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1. 发明授权

US07009009B1 Fluxing underfill compositions 失效
标题翻译：助焊剂底部填充剂组合物
公开(公告)号：US07009009B1
公开(公告)日：2006-03-07
申请号：US10656120
申请日：2003-09-08
申请人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
发明人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
IPC分类号： C08L63/00 , C08L63/02
CPC分类号： H01L21/563 , H01L23/293 , H01L23/49816 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19042 , H01L2924/20106 , H01L2924/351 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译：包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。

2. 发明授权

US06667194B1 Method of bonding die chip with underfill fluxing composition 有权
标题翻译：使用底部填充助熔剂组合物将芯片接合的方法
公开(公告)号：US06667194B1
公开(公告)日：2003-12-23
申请号：US10082278
申请日：2002-02-26
申请人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
发明人： Lawrence N. Crane , Mark M. Konarski , J. Paul Krug , Andrew D. Messana , John G. Woods
IPC分类号： C08L6302
CPC分类号： C07D303/22 , C07D303/24 , C07D303/44 , C08G59/12 , C08G59/42 , C08G59/5026 , C09J163/00 , H01L2224/27334 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29486 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01322 , H01L2924/0665 , Y10T428/12528 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
摘要翻译：包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。

3. 发明授权

US07109061B2 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith 失效
公开(公告)号：US07109061B2
公开(公告)日：2006-09-19
申请号：US09985728
申请日：2001-11-06
申请人： Lawrence N. Crane , Mark M. Konarski , Erin K. Yaeger , Afranio Torres-Filho , J. Paul Krug , Rebecca Tishkoff
发明人： Lawrence N. Crane , Mark M. Konarski , Erin K. Yaeger , Afranio Torres-Filho , J. Paul Krug , Rebecca Tishkoff
IPC分类号： H01L21/48 , H01L23/48
CPC分类号： H01L23/293 , H01L21/563 , H01L23/3192 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/29082 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

4. 发明授权

US07108920B1 Reworkable compositions incorporating episulfide resins 有权
标题翻译：加入环硫树脂的可重组组合物
公开(公告)号：US07108920B1
公开(公告)日：2006-09-19
申请号：US09885269
申请日：2000-09-15
申请人： Lawrence N. Crane , Mark M. Konarski , Brendan J. Kneafsey , Afranio Torres-Filho , Z. Andrew Szczepaniak
发明人： Lawrence N. Crane , Mark M. Konarski , Brendan J. Kneafsey , Afranio Torres-Filho , Z. Andrew Szczepaniak
IPC分类号： B32B27/38 , H01L21/56 , C08G75/00 , C08L63/00 , C08L81/00
CPC分类号： H01L24/98 , C08G75/08 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/81 , H01L24/83 , H01L2224/11 , H01L2224/1132 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , Y10T428/31511 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.
摘要翻译：本发明涉及用于安装到诸如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGAs”），焊盘网格阵列（“LGAs”）等电路板半导体器件上的热固性树脂组合物，以及其中每个在载体基板上具有诸如大规模集成（“LSI”）的半导体芯片，以及可用于这种组合物的化合物。组合物包括具有可热切割键的化合物，并且在化合物内包括环硫基。当经受适当条件时，本发明的组合物可重复使用。

5. 发明授权

US06458472B1 Fluxing underfill compositions 失效
标题翻译：助焊剂底部填充剂组合物
公开(公告)号：US06458472B1
公开(公告)日：2002-10-01
申请号：US09755146
申请日：2001-01-08
申请人： Mark M. Konarski , J. Paul Krug
发明人： Mark M. Konarski , J. Paul Krug
IPC分类号： H01L2912
CPC分类号： H01L21/563 , B23K35/3612 , B23K35/3613 , B23K35/3618 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01077 , H01L2924/01087 , H01L2924/01322 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , Y10T29/49158 , Y10T29/4916 , Y10T29/49171 , Y10T428/12528 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
摘要翻译：本发明涉及用于助熔金属表面的助焊剂底部填充组合物，以准备提供电连接并密封半导体器件之间的空间，例如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGA”），每个都具有半导体芯片，例如大规模集成（“LSI”）或半导体芯片本身的电路阵列（“LGAs”），倒装芯片组件（“FC”）等，以及电路板设备或芯片分别电连接。本发明的助焊剂底部填充组合物在与用于建立电互连熔体的焊料大约相同的温度下开始固化。

