased.
摘要翻译：电连接器包括绝缘壳体，保持在绝缘壳体中的多个第一和第二触点和金属接地。每个第一接触包括第一接触部分和第一安装部分。每个第二接触件包括第二接触部分和第二安装部分。第一和第二安装部分分别设置在第一和第二行中。第二触点包括接地触点。接地片包括用于抵靠接地触头的弹性接触梁，使得接地触头的表面膨胀。结果，可以减少触点之间的串扰。

46. 发明申请

US20090130906A1 ELECTRICAL CONNECTOR WITH IMPROVED WIRE TERMINATION ARRANGEMENT 有权
标题翻译：具有改进的电线终端装置的电连接器
公开(公告)号：US20090130906A1
公开(公告)日：2009-05-21
申请号：US11985676
申请日：2007-11-16
申请人： Pei Tsao , Chong Yi , Kuan-Yu Chen , Gary E. Biddle
发明人： Pei Tsao , Chong Yi , Kuan-Yu Chen , Gary E. Biddle
IPC分类号： H01R24/00
CPC分类号： H01R13/58
摘要： An electrical connector (100) includes an insulative housing (2) extending in a front-to-back direction, a conductive shell (7) enclosing the insulative housing and cooperating with the insulative housing to define a receiving cavity (101) adapted for receiving a complementary connector, a first set of contacts (3) held in the insulative housing for transmitting a first kind of signals, a second set of contacts (4) held in the insulative housing and comprising two pairs of differential contacts (41) respectively for transmitting and receiving a second kind of signals and a grounding contact (42), a first set of wires (51) and a second set of wires (52). Each first contact includes a contacting section (36) exposed in the receiving cavity and a tail section (35) extending rearward from the contacting section. Each of the second set of contacts includes a contacting section (43) exposed in the receiving cavity and a tail section (45) extending rearward form the contacting section. The first set of wires are aligned in one row and have inner conductors (510) electrically connecting with the tail sections of the first set of contacts. The second set of wires are aligned in one row and include a pair of differential pairs (521) electrically connecting with the two pairs of differential contacts for transmitting and receiving the second kind of signals and at least one grounding conductor (522) electrically connecting with the grounding contact.
摘要翻译：电连接器（100）包括在前后方向延伸的绝缘壳体（2），包围绝缘壳体的导电壳体（7），并与绝缘壳体配合以限定适于接纳的接收腔互补连接器，保持在绝缘壳体中用于传输第一种信号的第一组触点（3），保持在绝缘壳体中的第二组触点（4），分别包括两对差动触点（41），用于发送和接收第二类信号和接地触点（42），第一组电线（51）和第二组电线（52）。每个第一接触包括暴露在接收腔中的接触部分（36）和从接触部分向后延伸的尾部（35）。第二组触点中的每一个包括暴露在接收腔中的接触部分（43）和从接触部分向后延伸的尾部（45）。第一组电线排列成一列，并且具有与第一组触点的尾部部分电连接的内部导体（510）。第二组线对齐在一排中，并且包括一对与两对差动触点电连接的差分对（521），用于传输和接收第二种信号，以及至少一个接地导体（522）与接地接点。

47. 发明申请

US20080285196A1 OVER-VOLTAGE INDICATOR AND RELATED CIRCUIT AND METHOD 失效
标题翻译：过电压指示器及相关电路及方法
公开(公告)号：US20080285196A1
公开(公告)日：2008-11-20
申请号：US11934767
申请日：2007-11-03
申请人： Wen-Ching Hsiung , Jeng-Dau Chang , Chia-Liang Lai , Kuan-Yu Chen
发明人： Wen-Ching Hsiung , Jeng-Dau Chang , Chia-Liang Lai , Kuan-Yu Chen
IPC分类号： H02H9/04 , H02H3/20
CPC分类号： H03K17/223 , H03K17/08 , H03K17/18 , H03K19/00315 , H03K2217/0018 , H03K2217/96054
摘要： Over-voltage indicator and related circuit and method. The over-voltage indicator can work with an I/O circuit of a chip for detecting over-voltage in an I/O pad and providing an indication signal accordingly. When over-voltage does not happen, the over-voltage indicator continues to detect a signal level of the I/O pad and keeps the indication signal low. Once over-voltage is detected, the over-voltage indicator pauses detecting, asserts a high level in the indication signal, and periodically resumes detecting until end of over-voltage is detected. With informing provided by the indication signal, a core cell of the chip can perform proper operation to reduce potential damage caused by over-voltage.
摘要翻译：过电压指示器及相关电路及方法。过电压指示器可以与芯片的I / O电路一起工作，用于检测I / O焊盘中的过电压并相应地提供指示信号。当不发生过电压时，过电压指示器继续检测I / O焊盘的信号电平，并保持指示信号为低电平。一旦检测到过电压，则过电压指示器暂停检测，在指示信号中置高电平，并且周期性地恢复检测直到检测到过电压结束。通过指示信号提供的通知，芯片的核心单元可以执行正常的操作，以减少由过电压引起的潜在损害。

