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    • 42. 发明授权
    • Reliability test method and circuit for non-volatile memory
    • 非易失性存储器的可靠性测试方法和电路
    • US06512710B1
    • 2003-01-28
    • US10004636
    • 2001-12-04
    • Wen-Jer TsaiLan Ting HuangNian-Kai ZousTa-Hui Wang
    • Wen-Jer TsaiLan Ting HuangNian-Kai ZousTa-Hui Wang
    • G11C700
    • G11C29/50016G11C8/08G11C16/04G11C29/50
    • A reliability test method for a non-volatile memory. A relation curve of gate voltage versus read current degradation rate is obtained. The read current degradation rate of an actual gate voltage is estimated. From the relation curve, an accelerated test gate voltage and a test time corresponding to the actual gate voltage are obtained. With the accelerated test gate voltage, the test is continuously performed within the test time. Afterward, a test result of the memory is then obtained and, by the result, it is judged whether the data is valid or not. If the data is right (retained), the memory can be guarantied to have an expected lifetime; if the data is wrong (lost), the memory is judged as fails to pass the lifetime test.
    • 用于非易失性存储器的可靠性测试方法。 获得栅极电压与读取电流退化率的关系曲线。 估计实际栅极电压的读取电流劣化率。 从关系曲线可以得到与实际栅极电压对应的加速测试栅极电压和测试时间。 加速测试门电压,测试在测试时间内连续进行。 然后,获得存储器的测试结果,并且通过结果判断数据是否有效。 如果数据正确(保留),则可以保证存储器具有预期的使用寿命; 如果数据错误(丢失),则存储器被判定为无法通过寿命测试。
    • 43. 发明授权
    • ROM for constraining 2nd-bit effect
    • ROM限制第二位效果
    • US09209316B2
    • 2015-12-08
    • US13421389
    • 2012-03-15
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • H01L27/115H01L29/792G11C11/56G11C16/04
    • H01L29/792G11C11/5621G11C16/0466H01L27/11521H01L27/11568
    • A read only memory including a substrate, a source region and a drain region, a charge storage structure, a gate, and a local extreme doping region is provided. The source region and the drain region are disposed in the substrate, the charge storage structure is located on the substrate between the source region and the drain region, and the gate is configured on the charge storage structure. The local extreme doping region is located in the substrate between the source region and the drain region and includes a low doping concentration region and at least one high doping concentration region. The high doping concentration region is disposed between the low doping concentration region and one of the source region and the drain region, and a doping concentration of the high doping concentration region is three times or more than three times a doping concentration of the low doping concentration region.
    • 提供了包括基板,源极区和漏极区,电荷存储结构,栅极和局部极化掺杂区域的只读存储器。 源极区域和漏极区域设置在衬底中,电荷存储结构位于源极区域和漏极区域之间的衬底上,并且栅极被配置在电荷存储结构上。 局部极掺杂区位于源区和漏区之间的衬底中,并且包括低掺杂浓度区和至少一个高掺杂浓度区。 高掺杂浓度区域设置在低掺杂浓度区域和源极区域和漏极区域之一中,并且高掺杂浓度区域的掺杂浓度是低掺杂浓度的掺杂浓度的三倍或更多倍 地区。
    • 44. 发明授权
    • Dynamic random access memory cell and manufacturing method thereof
    • 动态随机存取存储单元及其制造方法
    • US07754544B2
    • 2010-07-13
    • US12570147
    • 2009-09-30
    • Ta-Wei LinWen-Jer Tsai
    • Ta-Wei LinWen-Jer Tsai
    • H01L21/8242
    • H01L27/10802H01L21/84H01L27/10844H01L27/1203H01L29/7841
    • A dynamic random access memory cell and a manufacturing method thereof are provided. First, a substrate on which a bottom oxide layer and a semiconductor layer are formed is provided. The semiconductor layer is formed on the bottom oxide layer. Next, a gate is formed on the semiconductor layer. Then, the semiconductor layer is patterned to expose a portion of the bottom oxide layer. Afterwards, an insulation layer is formed at the side walls of the semiconductor layer, wherein the height of the insulation layer is shorter than that of the semiconductor layer, so that a gap is formed between the tops of the insulation layer and the semiconductor layer. Further, a doping layer covering the insulation layer and having the same height with the semiconductor layer is formed on the bottom oxide layer. The doping layer contacts the side walls of the semiconductor layer via the gap.
