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41. 发明授权

US07009009B1 Fluxing underfill compositions 失效
标题翻译：助焊剂底部填充剂组合物
公开(公告)号：US07009009B1
公开(公告)日：2006-03-07
申请号：US10656120
申请日：2003-09-08
申请人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
发明人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
IPC分类号： C08L63/00 , C08L63/02
CPC分类号： H01L21/563 , H01L23/293 , H01L23/49816 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19042 , H01L2924/20106 , H01L2924/351 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译：包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。

42. 发明授权

US06916890B1 Thermally reworkable epoxy resins and compositions based thereon 失效
标题翻译：热可再加工的环氧树脂及其上的组合物
公开(公告)号：US06916890B1
公开(公告)日：2005-07-12
申请号：US10201977
申请日：2002-07-25
申请人： John G. Woods , Susanne D. Morrill
发明人： John G. Woods , Susanne D. Morrill
IPC分类号： C07D301/14 , C07D303/40 , C07D303/44 , C08G59/00 , C08G59/34 , C08G59/42 , C09J163/02 , C07C67/05 , C07C69/73 , C07D301/12 , C07D303/20 , C08L63/00
CPC分类号： C09J163/00 , C07D301/14 , C07D303/40 , C07D303/44 , C08G59/00 , C08G59/027 , C08G59/42 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0665 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak α-alkoxy ester linkages providing for the reworkable aspect of the invention.
摘要翻译：本发明公开了适用于包括（a）多官能1-链烯基醚或1-环烯基醚和烯基羧酸的环氧化反应产物的电子部件的可再加工环氧组合物，所述环氧化反应产物具有两个或多个热不稳定的α-烷氧基酯键; 和（b）环氧组分的固化剂。当固化时，环氧组合物提供可热再加工的组合物，弱的α-烷氧基酯键提供本发明的可再加工方面。

43. 发明授权

US06887737B1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom 失效
标题翻译：环氧化缩醛和硫缩醛，环氧化缩醛和硫缩醛，以及由其配制的可再加工的热固性树脂组合物
公开(公告)号：US06887737B1
公开(公告)日：2005-05-03
申请号：US10013487
申请日：2001-12-13
申请人： John G. Woods , Afranio Torres-Filho , Rebecca L. Tishkoff , Erin K. Yaeger , Jianzhao Wang
发明人： John G. Woods , Afranio Torres-Filho , Rebecca L. Tishkoff , Erin K. Yaeger , Jianzhao Wang
IPC分类号： C08G59/22 , C08G59/30 , C08G59/32 , C08G75/08 , C08L63/00 , H01L21/56 , H01L23/29 , H01L21/58 , B32B27/38 , C07D407/00 , C07D409/00
CPC分类号： H01L23/293 , C08G59/22 , C08G59/302 , C08G59/32 , C08G59/3254 , C08G75/08 , C08L63/00 , H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81052 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01077 , H01L2924/014 , Y10T428/31511 , Y10T428/31515 , H01L2924/00 , H01L2924/3512
摘要： This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.
摘要翻译：本发明涉及环氧化缩醛和硫缩醛，环氧化缩醛和硫缩醛，基于这种环氧化缩醛和硫缩醛的热固性树脂组合物，环氧化缩醛和硫缩醛，其反应产物在经受适当条件时可控地降解。

44. 发明授权

US06667194B1 Method of bonding die chip with underfill fluxing composition 有权
标题翻译：使用底部填充助熔剂组合物将芯片接合的方法
公开(公告)号：US06667194B1
公开(公告)日：2003-12-23
申请号：US10082278
申请日：2002-02-26
申请人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
发明人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
IPC分类号： C08L6302
CPC分类号： C07D303/22 , C07D303/24 , C07D303/44 , C08G59/12 , C08G59/42 , C08G59/5026 , C09J163/00 , H01L2224/27334 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01322 , H01L2924/0665 , Y10T428/12528 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译：包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。

45. 发明授权

US06656580B2 Impregnation of a graphite sheet with a sealant 失效
公开(公告)号：US06656580B2
公开(公告)日：2003-12-02
申请号：US10111550
申请日：2002-04-26
申请人： John G. Woods
发明人： John G. Woods
IPC分类号： B32B712
CPC分类号： C04B41/009 , C04B41/483 , C04B41/83 , C04B2111/00853 , H01M8/0213 , H01M8/0221 , H01M8/0223 , H01M8/0234 , H01M8/0263 , H01M8/0284 , H01M8/2425 , H01M8/2432 , H01M8/248 , H01M2008/1293 , Y10T428/24562 , Y10T428/24661 , Y10T428/24744 , Y10T428/249953 , Y10T428/249955 , Y10T428/249982 , Y10T428/249987 , Y10T428/30 , C04B35/522
摘要： A method for sealing graphite plates formed from mechanically processed graphite sheets of exfoliated graphite particles is provided. The graphites sheets are infused with a sealant to fill about 90 volume percent of the pores contained in the sheet. Upon curing the sealant, a substantially gas impermeable graphite plate is provides. Such a plate is useful in fuel cell construction.

