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41. 发明申请

US20080302418A1 Elongated Photovoltaic Devices in Casings 审中-公开
标题翻译：细长的光伏器件
公开(公告)号：US20080302418A1
公开(公告)日：2008-12-11
申请号：US12115485
申请日：2008-05-05
申请人： Benyamin Buller , Christian M. Gronet , Ratson Morad , Markus E. Beck , Brian Cumpston
发明人： Benyamin Buller , Christian M. Gronet , Ratson Morad , Markus E. Beck , Brian Cumpston
IPC分类号： H01L31/0272 , H01L31/04 , H01L31/06 , H01L31/18
CPC分类号： H01L31/035281 , H01L31/02168 , H01L31/022425 , H01L31/048 , H01L31/0543 , H01L31/0547 , Y02E10/52
摘要： A solar cell unit comprising a solar cell and an at least partially transparent casing that encases the solar cell. The solar cell includes a nonplanar substrate defining a length of the solar cell, wherein a length of the nonplanar substrate is at least three times longer than a width of the nonplanar substrate. A back-electrode is disposed around all or a portion of the nonplanar substrate, and extends along all or a portion of the length of the nonplanar substrate. A semiconductor junction is disposed on the back-electrode, and has first and second layers, each of which has an inorganic semiconductor. An at least partially transparent conductive layer is disposed on the semiconductor junction. Optionally, filler material is disposed on the transparent conductive layer, which can for example be a liquid or gel.
摘要翻译：太阳能电池单元包括太阳能电池和封装太阳能电池的至少部分透明的壳体。太阳能电池包括限定太阳能电池长度的非平面衬底，其中非平面衬底的长度比非平面衬底的宽度长至少三倍。背面电极设置在非平面基板的全部或一部分周围，并且沿着非平面基板的全部或一部分长度延伸。半导体结设置在背电极上，并且具有第一和第二层，每层具有无机半导体。至少部分透明的导电层设置在半导体结上。任选地，填充材料设置在透明导电层上，其可以例如是液体或凝胶。

42. 发明授权

US07192494B2 Method and apparatus for annealing copper films 有权
标题翻译：铜膜退火方法和设备
公开(公告)号：US07192494B2
公开(公告)日：2007-03-20
申请号：US10611589
申请日：2003-06-30
申请人： B. Michelle Chen , Ho Seon Shin , Yezdi Dordi , Ratson Morad , Robin Cheung
发明人： B. Michelle Chen , Ho Seon Shin , Yezdi Dordi , Ratson Morad , Robin Cheung
IPC分类号： C25D5/50
CPC分类号： H01L21/6723 , C22F1/02 , C22F1/08 , C25D5/48 , C25D5/50 , C25D7/123 , H01L21/67098 , H01L21/67103 , H01L21/67109 , H01L21/76838 , H01L21/7684 , H01L21/76886
摘要： A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system.
摘要翻译：一种退火铜的方法和装置。该方法包括通过电镀在一体化处理系统中的基板上形成铜层，并对集成处理系统内的室内的铜层退火。

43. 发明申请

US20060166487A1 Method and apparatus for chemical mechanical polishing of semiconductor substrates 失效
公开(公告)号：US20060166487A1
公开(公告)日：2006-07-27
申请号：US11393999
申请日：2006-03-30
申请人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
发明人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
IPC分类号： H01L21/4763 , H01L21/461
CPC分类号： H01L21/7684 , B24B37/042 , B24B49/16 , H01L21/3212 , Y02P80/30
摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

44. 发明授权

US07060606B2 Method and apparatus for chemical mechanical polishing of semiconductor substrates 失效
公开(公告)号：US07060606B2
公开(公告)日：2006-06-13
申请号：US10972191
申请日：2004-10-22
申请人： Stan D. Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Q. Liu , Rashid Mavliev , Ratson Morad , Daniel A. Carl
发明人： Stan D. Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Q. Liu , Rashid Mavliev , Ratson Morad , Daniel A. Carl
IPC分类号： H01L21/4763
CPC分类号： H01L21/7684 , B24B37/042 , B24B49/16 , H01L21/3212 , Y02P80/30
摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

45. 发明授权

US06979248B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US06979248B2
公开(公告)日：2005-12-27
申请号：US10140010
申请日：2002-05-07
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Rashid Mavliev , Liang-Yuh Chen , Ratson Morad , Sasson Somekh
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Rashid Mavliev , Liang-Yuh Chen , Ratson Morad , Sasson Somekh
IPC分类号： C25D7/12 , B23H5/08 , B24B37/04 , B24D13/14 , C25F3/00 , C25F3/30 , C25F7/00 , H01L21/304 , B24B1/00 , C25C7/04 , C25D17/00
CPC分类号： B24B37/16 , B23H5/08 , B24B37/046 , B24B37/14 , Y10S977/902
摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.
摘要翻译：提供了一种用于平坦化基板表面的制造方法和装置。在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括涂覆有导电材料的电介质或导电纤维，导电填料或其组合。导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

