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    • 42. 发明授权
    • Apparatus and method for implementing precise sensing of PCRAM devices
    • 实现PCRAM设备精确检测的装置和方法
    • US07535783B2
    • 2009-05-19
    • US11865134
    • 2007-10-01
    • John K. DeBrosseThomas M. MaffittMark C. H. Lamorey
    • John K. DeBrosseThomas M. MaffittMark C. H. Lamorey
    • G11C7/02
    • G11C29/02G11C7/062G11C7/067G11C13/0004G11C13/004G11C29/026G11C29/028G11C2013/0054
    • A precision sense amplifier apparatus includes a current source configured to introduce an adjustable reference current through a reference leg; a current mirror configured to mirror the reference current to a data leg, the data leg selectively coupled to a programmable resistance memory element; an active clamping device coupled to the data leg, and configured to clamp a fixed voltage across the memory element, thereby establishing a fixed current sinking capability thereof; and a differential sense amplifier having a first input thereof coupled to the data leg and a second input thereof coupled to the reference leg; wherein an output of the differential sense amplifier assumes a first logic state whenever the reference current is less than the fixed current sinking capability of the memory element, and assumes a second logic state whenever the reference current exceeds the fixed current sinking capability.
    • 精密读出放大器装置包括:电流源,被配置为通过参考支路引入可调参考电流; 配置为将参考电流镜像到数据支路的电流镜,所述数据支路选择性地耦合到可编程电阻存储元件; 耦合到所述数据支脚的有源钳位装置,并且被配置为在所述存储元件上钳位固定电压,由此建立其固定的电流吸收能力; 以及差分读出放大器,其具有耦合到所述数据支路的第一输入端和耦合到所述基准支路的第二输入端; 其中每当所述参考电流小于所述存储元件的固定电流吸收能力时,所述差分读出放大器的输出呈现第一逻辑状态,并且每当所述参考电流超过所述固定电流吸收能力时,所述差分读出放大器的输出呈现第二逻辑状态。
    • 43. 发明授权
    • Method and apparatus for initializing reference cells of a toggle switched MRAM device
    • 用于初始化切换切换MRAM设备的参考单元的方法和装置
    • US07453740B2
    • 2008-11-18
    • US11624707
    • 2007-01-19
    • John K. DeBrosseMark C. H. Lamorey
    • John K. DeBrosseMark C. H. Lamorey
    • G11C7/06
    • G11C7/14G11C11/16G11C2207/2254
    • A method of determining an initial state of a reference cell in a fabricated memory array includes performing a first read operation of the reference cell by comparing current through the reference cell with the average current passing through a pair of data cells, and storing the result of the first read operation; inverting the value of one of the pair of the data cells; performing a second read operation of the reference cell, and storing the result of the second read operation; inverting the value of the other of the pair of the data cells; performing a third read operation of the reference cell, and storing the result of the third read operation. A majority compare operation of the results of the first, second and third operations is performed, wherein the result of the majority compare operation is the initial state of the reference cell.
    • 确定制造的存储器阵列中的参考单元的初始状态的方法包括通过将通过参考单元的电流与通过一对数据单元的平均电流进行比较来执行参考单元的第一读取操作,并且存储 第一次读取操作; 反转一对数据单元之一的值; 执行参考单元的第二读取操作,并存储第二读取操作的结果; 反转一对数据单元中的另一个的值; 执行参考单元的第三读取操作,并存储第三读取操作的结果。 执行第一,第二和第三操作的结果的多数比较操作,其中多数比较操作的结果是参考单元的初始状态。
    • 46. 发明授权
    • Layout impact reduction with angled phase shapes
    • 具有角度相位形状的布局冲击减少
    • US07135255B2
    • 2006-11-14
    • US10249317
    • 2003-03-31
    • Scott J. BukofskyJohn K. DeBrosseMarco HugLars W. LiebmannDaniel J. NickelJuergen Preuninger
    • Scott J. BukofskyJohn K. DeBrosseMarco HugLars W. LiebmannDaniel J. NickelJuergen Preuninger
    • G01F9/00
    • G03F1/30
    • A phase shift mask shape that reduces line-end shortening at the critical feature without changing layout size increases required of requisite phase shift rules. The phase feature is given an angled extension, which includes the lithographic shortening value. This allows the critical shape to be designed much closer to the reference layer then it could without the angled extension feature. Phase mask extension features beyond a given device segment are significantly reduced by lengthening the feature along an uncritical portion; moving the feature reference point to the device layer; and flattening the phase extension feature into an L-shape or T-shape along the uncritical parts of a device segment. Applying these design rules allows a draw of the gate conductor under current conditions and puts phase shapes inside without extending the gate conductor dimensions to the next feature.