46. 发明授权

US06231714B1 Allylic phenyl ether (meth)acrylate compositions and novel allylic phenyl ether (meth)acrylate monomers 失效
标题翻译：烯丙基苯基醚（甲基）丙烯酸酯组合物和新型烯丙基苯基醚（甲基）丙烯酸酯单体
公开(公告)号：US06231714B1
公开(公告)日：2001-05-15
申请号：US09198536
申请日：1998-11-24
申请人： John G. Woods , Susanne Morrill , Ciaran B. McArdle
发明人： John G. Woods , Susanne Morrill , Ciaran B. McArdle
IPC分类号： B32B3100
CPC分类号： C08F290/062 , C07C69/54 , C08F16/26 , C08F20/30 , C08F22/105
摘要： Curable compositions include at least one monomer compound having both (meth)acrylic ester functionality and an allylic phenyl ether functional group on the same molecule, the allylic phenyl ether functional group having at least one unsubstituted position on the phenyl ring which is ortho or para to the allylic ether group, and a free radical catalyst system. The composition may also includes a latent thermally activated acid generator. Claisen Rearrangement of radically polymerized polymers produced from the compositions may be induced at temperatures of about 100° C. or more to give crosslinked products of improved thermal resistance. Novel monomers which may be used in such compositions are characterized by formulas I and II: where R1 is H or methyl; R2 is a direct bond, a group of the formula —NCnH2n-, or a group of the formula —(OCnH2n—)m— which when taken with the phenyl group to which it is attached forms a phenyl ether; n is 1-4 and m is 1-10; R3 is —CH2CH═CH2, —CH2C(CH3)═CH2, —CH2CH═CH(CH3), —CH2C(CH3)═CH(CH3), —CH2CH═C(CH3)2 or —CH2 CH═CH(C6H5); and R4 is a divalent allylic group, and wherein the compound is optionally substituted on a phenyl group thereof by an alkyl, alkoxy or halo group, provided that relative to the respective —OR3 or —OR4O — groups, at least one unsubstituted ortho or para position remains on an adjacent phenyl ring.
摘要翻译：可固化组合物包括在同一分子上具有（甲基）丙烯酸酯官能团和烯丙基苯基醚官能团的至少一种单体化合物，所述烯丙基苯基醚官能团在苯环上具有至少一个未取代的位置，烯丙基醚基团和自由基催化剂体系。组合物还可以包括潜热热活化酸产生剂。 Claisen从组合物制备的自由基聚合聚合物的重排可以在约100℃或更高的温度下诱导，得到具有改善的耐热性的交联产物。可用于这些组合物中的新单体由式I和II表征：其中R 1是H或甲基; R2是直接键，式-NC n H 2n - 或式 - （OC n H 2n - ）m - 的基团，当与其连接的苯基取代时形成苯基醚; n为1-4，m为1-10; R3是-CH2CH = CH2，-CH2C（CH3）= CH2，-CH2CH = CH（CH3），-CH2C（CH3）= CH（CH3），-CH2CH = C（CH3）2或-CH2CH = CH（C6H5 ）; 并且R 4是二价烯丙基，并且其中所述化合物任选地在其苯基上被烷基，烷氧基或卤素取代，条件是相对于相应的-OR 3或-OR 4 O-基团，至少一个未取代的邻位或对位的位置保留在相邻的苯环上。

47. 发明授权

US5141970A Method of forming high-temperature resistant polymers 失效
标题翻译：形成高温耐热聚合物的方法
公开(公告)号：US5141970A
公开(公告)日：1992-08-25
申请号：US625574
申请日：1990-12-10
申请人： Ciaran B. McArdle , Joseph Burke , John G. Woods , Edward K. Welch, II
发明人： Ciaran B. McArdle , Joseph Burke , John G. Woods , Edward K. Welch, II
IPC分类号： C08F10/14 , C08F2/46 , C08F2/48 , C08F12/00 , C08F12/24 , C08F12/34 , C08F16/12 , C08F16/22 , C08F16/32 , C08F212/00 , C08F290/00 , C08F290/06 , C08F299/02 , C08J3/24 , C08L31/02 , C08L57/00
CPC分类号： C08F16/32 , C08F12/24 , C08F12/34 , C08F16/22
摘要： A method of forming high-temperature resistant polymers by a 2 step curing process comprising(a) curing a polymerizable composition at least one aromatic compound having alpha and/or beta instruction which is not substantially reactive under the curing condition of step a, particularly allyl or properyl, and(b) heating the cured composition of step a in the presence of acid to form a crosslinked resin.

