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41. 发明授权

US5168383A Liquid crystal device with Fabry-Perot etalon 失效
标题翻译：液晶水晶装置，具有手工制作的ETALON
公开(公告)号：US5168383A
公开(公告)日：1992-12-01
申请号：US443717
申请日：1989-11-29
申请人： Tadao Iwaki , Hiroshi Kuroda , Junko Yamanaka
发明人： Tadao Iwaki , Hiroshi Kuroda , Junko Yamanaka
IPC分类号： C09K19/46 , G02F1/1335 , G02F1/1339 , G02F1/1343 , G02F1/139 , G02F1/141 , G02F1/21
CPC分类号： G02F1/133553 , C09K19/46 , G02F1/13394 , G02F1/134336 , G02F1/216 , G02F1/13392 , G02F1/1396 , G02F1/141
摘要： The liquid crystal device has a pair of flat glass substrates, a pair of dielectric multilayer film mirror, a plurality of transparent electrodes arranged in a matrix, a plurality of minute insulating films formed on inner face of the glass substrates, and a liquid crystal layer. A pair of dielectric multilayer film mirror constitute a Fabry-Perot etalon via the liquid crystal layer and enhance a contrast ratio. The minute insulating films are formed by physical vapor deposition and attain a uniform thickness, so that a liquid crystal device having a uniform cell gap is obtained.

42. 发明授权

US4961823A Method of manufacturing calcium carbonate single crystal 失效
标题翻译：碳酸钙单晶的制造方法
公开(公告)号：US4961823A
公开(公告)日：1990-10-09
申请号：US146294
申请日：1988-01-20
申请人： Shinichi Hirano , Ryo Toyokuni , Hiroshi Kuroda
发明人： Shinichi Hirano , Ryo Toyokuni , Hiroshi Kuroda
IPC分类号： C30B7/00
CPC分类号： C30B7/00 , C30B29/10 , C30B7/005
摘要： A starting material composed of calcium carbonate is dissolved in a nitrate aqueous solution containing either Ca(NO.sub.3).sub.2 or NH.sub.4 NO.sub.3 under application of heat and pressure. The starting material is hydrothermally synthesized within the nitrate aqueous solution to effect the rapid growth of calcium carbonate single crystal.
摘要翻译：碳酸钙组成的原料在热和压力的作用下溶解于含有Ca（NO 3）2或NH 4 NO 3的硝酸盐水溶液中。将原料在硝酸盐水溶液中水热合成，以实现碳酸钙单晶的快速生长。

43. 发明授权

US4784717A Method of manufacturing BaPb.sub.1 失效
标题翻译：制备BaPb1的方法
公开(公告)号：US4784717A
公开(公告)日：1988-11-15
申请号：US33454
申请日：1987-04-01
申请人： Shinichi Hirano , Ryo Toyokuni , Hiroshi Kuroda
发明人： Shinichi Hirano , Ryo Toyokuni , Hiroshi Kuroda
IPC分类号： C30B7/10 , C30B7/00 , C30B29/22
CPC分类号： C30B29/22 , C30B7/00 , C30B7/005 , Y10S117/918 , Y10S505/729 , Y10T117/1096
摘要： A method of manufacturing BaPb.sub.1-x Bi.sub.x O.sub.3 single crystal wherein the BaPb.sub.1-x Bi.sub.x O.sub.3 single crystal is grown by hydrothermal synthesis which applies heat and pressure to a nutrient composed of BaPb.sub.1-x Bi.sub.x O.sub.3 within a nitrate aqueous solution, such as LINO.sub.3, KNO.sub.3 and NaNO.sub.3 aqueous solutions.

