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    • 44. 发明申请
    • Load lock and load lock chamber using the same
    • 使用相同的负载锁和负载锁定室
    • US20050129489A1
    • 2005-06-16
    • US10987600
    • 2004-11-12
    • Yong QuanBu KoJae Choi
    • Yong QuanBu KoJae Choi
    • B65G1/00B65G49/05G03F7/00H01L21/677H01L21/68
    • H01L21/67748H01L21/67739H01L21/67751
    • Disclosed herein is a load lock to be on standby after loading a plurality of substrates in cooperation with a transfer means adapted to transfer the substrates from process chambers in turn. The present invention provides the load lock which increases the transfer rate thereof to efficiently transfer the substrates to the process chambers or the exterior, and a load lock chamber using the load lock. According to the present invention, the load lock includes a plurality of substrate support panels which support the substrates thereon, are movable vertically, and are spaced apart from each other by a distance that is greater than the thickness of the substrate, and drive units for vertically moving at least one of the substrate support panels.
    • 本文公开了一种负载锁定,其在与适于从处理室依次传送基板的转印装置协作装载多个基板之后待处理。 本发明提供了一种增加其传送速率以有效地将基板传送到处理室或外部的装载锁和使用该装载锁的装载锁定室。 根据本发明,负载锁定包括多个基板支撑板,其支撑其上的基板,可垂直移动,并且彼此间隔开大于基板的厚度的距离,以及用于 垂直移动至少一个基板支撑板。
    • 46. 发明授权
    • Non-destructive thermal conductivity detection of solder voids
    • 焊料空隙的非破坏性热导率检测
    • US08376209B2
    • 2013-02-19
    • US12779848
    • 2010-05-13
    • Jae ChoiMark D. Woolley
    • Jae ChoiMark D. Woolley
    • B23K31/12G01N25/00G01N25/72
    • G01R31/048G01R31/311
    • Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.
    • 系统和方法可以产生在电路板上安装热增强集成电路(IC)的热图像。 该系统包括热成像相机,其可操作以将通过散热器的散热和/或传导成像到基板上的安装焊盘。 在测试热增强IC时,衬底或IC连接到电源,并且IC被操作以使得IC开始发热。 当热量通过散热器传导或散发到安装垫中时,热成像相机可以检测通过散热器进入基板的热传导和/或耗散。 如果安装IC有空隙或其他类型的故障,则热成像相机可以检测到图像中较冷或较冷的斑点。
    • 47. 发明授权
    • Apparatus for attaching a device to a circular structure
    • 用于将装置附接到圆形结构的装置
    • US08186643B2
    • 2012-05-29
    • US12731309
    • 2010-03-25
    • Wei LuoTounine MayerJae Choi
    • Wei LuoTounine MayerJae Choi
    • F16M11/00
    • F16L41/008G01N29/223G01N2291/044G01N2291/2634
    • An apparatus for attaching a device to a circular structure is disclosed. In one embodiment, the apparatus includes a clamp body attached to the outer surface of the circular structure using a strap, which can be attached to the clamp body using a spring that maintains an attachment force to prevent movement of the clamp body over a wide range of temperatures and temperature cycling of the circular structure and the strap. In one embodiment, the device can be installed in the clamp body and coupled to the outer surface of the circular structure using one or more spring washers that maintain an attachment force between the device and the outer surface of the circular structure to prevent detachment of the device from the outer surface of the circular structure over a wide range of temperatures and temperature cycling of the circular structure.
    • 公开了一种用于将装置附接到圆形结构的装置。 在一个实施例中,该装置包括使用带子连接到圆形结构的外表面的夹具主体,该带可以使用保持附接力的弹簧附接到夹具主体,以防止夹具主体在较宽的范围内移动 的圆形结构和带子的温度和温度循环。 在一个实施例中,该装置可以安装在夹具主体中并且使用一个或多个弹簧垫圈联接到圆形结构的外表面,弹簧垫圈在装置与圆形结构的外表面之间保持附着力,以防止 器件从圆形结构的外表面在圆形结构的宽温度和温度循环范围内。
    • 49. 发明申请
    • Support structure for a planar cooling device
    • 平面冷却装置的支撑结构
    • US20070240860A1
    • 2007-10-18
    • US11410772
    • 2006-04-24
    • George MeyerKi-Bu NamSung KwackJae Choi
    • George MeyerKi-Bu NamSung KwackJae Choi
    • F28D15/04
    • F28D15/046F28D15/0233G06F1/20H01L23/427H01L2924/0002Y10T29/49353H01L2924/00
    • A support structure for a compact planar cooling device is presented. The support structure allows the cooling device to be made with a simpler structure than most conventional cooling devices. The cooling device includes a planar casing, a wick layer, and the support structure. The support structure includes a flat plate with a portion cut out to form an opening and a spacer on the flat plate. The spacer is made by bending or folding the cut-out portion of the plate. The spacer enhances coolant circulation inside the cooling device by pushing the wick layer against the inner surface of the casing and maintaining a set distance between the support structure and the casing to allow unimpeded coolant movement. The cooling device can be made cost-effectively without compromising heat transfer efficiency.
    • 提出了一种紧凑型平面冷却装置的支撑结构。 支撑结构允许制冷装置的结构比大多数传统的冷却装置简单。 冷却装置包括平面壳体,芯吸层和支撑结构。 支撑结构包括平板,其中切出一部分以在平板上形成开口和间隔件。 间隔件通过弯曲或折叠板的切口部分而制成。 间隔板通过将油芯层推靠在壳体的内表面上并且保持支撑结构和壳体之间的设定距离以允许不受阻碍的冷却剂移动来增强冷却装置内部的冷却剂循环。 冷却装置可以经济地制造而不损害传热效率。