48. 发明授权

US5021512A Thiol/ene compositions 失效
标题翻译：硫醇/烯组合物
公开(公告)号：US5021512A
公开(公告)日：1991-06-04
申请号：US351310
申请日：1989-05-04
申请人： John G. Woods , John M. Rooney
发明人： John G. Woods , John M. Rooney
IPC分类号： C07C43/23 , C08F12/34 , C08F257/00 , C08F273/00 , C08F283/00 , C08G77/38
CPC分类号： C08G77/38 , C07C43/23 , C08F12/34
摘要： Curable thiol/ene compositions comprise:(1) a multifunctional styryloxy monomer having one or more of the following structures ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are selected from vinyl (--CH.dbd.CH.sub.2), 1-propenyl (--CH.dbd.CH--CH.sub.3), isopropenyl ##STR2## hydrogen, lower alkyl or alkoxy, provided that at least one of R.sup.1, R.sup.2 and R.sup.3 must be vinyl, 1-propenyl or isopropenyl;n is an integer .gtoreq.1;if n=1, then R.sup.4 is a monovalent hydrocarbon radical containing one free-radically copolymerizable alkenyl or cycloalkenyl group,if n.gtoreq.2, R.sup.4 is a multivalent hydrocarbon radical which may contain a maximum of one free-radically copolymerizable alkenyl or cycloalkenyl group;R.sup.5 is a divalent hydrocarbon radical; or a carbon atom which is part of a cyclic group in the radical G; or a radical of formula ##STR3## where R.sup.7 is a divalent hydrocarbon radical; if n=1, G is a monovalent organic or inorganic radical, free of phenolic hydroxyl groups or other groups which substantially interfere with radical polymerization, containing one free-radically copolymerizable alkenyl or cycloalkenyl group;if n.gtoreq.2, G is a multivalent organic or inorganic radical, free of phenolic hydroxyl groups or other groups which substantially interfere with radical polymerization, which may contain a maximum of one free-radically copolymerizable alkenyl or cycloalkenyl group;R.sup.6 is a lower alkyl or cycloalkyl group; or if n=1, R.sup.6 may also be an alkenyl or cycloalkenyl group, provided that G does not contain an alkenyl or cycloalkenyl group.(2) a multifunction thiol.(3) a free-radical curing rate accelerator.Novel styryloxy compounds are described which are reaction products of isoeugenol and (a) multifunctional epoxy compounds or (b) allyl glycidyl ether with or without a multifunctional polydimethylsiloxane.
摘要翻译：可固化硫醇/烯组合物包含：（1）具有一个或多个以下结构的多官能苯乙烯基氧基单体，其中R 1，R 2和R 3选自乙烯基（-CH = CH 2），1- 丙烯基（-CH = CH-CH 3），异丙烯基氢，低级烷基或烷氧基，条件是R 1，R 2和R 3中的至少一个必须是乙烯基，1-丙烯基或异丙烯基; n是整数> / = 1; 如果n = 1，那么R 4是含有一个可自由基共聚的烯基或环烯基的单价烃基，如果n≥2，R4是多价烃基，其可以含有最多一个可自由基共聚的烯基或环烯基组; R5是二价烃基; 或作为基团G中的环状基团的一部分的碳原子; 或其中R 7为二价烃基的式“IMAGE”基团; 如果n = 1，G是不含酚羟基或基本上干扰自由基聚合的其它基团的单价有机或无机基团，其中含有一个可自由基共聚的烯基或环烯基; 如果n> / = 2，G是多价有机或无机基团，不含酚羟基或基本上干扰自由基聚合的其它基团，其可以含有最多一个可自由基共聚的烯基或环烯基; R6是低级烷基或环烷基; 或者如果n = 1，则R6也可以是烯基或环烯基，条件是G不含有烯基或环烯基。（2）多功能硫醇。（3）自由基固化速率加速剂。描述了新颖的苯乙烯基氧基化合物，其是异丁子香酚和（a）多官能环氧化合物的反应产物或（b）具有或不具有多官能聚二甲基硅氧烷的烯丙基缩水甘油醚。