6. 发明授权

US07193016B1 Epoxy-extended polyacrylate toughening agent 失效
标题翻译：环氧延伸聚丙烯酸酯增韧剂
公开(公告)号：US07193016B1
公开(公告)日：2007-03-20
申请号：US10692935
申请日：2003-10-27
申请人： John G. Woods , Mark M. Konarski , Kyra M. Kozak , Yuhshi Luh
发明人： John G. Woods , Mark M. Konarski , Kyra M. Kozak , Yuhshi Luh
IPC分类号： C08F8/08 , C08L63/00 , C08L63/02
CPC分类号： C09J163/00 , C08F8/14 , C08F2810/40 , C08F20/16
摘要： In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要翻译：根据本发明，提供了可用于改善环氧基粘合剂制剂的性能的增韧剂。例如，已经发现环氧化的聚丁基丙烯酸酯是组分级底部填充粘合剂组合物的有用的增韧剂。发明材料通常是液体橡胶，其提供改善的断裂韧性同时保持令人满意的毛细管流动性能本发明材料可以从易于获得的低成本原料的纯（无溶剂）反应中合成并以高收率分离。它们具有末端环氧官能团的分子遥爪结构。聚丙烯酸酯通常以环氧化聚合物，链延长多元寡聚物和未反应单体的混合物形式获得。本发明材料与普通的环氧配方相容，可以不经纯化地使用。在低掺量下，它们提供了许多商业底层填充应用的粘合剂，其满足最小断裂韧性（Gq> 2.0lb / in）和毛细管流动规格（流动时间<180秒）。根据本发明的另一个实施方案，提供了包含本发明化合物的粘合剂组合物及其使用方法。在本发明的另外的实施方案中，提供了制备本发明增韧剂的方法，用于将装置粘附到基底上的方法以及包括附着到第二制品上的第一制品的组件。

7. 发明授权

US07087304B1 Polysulfide-based toughening agents, compositions containing same and methods for the use thereof 有权
标题翻译：聚硫醚系增韧剂，含有它们的组合物及其使用方法
公开(公告)号：US07087304B1
公开(公告)日：2006-08-08
申请号：US10367759
申请日：2003-02-19
申请人： John G. Woods , Yuhshi Luh , Mark M. Konarski
发明人： John G. Woods , Yuhshi Luh , Mark M. Konarski
IPC分类号： B32B27/38 , B32B7/12 , C08L63/00 , C09J163/00 , H01L21/56
CPC分类号： C08G59/302 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , Y10T428/31515 , C08L81/00 , H01L2924/00
摘要： In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time
摘要翻译：根据本发明，提供了可用于改善环氧基粘合剂制剂的性能的增韧剂。例如，已经发现环氧化多硫化物是组分级底部填充粘合剂组合物的有用的增韧剂。发明材料是提供改善的断裂韧性同时保持令人满意的毛细管流动特性的液体橡胶。本发明材料可以从易于获得的低成本原料的纯（无溶剂）反应中合成并以高收率分离。它们具有带末端环氧官能团的直链和支链遥爪结构，并且在不显着增加起始多硫化物材料的分子量的情况下制备。本发明材料与普通的环氧配方相容，可以不经纯化地使用。在低掺量下，它们提供了许多商业底层填充应用的粘合剂，其满足最小断裂韧性（Gq> 2.0lb / in）和毛细管流动规格（流动时间<180秒）。根据本发明的另一个实施方案，提供了包含本发明化合物的粘合剂组合物及其使用方法。在本发明的另外的实施方案中，提供了制备本发明增韧剂的方法，用于将装置粘附到基底上的方法以及包括附着到第二制品上的第一制品的组件。