    • 减少关键特征而不改变布局尺寸的线端缩短的相移掩模形状增加了所需的相移规则。 相位特征给出一个有角度的延伸,其包括光刻缩短值。 这允许将临界形状设计得更接近参考层,然后它可以没有成角度的延伸特征。 通过沿着非临界部分延长特征,显着减少了给定装置段之外的相位掩模延伸特征; 将特征参考点移动到设备层; 并且将相延伸特征沿着装置段的非关键部分平坦化为L形或T形。 应用这些设计规则允许在当前条件下绘制栅极导体,并将相位形状置于内部,而不会将栅极导体尺寸延伸到下一个特征。
    • 48. 发明授权
    • Method and apparatus for redundancy word line replacement in a
repairable semiconductor memory device
    • 用于可修复半导体存储器件中冗余字线替换的方法和装置
    • US5963489A
    • 1999-10-05
    • US47086
    • 1998-03-24
    • Toshiaki KirihataJohn K. DeBrosseYohji WatanabeHing Wong
    • Toshiaki KirihataJohn K. DeBrosseYohji WatanabeHing Wong
    • G11C29/04G11C29/00G11C7/00
    • G11C29/806G11C29/848
    • A method and apparatus for repairing a semiconductor memory device. A row redundancy replacement arrangement is provided to repair the memory device consisting of a first plurality of redundant true word lines and a second plurality of redundant complement word lines to simultaneously replace the same first number of first normal word lines and the same second number of the normal complement word lines. An address reordering scheme, preferably implemented as a word line selector circuit and controlled by redundancy control logic and address inputs, allows the redundant true (complement) word lines to replace the normal true (complement) word lines when making the repair. The redundancy replacement arrangement ensures that consistency of the bit map is maintained at all times, irrespective whether the memory device operates in a normal or in a redundancy mode. This approach introduces an added flexibility of incorporating the redundancy replacement without affecting the column access speed.
    • 一种用于修复半导体存储器件的方法和装置。 提供行冗余替换布置以修复由第一多个冗余真字字线和第二多个冗余补码字线组成的存储器件,以同时替换相同的第一数量的第一正常字线和相同的第二数目的第 正常补码字线。 地址重排序方案优选地实现为字线选择器电路并由冗余控制逻辑和地址输入控制,允许冗余的真(补)字线在进行修复时替换正常的真(补)字线。 冗余替换布置确保始终保持位图的一致性,而不管存储器件是以正常操作还是以冗余模式操作。 这种方法引入了增加冗余替换的灵活性,而不影响列访问速度。
    • 49. 发明授权
    • Method of making buried strap trench cell yielding an extended transistor
    • 制造扩展晶体管的掩埋带沟槽电池的方法
    • US5614431A
    • 1997-03-25
    • US575311
    • 1995-12-20
    • John K. DeBrosse
    • John K. DeBrosse
    • H01L27/108H01L21/8242
    • H01L27/10861Y10S257/907
    • A process sequence, cell structure, and cell layout for an eight square folded bit line dynamic random access memory (DRAM) cell allows a transfer device channel length of two lithographic features. The process sequence may allow elimination of deep trench collar or cap deposition, or reduction of word line to word line capacitance. The cell prepared by the method allows a two lithographic feature transfer device channel length in an eight square folded bit line DRAM cell. The method uses conventional processing techniques with no spacer defined features and uses conventional structures. The cell requires only one additional mask (GPC) and minimal additional processing. The process sequence starts with deep trench (DT) processing, followed by deposition of SiO.sub.2, planarization and pad strip. Then gate SiO.sub.2, polysilicon, and pad are deposited. The structure is etched using a shallow trench isolation mask and filled with SiO.sub.2. After planarization, a thin insulator is deposited and the structure is etched again with a Gate Poly Contact mask. A gate conductor is then deposited. After a final etch, wiring is added.
    • 用于八平方折叠位线动态随机存取存储器(DRAM)单元的处理顺序,单元结构和单元布局允许两个光刻特征的传输设备通道长度。 处理顺序可以允许消除深沟槽环或帽沉积,或者将字线减小到字线电容。 通过该方法制备的电池允许在八个方形折叠的位线DRAM单元中的两个光刻特征传输器件沟道长度。 该方法使用没有间隔物限定特征的常规加工技术,并且使用常规结构。 电池只需要一个额外的掩模(GPC)和最少的附加处理。 工艺顺序从深沟(DT)处理开始,随后沉积SiO 2,平面化和焊盘条。 然后沉积栅极SiO2,多晶硅和焊盘。 使用浅沟槽隔离掩模蚀刻该结构并填充SiO 2。 在平坦化之后,沉积薄的绝缘体,并且用Gate Poly接触掩模再次蚀刻该结构。 然后沉积栅极导体。 最终蚀刻后,加入接线。