44. 发明授权

US4389732A Tuning device for radio receiver 失效
标题翻译：无线电接收机调谐装置
公开(公告)号：US4389732A
公开(公告)日：1983-06-21
申请号：US193111
申请日：1980-10-02
申请人： Yasumasa Sasahara , Hiroshi Kuroda
发明人： Yasumasa Sasahara , Hiroshi Kuroda
IPC分类号： H03J1/18 , H03J7/06 , H03J7/16 , H04B1/16 , H03J7/30
CPC分类号： H03J1/18 , H03J7/06 , H03J7/16
摘要： A tuning device for a radio receiver comprises a manual tuning system to manually drive a variable capacitor and an automatic tuning system to drive the same by a motor, wherein the mechanism for transmitting a motive force of a manipulated tuning knob to the variable capacitor in the manual tuning mode is arranged in a mechanically independent relation with a motive force transmitting mechanism provided by a motor in the automatic tuning mode, and the selection of either one of the two transmitting mechanisms is effected by a clutch mechanism whose connection of either one of the two transmitting mechanisms to the variable capacitor is changed over by a touch switch electrically connected to the tuning knob of the receiver.
摘要翻译：用于无线电接收机的调谐装置包括手动驱动可变电容器的手动调谐系统和通过电动机驱动其的自动调谐系统，其中用于将操纵的调谐旋钮的动力传递到可变电容器的可变电容器的机构手动调谐模式以与自动调谐模式中的电动机提供的动力传递机构以机械独立的关系布置，并且两个传动机构中的任一个的选择由离合器机构实现，离合器机构的连接通过电连接到接收器的调谐旋钮的触摸开关切换到可变电容器的两个发送机构。

45. 发明授权

US4094286A Internal combustion engine and method of reducing toxic compounds in the exhaust gases therefrom 失效
标题翻译：内燃机及其排放气体中有毒化合物的还原方法
公开(公告)号：US4094286A
公开(公告)日：1978-06-13
申请号：US717408
申请日：1976-08-24
申请人： Hiroshi Kuroda , Yasuo Nakajima , Yoshimasa Hayashi , Shin-ichi Nagumo
发明人： Hiroshi Kuroda , Yasuo Nakajima , Yoshimasa Hayashi , Shin-ichi Nagumo
IPC分类号： F02B1/04 , F02B23/08 , F02M25/07 , F02M25/06
CPC分类号： F02B23/08 , F02M26/15 , F02M26/39 , F02M26/42 , F02M26/56 , F02B1/04 , F02M26/21 , Y02T10/125
摘要： A multiple-cylinder spark-ignition internal combustion engine for an automotive vehicle, in which the ratio of the inactive compounds in the mixture gases produced in each combustion chamber to the fuel component in the combustible mixture inducted into the chamber is maintained within a predetermined range and the spark plug for each engine cylinder is arranged so that the flame travel from the spark plug is reduced to a minimum for promoting the combustion reaction to proceed in the least possible time. Improvements are further made in respect of the exhaust gas recirculation rate, the location and measurements of the spark plug, the configurations and measurements of the engine cylinder and the arrangement of the intake and exhaust ports so as to reduce the concentrations of toxic compounds in the exhaust gases without impairing the performance efficiency of the engine.
摘要翻译：一种用于机动车辆的多缸火花点火内燃机，其中在每个燃烧室中产生的混合气体中的无活性化合物与引入室中的可燃混合物中的燃料组分的比率保持在预定范围内并且每个发动机气缸的火花塞被布置成使得来自火花塞的火焰传播减少到最小，以促进燃烧反应在最短的时间内进行。进一步对废气再循环率，火花塞的位置和测量值，发动机气缸的结构和尺寸以及进气和排气口的布置进行改进，以便降低有毒化合物的浓度排气而不损害发动机的性能效率。