8. 发明授权

US06893736B2 Thermosetting resin compositions useful as underfill sealants 有权
标题翻译：可用作底部填充密封剂的热固性树脂组合物
公开(公告)号：US06893736B2
公开(公告)日：2005-05-17
申请号：US10294668
申请日：2002-11-15
申请人： Mark M. Konarski
发明人： Mark M. Konarski
IPC分类号： C08G59/18 , C08G59/40 , C08G59/68 , C08L63/00 , C08L81/04 , H01L21/56 , H01L23/29 , H01L29/12
CPC分类号： H01L23/293 , C08G59/18 , C08G59/4021 , C08G59/686 , C08L63/00 , C08L81/04 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , Y10T428/12528 , C08L81/00 , C08L2666/22 , H01L2924/00
摘要： The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor. Optionally, the inventive composition includes a filler, desirably at least a portion of the filler should have a particle size in the range of 1 to 1,000 nanometers.
摘要翻译：本发明提供一种热固性树脂组合物，其用作高填充低CTE底填充密封剂组合物，其完全填充半导体装置中的底部填充空间，例如倒装芯片组件，其包括安装在载体基板上的半导体芯片，导体通过热固化和良好的生产率牢固地连接到电路板，并且表现出可接受的热冲击性能（或热循环性能）。在这种半导体器件与半导体器件电连接的电路板之间用作底部填充密封剂的热固性树脂组合物包括环氧树脂组分，潜在硬化剂组分和多硫化物基增韧组分。潜在的固化剂组分包括改性的酰胺组分和潜在的催化剂。任选地，本发明的组合物包括填料，理想地，填料的至少一部分应具有在1至1000纳米范围内的粒度。

9. 发明授权

US06519968B1 Shipping container for exothermic material 失效
标题翻译：用于放热材料的运输容器
公开(公告)号：US06519968B1
公开(公告)日：2003-02-18
申请号：US09852158
申请日：2001-05-09
申请人： Mark M. Konarski
发明人： Mark M. Konarski
IPC分类号： F25D308
CPC分类号： F25D3/06 , F25D2331/804
摘要： A shipping container for exothermic material comprises an outer container and a plurality of inner containers enclosed within the outer container with a quantity of coolant material adjacent the inner containers. Each inner container includes a box defining an enclosure, a fluted insert disposed within such enclosure for supporting a plurality of vessels, such as plastic syringes containing exothermic material. Each fluted insert includes a plurality of open ended recesses for receiving the syringes separated by upstanding walls defining a barrier between the supported syringes. A pair of heat shields, one at the bottom and one at the top of each inner box, is included for dissipating heat therewithin. Plural inner containers housing exothermic material are bubble-wrapped in a stacked arrangement with gel packs between each inner container. The wrapped stack of inner containers are then placed in an outer container which is then filled with a quantity of dry ice and covered to close the shipping container for transportation.
摘要翻译：用于放热材料的运输容器包括外容器和封闭在外容器内的多个内容器，其中一些冷却剂材料与内容器相邻。每个内部容器包括限定外壳的盒子，设置在该外壳内的槽形插入件，用于支撑多个容器，例如含有放热材料的塑料注射器。每个带凹槽的插入件包括多个开口的凹部，用于接纳由支撑的注射器之间限定障碍物的直立壁分隔开的注射器。包括一对隔热罩，一个在底部，一个位于每个内箱的顶部，用于在其中散热。容纳放热材料的多个内部容器以层叠的方式气泡包裹，每个内部容器之间具有凝胶包装。然后将包裹的内部容器堆叠放置在外部容器中，然后将其装满一定数量的干冰并将其盖上以关闭运输容器以便运输。

10. 发明授权

US07547735B1 UV curable compositions 有权
标题翻译：紫外光固化组合物
公开(公告)号：US07547735B1
公开(公告)日：2009-06-16
申请号：US11566262
申请日：2006-12-04
申请人： Mark M. Konarski , Joel D. Schall
发明人： Mark M. Konarski , Joel D. Schall
IPC分类号： C08J3/28 , C08F2/46 , C08F2/50 , G03F7/031 , C08F4/00
CPC分类号： C08L15/00 , C08L19/006 , C08L33/08 , C08L33/14 , C08L2666/04
摘要： The present invention provides a UV curable composition comprising an acrylate component, comprising an acrylate-functionalized hydrogenated polybutadiene, and at least one mono-functional acrylate, and a photoinitiator combination triggered upon exposure to radiation at 365 nm of the electromagnetic spectrum comprising a bisacyl phosphine oxide and benzophenone, where when dispensed at a thickness of about 1 mm and exposed to UV radiation generated at a wavelength of 365 nm the composition cures through the thickness of the dispensed composition at a speed between 40 mm/sec to 100 mm/sec.
摘要翻译：本发明提供了一种包含丙烯酸酯组分的丙烯酸酯组分的包含丙烯酸酯官能化的氢化聚丁二烯和至少一种单官能丙烯酸酯的紫外线可固化组合物，以及在365nm处暴露于辐射下触发的光引发剂组合物，其包含双酰基膦氧化物和二苯甲酮，其中当以约1mm的厚度分配并暴露于在365nm波长下产生的UV辐射时，组合物以40mm / sec至100mm / sec的速度固化分配的组合物的厚度。

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