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    • 4. 发明申请
    • ROM FOR CONSTRAINING 2nd-BIT EFFECT
    • 用于约束第二位影响的ROM
    • US20130240975A1
    • 2013-09-19
    • US13421389
    • 2012-03-15
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • H01L29/792
    • H01L29/792G11C11/5621G11C16/0466H01L27/11521H01L27/11568
    • A read only memory including a substrate, a source region and a drain region, a charge storage structure, a gate, and a local extreme doping region is provided. The source region and the drain region are disposed in the substrate, the charge storage structure is located on the substrate between the source region and the drain region, and the gate is configured on the charge storage structure. The local extreme doping region is located in the substrate between the source region and the drain region and includes a low doping concentration region and at least one high doping concentration region. The high doping concentration region is disposed between the low doping concentration region and one of the source region and the drain region, and a doping concentration of the high doping concentration region is three times or more than three times a doping concentration of the low doping concentration region.
    • 提供了包括基板,源极区和漏极区,电荷存储结构,栅极和局部极化掺杂区域的只读存储器。 源极区域和漏极区域设置在衬底中,电荷存储结构位于源极区域和漏极区域之间的衬底上,并且栅极被配置在电荷存储结构上。 局部极掺杂区位于源区和漏区之间的衬底中,并且包括低掺杂浓度区和至少一个高掺杂浓度区。 高掺杂浓度区域设置在低掺杂浓度区域和源极区域和漏极区域之一中,并且高掺杂浓度区域的掺杂浓度是低掺杂浓度的掺杂浓度的三倍或更多倍 地区。
    • 6. 发明授权
    • ROM for constraining 2nd-bit effect
    • ROM限制第二位效果
    • US09209316B2
    • 2015-12-08
    • US13421389
    • 2012-03-15
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • Chih-Chieh ChengCheng-Hsien ChengWen-Jer Tsai
    • H01L27/115H01L29/792G11C11/56G11C16/04
    • H01L29/792G11C11/5621G11C16/0466H01L27/11521H01L27/11568
    • A read only memory including a substrate, a source region and a drain region, a charge storage structure, a gate, and a local extreme doping region is provided. The source region and the drain region are disposed in the substrate, the charge storage structure is located on the substrate between the source region and the drain region, and the gate is configured on the charge storage structure. The local extreme doping region is located in the substrate between the source region and the drain region and includes a low doping concentration region and at least one high doping concentration region. The high doping concentration region is disposed between the low doping concentration region and one of the source region and the drain region, and a doping concentration of the high doping concentration region is three times or more than three times a doping concentration of the low doping concentration region.
    • 提供了包括基板,源极区和漏极区,电荷存储结构,栅极和局部极化掺杂区域的只读存储器。 源极区域和漏极区域设置在衬底中,电荷存储结构位于源极区域和漏极区域之间的衬底上,并且栅极被配置在电荷存储结构上。 局部极掺杂区位于源区和漏区之间的衬底中,并且包括低掺杂浓度区和至少一个高掺杂浓度区。 高掺杂浓度区域设置在低掺杂浓度区域和源极区域和漏极区域之一中,并且高掺杂浓度区域的掺杂浓度是低掺杂浓度的掺杂浓度的三倍或更多倍 地区。