46. 发明授权

US06897146B2 System architecture of semiconductor manufacturing equipment 失效
标题翻译：半导体制造设备的系统架构
公开(公告)号：US06897146B2
公开(公告)日：2005-05-24
申请号：US10602225
申请日：2003-06-23
申请人： Ratson Morad , Ho Seon Shin
发明人： Ratson Morad , Ho Seon Shin
IPC分类号： C23C16/02 , C23C16/54 , H01L21/00 , H01L21/4763
CPC分类号： H01L21/67167 , C23C16/0227 , C23C16/54 , H01L21/67184 , H01L21/67207
摘要： A semiconductor manufacturing equipment wherein degas chamber(s) are integrated to the conventional pass-through chamber location. A preferred embodiment for depositing Cu barrier and seed layers on a semiconductor wafer comprises a front opening unified pod(s), a single wafer loadlock chamber(s), a degas chamber(s), a preclean chamber(s), a Ta or TaN process chamber(s), and a Cu process chamber(s). The degas chamber is integrated to a pass-through chamber. Such system may achieve system throughput higher than 100 wafers per hour.
摘要翻译：一种半导体制造设备，其中脱气室与常规的通过腔室位置集成。用于在半导体晶片上沉积Cu阻挡层和种子层的优选实施例包括前开口统一吊舱，单个晶片负荷锁定室，脱气室，预清洁室，Ta或 TaN处理室和一个或多个Cu处理室。脱气室集成到通气室。这样的系统可以实现高于每小时100个晶片的系统吞吐量。

47. 发明授权

US06893548B2 Method of conditioning electrochemical baths in plating technology 失效
标题翻译：电镀技术中电化学浴的调理方法
公开(公告)号：US06893548B2
公开(公告)日：2005-05-17
申请号：US09882208
申请日：2001-06-13
申请人： Robin Cheung , Daniel A. Carl , Liang-Yuh Chen , Yezdi Dordi , Paul F. Smith , Ratson Morad , Peter Hey , Ashok Sinha
发明人： Robin Cheung , Daniel A. Carl , Liang-Yuh Chen , Yezdi Dordi , Paul F. Smith , Ratson Morad , Peter Hey , Ashok Sinha
IPC分类号： C23C18/16 , C25D7/12 , C25D21/12 , C25D21/18 , C25D5/00
CPC分类号： C25D21/18 , C23C18/1617 , C23C18/1683 , C25D21/12
摘要： An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition. The constituents may be added at the beginning of the use of the bath to initially condition the electrochemical bath or may be added, preferably either continuously or periodically, during the electrochemical deposition process.
摘要翻译：提供了一种用于分析或调理电化学浴的装置和方法。本发明的一个方面提供了一种用于在电化学沉积方法中分析电化学浴的方法，包括提供具有第一浴组成的第一电化学浴，利用电化学沉积工艺中的第一电化学浴形成具有第二浴的第二电化学浴组合和分析第一和第二组合物以鉴定在电化学沉积过程中产生的一种或多种成分。具有与在电化学沉积工艺中产生的一种或多种成分中的全部或至少一些基本上相同的组成的添加剂材料可以加入到另一电化学浴中以产生所需的化学组成。可以在使用浴的开始时添加组分以最初调节电化学浴，或者可以在电化学沉积过程期间连续地或周期性地添加。

48. 发明授权

US5003266A Passively improving magnetic field homogeneity 失效
标题翻译：被动改善磁场均匀性
公开(公告)号：US5003266A
公开(公告)日：1991-03-26
申请号：US379353
申请日：1989-07-12
申请人： Alex Palkovich , Ratson Morad
发明人： Alex Palkovich , Ratson Morad
IPC分类号： G01R33/3873
CPC分类号： G01R33/3873
摘要： Shim holding independently accessible open cavities are attached to the magnet bore. The holding independently accessible open cavities are arranged in rows and columns to provide readily identifiable locations. The shim holding indpendently accessible open cavities increase the effeciency of shimming to improve the homogeneity of magnets in magnetic resonance systems.
摘要翻译：保持独立开放的腔的垫片附接到磁体孔。保持独立开放的腔体以行和列布置以提供易于识别的位置。保持独立开口的垫片增加了垫片的有效性，以提高磁共振系统中磁体的均匀性。

49. 发明授权

US08686279B2 Concentrating solar energy collector 失效
标题翻译：集中太阳能收集器
公开(公告)号：US08686279B2
公开(公告)日：2014-04-01
申请号：US12781706
申请日：2010-05-17
申请人： Gilad Almogy , Ratson Morad , Amir Bar , Amir Arie Weiss , Ofer Ricklis , Andrey Bochkariov
发明人： Gilad Almogy , Ratson Morad , Amir Bar , Amir Arie Weiss , Ofer Ricklis , Andrey Bochkariov
IPC分类号： H01L31/052
CPC分类号： H01L31/0525 , F24S23/74 , F24S25/12 , F24S25/13 , F24S30/425 , G02B7/1822 , H01L31/0521 , H01L31/0547 , Y02E10/45 , Y02E10/47
摘要： A concentrating solar energy collector comprises a linearly extending receiver comprising solar cells, a plurality of linearly extending reflective elements arranged in side-by-side rows, oriented parallel to a long axis of the receiver, and fixed in position with respect to each other and with respect to the receiver to form a linearly extending reflector, and a linearly extending support structure supporting the receiver and the reflector and pivotally mounted to accommodate rotation of the support structure, the reflector, and the receiver about a rotation axis parallel to the long axis of the receiver.
摘要翻译：集中太阳能收集器包括线性延伸的接收器，其包括太阳能电池，并排布置的多个线性延伸的反射元件，其平行于接收器的长轴定向并相对于彼此固定就位，相对于接收器形成线性延伸的反射器，以及支撑接收器和反射器并枢转地安装的线性延伸的支撑结构，以适应支撑结构，反射器和接收器围绕平行于长轴的旋转轴的旋转的接收器。

50. 发明授权

US08580037B2 Method of depositing materials on a non-planar surface 失效
公开(公告)号：US08580037B2
公开(公告)日：2013-11-12
申请号：US12482263
申请日：2009-06-10
申请人： Ratson Morad
发明人： Ratson Morad
IPC分类号： C23C16/50 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： C30B23/02 , H01L21/02568 , H01L21/02631 , H01L21/67754 , H01L21/6776
摘要： A method of depositing materials on a non-planar surface is disclosed. The method is effectuated by rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a method effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.

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