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    • 48. 发明申请
    • TEST APPARATUS AND METHOD
    • 测试装置和方法
    • US20050287044A1
    • 2005-12-29
    • US10710183
    • 2004-06-24
    • Govindarajan Natarajan
    • Govindarajan Natarajan
    • B01L3/00
    • B01L3/50273B01L3/5025B01L3/502707B01L2400/0406B01L2400/0688
    • An apparatus and method is described for testing interactions between multiple reagents or components by means of a flow distribution body configured to have a three-dimensional network of conduits including feed holes for dispensing fluid, connected to a capillary channel bounded on at least one surface by a receiving surface, which in turn is connected to capillary flow promotion chimneys. The receiving surface may be a surface of a detachable receiving plate. Each feed hole is configured to terminate at a capillary flow control means at the intersection of the capillary channel to the feed hole. A uniform layer of reagent is formed or deposited on the receiving surface along the capillary channel. The feed hole, capillary channel and capillary flow promotion chimneys are configured so that when fluid is dispensed into the feed hole, capillary forces promote continuous flow of fluid along the capillary channel from the feed hole to the flow promotion chimneys until the trailing meniscus of the fluid in the feed hole stops at the capillary flow control means.
    • 描述了一种用于测试多个试剂或组分之间的相互作用的装置和方法,所述流动分布主体被配置成具有三维网络的导管,所述导管的三维网络包括用于分配流体的进料孔,其连接到通过限定在至少一个表面上的毛细管通道 接收表面又连接到毛细管流动促进烟囱。 接收表面可以是可拆卸接收板的表面。 每个进料孔构造成在毛细管通道与进料孔交叉处的毛细管流动控制装置处终止。 沿着毛细通道在接收表面上形成或沉积均匀的试剂层。 进料孔,毛细管通道和毛细管流动促进烟囱被构造成使得当流体被分配到进料孔中时,毛细管力促使流体沿着毛细管通道从进料孔到流动促进烟囱的连续流动,直到尾部弯液面 进料孔中的流体在毛细管流动控制装置处停止。
    • 49. 发明授权
    • Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
    • 使用可热解聚表面层形成无缺陷陶瓷结构的方法
    • US06261927B1
    • 2001-07-17
    • US09302943
    • 1999-04-30
    • Govindarajan NatarajanRichard F. IndykVincent P. PetersonKrishna G. Sachdev
    • Govindarajan NatarajanRichard F. IndykVincent P. PetersonKrishna G. Sachdev
    • H01L2130
    • H01L21/481H01L23/49894H01L2924/0002H01L2924/09701H01L2924/12044Y10S438/976H01L2924/00
    • This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.
    • 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地,本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说,本发明包括一种制造半导体衬底的方法,其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法,其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后,由于在烧结过程中挥发物质的热解聚和燃烧,因此可方便且清洁地除去热可分解/可分解的膜,从而提供无表面缺陷的陶瓷基材。