46. 发明授权

US07777347B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07777347B2
公开(公告)日：2010-08-17
申请号：US11756941
申请日：2007-06-01
申请人： Hiroshi Kuroda
发明人： Hiroshi Kuroda
IPC分类号： H01L23/52
CPC分类号： H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06575 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A first semiconductor chip, a spacer of plane shape, and a second semiconductor chip are put on a module substrate, sequentially. These semiconductor chips have a relation that every side of the first semiconductor chip is shorter than the first side and the second side of the second semiconductor chip, and longer than the third side and the fourth side of the second semiconductor chip. The border of the spacer is parallel to the third side and the fourth side and is placed inside the border of the first semiconductor chip. Even if the second electrode pad of the second semiconductor chip approaches the border of the first semiconductor chip, since a spacer secures space between the border portion of the first semiconductor chip and the second semiconductor chip, the wire combined with the second electrode pad does not contact the first semiconductor chip.
摘要翻译：依次将第一半导体芯片，平面形状的间隔物和第二半导体芯片放置在模块基板上。这些半导体芯片具有这样的关系：第一半导体芯片的每侧比第二半导体芯片的第一侧和第二侧短，并且比第二半导体芯片的第三侧和第四侧长。间隔件的边界平行于第三侧和第四侧，并且被放置在第一半导体芯片的边界内。即使第二半导体芯片的第二电极焊盘接近第一半导体芯片的边界，由于间隔物固定第一半导体芯片的边界部分和第二半导体芯片之间的空间，所以与第二电极焊盘组合的导线不接触第一个半导体芯片。

47. 发明授权

US07745921B2 Multi-chip semiconductor device 失效
标题翻译：多芯片半导体器件
公开(公告)号：US07745921B2
公开(公告)日：2010-06-29
申请号：US12264970
申请日：2008-11-05
申请人： Kazuhiko Hiranuma , Hiroshi Kuroda , Yoshiyuki Abe
发明人： Kazuhiko Hiranuma , Hiroshi Kuroda , Yoshiyuki Abe
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L23/498 , H01L23/49838 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14634 , H01L2224/05553 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2224/85444 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes semiconductor chips differing in withstand voltage or in noise immunity, such as a multi-chip module. The semiconductor device includes first and second semiconductor chips mounted over a package substrate which has bonding pads arranged along the edges. The first semiconductor chip includes bonding pads for analog signals, and the second semiconductor chip includes bonding pads for high-voltage signals. The edges along which the bonding pads for analog signals are arranged and the edges along which the bonding pads for high-voltage signals are arranged are disposed along mutually different edges of the package substrate. Adjoining of electrodes or wirings for high voltage signals and those for analog signals over the package substrate can be easily avoided, and SI deterioration can be thereby restrained.
摘要翻译：半导体器件包括不同于耐电压或抗噪声的诸如多芯片模块的半导体芯片。半导体器件包括安装在封装衬底上的第一和第二半导体芯片，该封装衬底具有沿边缘布置的焊盘。第一半导体芯片包括用于模拟信号的接合焊盘，第二半导体芯片包括用于高电压信号的焊盘。布置用于模拟信号的接合焊盘的边缘以及布置有用于高电压信号的接合焊盘的边缘沿着封装衬底的相互不同的边缘设置。可以容易地避免用于高电压信号的电极或布线与封装基板上的模拟信号的连接，从而可以抑制SI劣化。

48. 发明授权

US07259711B2 Vehicle control apparatus 有权
标题翻译：车辆控制装置
公开(公告)号：US07259711B2
公开(公告)日：2007-08-21
申请号：US10739223
申请日：2003-12-19
申请人： Fumihiko Okai , Hiroshi Kuroda
发明人： Fumihiko Okai , Hiroshi Kuroda
IPC分类号： G01S13/93 , G01S7/40 , G01S13/00
CPC分类号： G01S13/931 , B60W30/09 , B60W2050/143 , G01S7/40 , G01S7/411 , G01S7/412 , G01S2013/9321 , G01S2013/9346 , G01S2013/935 , G01S2013/9353
摘要： A vehicle control apparatus includes an obstruction detection unit for measuring a headway distance until an obstruction existing ahead of the vehicle by means of a radar device, a unit for performing vehicle control or alarm control on the basis of the headway distance, a unit for detecting detection performance of the obstruction detection means in a vehicle in which the obstruction detection unit is used to perform two or more controls containing the vehicle control or alarm control, and a unit for controlling to stop operation of the vehicle control or alarm control in accordance with the detection performance individually.
摘要翻译：车辆控制装置包括障碍物检测单元，用于通过雷达装置，用于根据前进距离进行车辆控制或报警控制的单元来测量前方车辆前方的障碍物的前进距离，检测单元其中障碍物检测单元用于执行包含车辆控制或报警控制的两个或多个控制的车辆中的障碍物检测装置的检测性能，以及用于控制停止车辆控制或报警控制的操作的单元检测性能分别。