    • 提供了一种动态随机存取存储单元及其制造方法。 首先,提供形成有底部氧化物层和半导体层的基板。 半导体层形成在底部氧化物层上。 接下来,在半导体层上形成栅极。 然后,对半导体层进行图案化以暴露底部氧化物层的一部分。 之后,在半导体层的侧壁形成绝缘层,其中绝缘层的高度比半导体层的高度短,从而在绝缘层的顶部和半导体层之间形成间隙。 此外,在底部氧化物层上形成覆盖绝缘层并且与半导体层具有相同高度的掺杂层。 掺杂层经由间隙与半导体层的侧壁接触。
    • 45. 发明授权
    • Nonvolatile semiconductor memory and operating method of the memory
    • 非易失性半导体存储器和存储器的操作方法
    • US07031196B2
    • 2006-04-18
    • US10757073
    • 2004-01-14
    • Chih-Chieh YehWen-Jer TsaiTao-Cheng Lu
    • Chih-Chieh YehWen-Jer TsaiTao-Cheng Lu
    • G11C16/00
    • G11C16/0475G11C16/3468H01L21/28273H01L29/792H01L29/7923
    • A method of programming the memory cell comprises setting the memory cell to an initial state of a first gate threshold voltage, performing a processing sequence including: applying a voltage bias between the gate and the first junction region to cause electric hole to migrate towards and be retained in the trapping layer, and evaluating a read current generated in response to the voltage bias to determine whether a second gate threshold voltage is reached, wherein the second gate threshold voltage is lower than the first gate threshold voltage. The processing sequence is repeated a number of times by varying one or more time the voltage bias between the gate and the first junction region until the second gate threshold voltage is reached and the memory cell is in a program state.
    • 一种对存储器单元进行编程的方法包括将存储单元设置为第一栅极阈值电压的初始状态,执行处理顺序,包括:在栅极与第一结区域之间施加电压偏置,使电孔朝向 保持在捕获层中,并且评估响应于电压偏置产生的读取电流,以确定是否达到第二栅极阈值电压,其中第二栅极阈值电压低于第一栅极阈值电压。 通过改变栅极和第一结区域之间的电压偏压的一个或多个时间直到达到第二栅极阈值电压并且存储器单元处于编程状态来重复处理顺序多次。
    • 49. 发明授权
    • Qualification test method and circuit for a non-volatile memory
    • 用于非易失性存储器的资格测试方法和电路
    • US06563752B2
    • 2003-05-13
    • US09945289
    • 2001-08-30
    • Wen-Jer TsaiNian-Kai ZousTa-Hui Wang
    • Wen-Jer TsaiNian-Kai ZousTa-Hui Wang
    • G11C700
    • G11C29/50004G11C16/04G11C29/50
    • A qualification test method for a non-volatile memory includes determining a relation curve between the programming voltage and the lifetime of the memory cell. A programming voltage with respect to the memory array within the expected lifetime is estimated. According to the relation curve, the accelerating test voltage and the test time period corresponding to the programming voltage operated in the expected lifetime are computed out. The test is performed for the test time period under the accelerating test voltage. All the memory cells at the programmed state are tested to see if the original programmed state still remains. If the programmed state remains, the memory array is judged to have the life period. If the programmed state does not remain, the memory array is judged to have no the life period.
    • 用于非易失性存储器的资格测试方法包括确定编程电压与存储器单元的寿命之间的关系曲线。 估计在预期寿命期内相对于存储器阵列的编程电压。 根据该关系曲线计算加速试验电压和对应于在预期寿命中运行的编程电压的试验时间。 在加速测试电压下进行测试时间。 测试编程状态下的所有存储单元,以查看原始编程状态是否仍然保留。 如果编程状态保持不变,则判断存储器阵列具有使用寿命。 如果编程状态不存在,则判断存储器阵列没有寿命周期。