48. 发明申请

US20080246057A1 Silicon layer for stopping dislocation propagation 有权
标题翻译：用于阻止位错传播的硅层
公开(公告)号：US20080246057A1
公开(公告)日：2008-10-09
申请号：US11732889
申请日：2007-04-05
申请人： Hsien-Hsin Lin , Weng Chang , Chien-Chang Su , Kuan-Yu Chen , Hsueh-Chang Sung , Ming-Hua Yu
发明人： Hsien-Hsin Lin , Weng Chang , Chien-Chang Su , Kuan-Yu Chen , Hsueh-Chang Sung , Ming-Hua Yu
IPC分类号： H01L29/78
CPC分类号： H01L29/66477 , H01L21/02532 , H01L29/165 , H01L29/665 , H01L29/66628 , H01L29/66636 , H01L29/7848
摘要： A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.
摘要翻译：提供一种复合半导体结构及其形成方法。复合半导体结构包括第一含硅化合物层，其包含选自基本上由锗和碳组成的组的元素; 所述第一含硅化合物层上的硅层，其中所述硅层包含基本上纯的硅; 以及在所述硅层上包含所述元素的第二含硅化合物层。第一和第二含硅化合物层具有比硅层低的硅浓度。复合半导体结构可以形成为金属氧化物半导体（MOS）器件的源极/漏极区域。

49. 发明申请

US20080100540A1 ELECTROLUMINESCENT DISPLAY 有权
标题翻译：电致发光显示器
公开(公告)号：US20080100540A1
公开(公告)日：2008-05-01
申请号：US11750317
申请日：2007-05-17
申请人： Shi-Hao Li , Ching-Ian Chao , Jiun-Haw Lee , Mao-Kuo Wei , Hoang-Yan Lin , Kuan-Yu Chen , Yu-Hsuan Ho , Sheng-Chih Hsu
发明人： Shi-Hao Li , Ching-Ian Chao , Jiun-Haw Lee , Mao-Kuo Wei , Hoang-Yan Lin , Kuan-Yu Chen , Yu-Hsuan Ho , Sheng-Chih Hsu
IPC分类号： G09G3/30
CPC分类号： H01L51/5275
摘要： An electroluminescent display includes an electroluminescent panel, and at least one brightness enhanced film. The electroluminescent panel has a plurality of sub-pixels, and at least one illumination surface. The brightness enhanced film is disposed on the at least one illumination surface. The brightness enhanced film has a plurality of micro lenses, and the width of the micro lens is smaller than half of the minimum width of the sub-pixels.
摘要翻译：电致发光显示器包括电致发光面板和至少一个亮度增强膜。电致发光面板具有多个子像素和至少一个照明面。亮度增强膜设置在至少一个照明面上。亮度增强膜具有多个微透镜，微透镜的宽度小于子像素的最小宽度的一半。

50. 发明申请

US20070157187A1 Process of automatically translating an extended activity diagram into a hardware component graph 审中-公开
标题翻译：将扩展活动图自动转换为硬件组件图的过程
公开(公告)号：US20070157187A1
公开(公告)日：2007-07-05
申请号：US11471483
申请日：2006-06-21
申请人： Fu-Chiung Cheng , Shin-Hway Yu , Kuan-Yu Chen , Jian-Yi Chen , Ming-Shiou Chiang , Shu-Ming Chang , Hung-Chi Wu , Ping-Yun Wang
发明人： Fu-Chiung Cheng , Shin-Hway Yu , Kuan-Yu Chen , Jian-Yi Chen , Ming-Shiou Chiang , Shu-Ming Chang , Hung-Chi Wu , Ping-Yun Wang
IPC分类号： G06F9/45 , G06F9/44
CPC分类号： G06F8/10 , G06F17/5045
摘要： A process of automatically translating an extended activity diagram (EAD) into a hardware component graph (HCG). For translating the high level programming language into a Very High Speed Integrated Circuit Hardware Description Language (VHDL), the high level programming language is first translated into an activity diagram (AD), then the AD is translated into an HCG, which can indicate a connection relation between hardware components, and finally corresponding HDL codes are generated according to the HCG
摘要翻译：将扩展活动图（EAD）自动翻译成硬件组件图（HCG）的过程。为了将高级编程语言转换为超高速集成电路硬件描述语言（VHDL），首先将高级编程语言转换为活动图（AD），然后将AD转换为HCG，其可以指示硬件组件之间的连接关系，最后根据HCG生成相应的HDL代码

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