49. 发明授权

US07138950B2 Antenna and electronic equipment using the same 有权
标题翻译：天线和电子设备使用相同
公开(公告)号：US07138950B2
公开(公告)日：2006-11-21
申请号：US10689845
申请日：2003-10-22
申请人： Susumu Fukushima , Hideki Nanba , Hiroshi Kuroda
发明人： Susumu Fukushima , Hideki Nanba , Hiroshi Kuroda
IPC分类号： H01Q1/24
CPC分类号： H01Q21/24 , H01Q1/24 , H01Q5/364 , H01Q9/0407 , H01Q21/065
摘要： The objective of the present invention is to realize, in an antenna and an electronic equipment using the same, miniaturization of that antenna. To achieve said objective, an antenna electrode (19) is provided on the surface of the main body (18), a grounding electrode (20) is provided on the back face, and a signal electrode (21) is provided on the circumferential face, the antenna electrode (19) being different in length at the X axis from the Y axis. This enables to construct a broad-band antenna with a single piece of antenna, contributing to miniaturization of the antenna.
摘要翻译：本发明的目的是在天线和使用该天线的电子设备中实现该天线的小型化。为了实现所述目的，在主体（18）的表面上设置有天线电极（19），在背面设置有接地电极（20），在周面上设置有信号电极，所述天线电极（19）的X轴与Y轴的长度不同。这使得能够构造具有单片天线的宽带天线，有助于天线的小型化。

50. 发明申请

US20060220673A1 Semiconductor device and an image sensing device 失效
标题翻译：半导体器件和图像感测器件
公开(公告)号：US20060220673A1
公开(公告)日：2006-10-05
申请号：US11392730
申请日：2006-03-30
申请人： Kazuhiko Hiranuma , Hiroshi Kuroda , Yoshiyuki Abe
发明人： Kazuhiko Hiranuma , Hiroshi Kuroda , Yoshiyuki Abe
IPC分类号： H03K17/16
CPC分类号： H01L27/14618 , H01L23/498 , H01L23/49838 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14634 , H01L2224/05553 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2224/85444 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： SI in a semiconductor device in which a plurality of semiconductor chips differing in withstand voltage or in noise immunity, such as a multi-chip module, is to be improved. The semiconductor device comprises a first semiconductor chip and a second semiconductor chip mounted over a package substrate which has a plurality of bonding pads arranged along the edges. The first semiconductor chip has a plurality of bonding pads for analog signals, and the second semiconductor chip has a plurality of bonding pads for high-voltage signals. The edges along which the bonding pads for analog signals are arranged and the edges along which the bonding pads for high-voltage signals are arranged are disposed along mutually different edges of the package substrate. Adjoining of electrodes or wirings for high voltage signals and those for analog signals over the package substrate can be easily avoided, and SI deterioration can be thereby restrained.
摘要翻译：要提高其中诸如多芯片模块之类的耐电压或抗噪声能力不同的多个半导体芯片的半导体器件中的SI。半导体器件包括安装在封装衬底上的第一半导体芯片和第二半导体芯片，该封装衬底具有沿着边缘布置的多个焊盘。第一半导体芯片具有用于模拟信号的多个接合焊盘，第二半导体芯片具有用于高电压信号的多个焊盘。布置用于模拟信号的接合焊盘的边缘以及布置有用于高电压信号的接合焊盘的边缘沿着封装衬底的相互不同的边缘设置。可以容易地避免用于高电压信号的电极或布线与封装基板上的模拟信号的连接，从而可以抑制SI劣化。

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