49. 发明授权

US4642362A Polymer bound calixarenes 失效
标题翻译：聚合物结合的杯芳烃
公开(公告)号：US4642362A
公开(公告)日：1987-02-10
申请号：US717251
申请日：1985-03-28
申请人： Stephen J. Harris , John G. Woods , John M. Rooney
发明人： Stephen J. Harris , John G. Woods , John M. Rooney
IPC分类号： C07F7/18 , C08F8/00 , C08G18/32 , C08G18/54 , C08G75/02 , C08G77/38 , C08G85/00 , C09J4/00 , C07F7/10
CPC分类号： C08G85/00 , C07F7/1836 , C08F8/00 , C08G18/3215 , C08G18/542 , C08G75/02 , C08G77/38 , C09J4/00
摘要： A linear or cross-linked polymer selected from polythioethers, polyethers, styrenic polymers, polyacrylates, and polyorganosiloxanes having a plurality of calixarene groups bound thereon, the calixarene groups having the formula ##STR1## where the R.sup.1 groups are the same or different H or hydrocarbyl groups; the R.sup.2 groups are H, hydrocarbyl, --CH.sub.2 C(.dbd.O)OR.sup.3, --CH.sub.2 C(.dbd.O)R.sup.3, or --C(.dbd.O)NHR.sup.3, R.sup.3 is hydrocarbyl or substituted hydrocarbyl; n is an integer of 1-8, m is an integer of 0-7 and n+m is 4-8.
摘要翻译：选自聚硫醚，聚醚，苯乙烯聚合物，聚丙烯酸酯和结合有多个杯芳烃的聚有机硅氧烷的线性或交联聚合物，具有式I'或II'的杯芳烃基团，其中R 1基团为相同或不同的H或烃基; R 2是H，烃基，-CH 2 C（= O）OR 3，-CH 2 C（= O）R 3或-C（= O）NHR 3，R 3是烃基或取代的烃基; n为1-8的整数，m为0-7的整数，n + m为4-8。

50. 发明申请

US20140216649A1 THIOL-ENE CURED OIL-RESISTANT POLYACRYLATE SEALANTS FOR IN-PLACE GASKETING APPLICATIONS 有权
标题翻译： THIOL-ENE固化耐油聚丙烯酸酯密封剂，用于内部气体应用
公开(公告)号：US20140216649A1
公开(公告)日：2014-08-07
申请号：US12062090
申请日：2008-04-03
申请人： John G. Woods , Richard O. Angus, JR. , Joel D. Schall
发明人： John G. Woods , Richard O. Angus, JR. , Joel D. Schall
IPC分类号： B32B37/12 , C08F8/34 , C08F2/46
CPC分类号： C08F8/02 , C08F8/14 , C08F8/32 , C08F8/34 , C08K5/0025 , C08K5/372 , C09J133/14 , G02F2202/023 , G02F2202/28 , C08F220/28 , C08F220/18 , C08F20/18
摘要： The present invention relates to thiol-ene curing compositions, which cure upon exposure to ultraviolet (UV) light and/or heat. The compositions include components having alkenyl (or “ene”) functionality and components having thiol functionality, which undergo thiol-ene curing. The compositions also include a cure system. More specifically, in some embodiments, the curable compositions include a vinyl polymer bearing alkenyl or thiol terminal functional group(s) and a cross-linking agent having the opposing functionality, i.e., thiol cross-linking agents with alkenyl-terminated vinyl polymers and vinyl cross-linking agents with thiol-terminated vinyl polymers. Also provided are methods of making and using the compositions, such as for sealants for in-place gasketing applications.
摘要翻译：本发明涉及硫醇烯固化组合物，其在暴露于紫外线（UV）光和/或热时固化。组合物包括具有烯基（或“烯”）官能团的组分和具有硫醇官能团的组分，其经历硫醇烯固化。组合物还包括固化体系。更具体地，在一些实施方案中，可固化组合物包括带有烯基或硫醇末端官能团的乙烯基聚合物和具有相反官能团的交联剂，即具有链烯基封端的乙烯基聚合物和乙烯基的硫醇交联剂交联剂与硫醇封端的乙烯基聚合物。还提供了制备和使用组合物的方法，例如用于就地垫片应用的密封剂。

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