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    • 45. 发明授权
    • Magnetic device having multi-layer with insulating and conductive layers
    • 具有多层绝缘导电层的磁性器件
    • US5768181A
    • 1998-06-16
    • US834968
    • 1997-04-07
    • Theodore ZhuSaied N. Tehrani
    • Theodore ZhuSaied N. Tehrani
    • G11C11/15G11C11/56G11C7/00
    • G11C11/15G11C11/5607G11C2211/5615
    • A magnetic device (40) having multi-layer (41-45) with insulating layer (45) and conductive layer (42). The conductive layer (42) is positioned between a first magnetic layer (41) and a third magnetic layer (44). The insulating layer (45) is positioned between a second magnetic layer (43) and the third magnetic layer (44), and which forms a tunnel junction between the second and third layers. Magnetic vectors in the first magnetic layer (41) magnetically couple with ones in the second magnetic layer (43) so that the magnetic coupling loop formed around the third magnetic layer (44) allows magnetic vectors in the third magnetic layer (44) to be switchable in a low magnetic field. Consequently, total power consumption of the magnetic device (60) decreases.
    • 具有绝缘层(45)和导电层(42)的具有多层(41-45)的磁性装置(40)。 导电层(42)位于第一磁性层(41)和第三磁性层(44)之间。 绝缘层(45)位于第二磁性层(43)和第三磁性层(44)之间,并且在第二层和第三层之间形成隧道结。 第一磁性层(41)中的磁矢量与第二磁性层(43)中的磁性磁耦合,使得围绕第三磁性层(44)形成的磁耦合环允许第三磁性层(44)中的磁矢量为 可在低磁场中切换。 因此,磁性装置(60)的总功耗降低。
    • 49. 发明授权
    • Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
    • 制造用于磁阻随机存取存储器的磁通集中层的方法
    • US06211090B1
    • 2001-04-03
    • US09528971
    • 2000-03-21
    • Mark DurlamEugene Youjun ChenSaied N. TehraniJon Michael SlaughterGloria KerszykowskiKelly Wayne Kyler
    • Mark DurlamEugene Youjun ChenSaied N. TehraniJon Michael SlaughterGloria KerszykowskiKelly Wayne Kyler
    • H01L2100
    • H01L27/222B82Y10/00
    • A method of fabricating a flux concentrator for use in magnetic memory devices including the steps of providing at least one magnetic memory bit (10) and forming proximate thereto a material stack defining a copper (Cu) damascene bit line (56) including a flux concentrating layer (52). The method includes the steps of depositing a bottom dielectric layer (32), an optional etch stop (34) layer, and a top dielectric layer (36) proximate the magnetic memory bit (10). A trench (38) is etched in the top dielectric layer (36) and the bottom dielectric layer (32). A first barrier layer (42) is deposited in the trench (38). Next, a metal system (29) is deposited on a surface of the first barrier layer (42). The metal system (29) includes a copper (Cu) seed material (44), and a plated copper (Cu) material (46), a first outside barrier layer (50), a flux concentrating layer (52), and a second outside barrier layer (54). The metal system (29) is patterned and etched to define a copper (Cu) damascene bit line (56).
    • 一种制造用于磁存储器件的通量集中器的方法,包括以下步骤:提供至少一个磁存储器位(10),并在其附近形成限定铜(Cu)镶嵌位线(56)的材料堆,所述铜(Cu)镶嵌位线包括通量集中 层(52)。 该方法包括以下步骤:沉积底部电介质层(32),可选的蚀刻停止层(34)层和靠近磁存储器位(10)的顶部电介质层(36)。 在顶部电介质层(36)和底部电介质层(32)中蚀刻沟槽(38)。 第一阻挡层(42)沉积在沟槽(38)中。 接下来,金属系统(29)沉积在第一阻挡层(42)的表面上。 金属系统(29)包括铜(Cu)种子材料(44)和镀铜(Cu)材料(46),第一外部阻挡层(50),集流层(52)和第二 外部阻挡层(54)。 金属系统(29)被图案化和蚀刻以限定铜(Cu)镶嵌位线(56)。