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    • 43. 发明授权
    • Circuit board built-in connector and catcher
    • 电路板内置连接器和捕手
    • US07845983B2
    • 2010-12-07
    • US12305281
    • 2007-05-10
    • Kouhei KawadaJinsong WangNaoki Shibata
    • Kouhei KawadaJinsong WangNaoki Shibata
    • H01R9/03
    • H01Q1/1271H01Q1/22H01R9/0515H01R12/714H01R13/6658H01R2201/02
    • A circuit board built-in connector and a catcher are provided. The circuit board built-in connector and the catcher can be miniaturized, have high cable pulled-out strength and resistance to noise and electrostatic property, and are easy for installation and high in line operability. The circuit board built-in connector for connecting an antenna element (10) with a cable (20) is comprised of a circuit board (1), a ground member (2), and a cable clamping portion (3). The circuit board (1) has connecting terminals and an electronic circuit is placed thereon. The ground member (2) is provided adjacent to a side portion of the circuit board in a perpendicular manner to a plate surface of the circuit board. Then, the cable clamping portion (3) extends from the ground member to hold the cable (20). The catcher (5), on one hand, set on a side of the antenna element, is provided with a ground terminal (50) for connecting the ground member with the ground on the side of the antenna element, and a power supply terminal (51) for connecting a connecting terminal of the circuit board with the antenna element.
    • 提供电路板内置连接器和捕获器。 电路板内置连接器和捕获器可以小型化,具有较高的电缆拉出强度,抗噪声和静电特性,易于安装和高线路可操作性。 用于将天线元件(10)与电缆(20)连接的电路板内置连接器包括电路板(1),接地元件(2)和电缆夹紧部分(3)。 电路板(1)具有连接端子,电子电路放置在其上。 接地构件(2)以与电路板的板表面垂直的方式设置为与电路板的侧部相邻。 然后,电缆夹紧部分(3)从接地部件延伸以保持电缆(20)。 捕获器(5)一方面设置在天线元件的一侧,设置有用于将接地部件与天线元件侧的接地连接的接地端子(50),以及电源端子 51),用于将电路板的连接端子与天线元件连接。
    • 44. 发明申请
    • DATA PROCESSING APPARATUS AND DATA PROCESSING METHOD
    • 数据处理设备和数据处理方法
    • US20090237405A1
    • 2009-09-24
    • US12396914
    • 2009-03-03
    • Kimio HayashiJosuke IwataShintaro KuronumaNaoki Shibata
    • Kimio HayashiJosuke IwataShintaro KuronumaNaoki Shibata
    • G06T11/20
    • G06T11/60G06T11/206
    • In a data processing apparatus, a processor of an S88 processing unit comprises: a display unit that displays a diagram including a plurality of figures representing a processing unit and a connecting line representing a processing flow by connecting the plurality of figures together; an editing unit that executes, when receiving an editing command to edit the diagram from a user via a screen displayed by the display unit, the editing thus requested; and a link control unit that determines, when the editing unit receives an editing command to connect a first figure representing start or end of branched processing with a second figure representing a processing unit by using a connecting line, a point on a line forming the second figure, to which the connecting line is to be connected, such that one end of the connecting line is automatically connected, and that also connects, when receiving from the user a specification that specifies any position on a line to which the connecting line is to be connected among lines forming the first figure, the other end of the connecting line with the position specified by the user.
    • 在数据处理装置中,S88处理单元的处理器包括:显示单元,其通过将多个图形连接在一起来显示表示处理单元的多个图形和表示处理流程的连接线的图; 编辑单元,当接收到通过由显示单元显示的画面从用户编辑图形的编辑命令时,执行如此请求的编辑; 以及链接控制单元,当所述编辑单元接收到通过使用连接线接收表示分支处理的开始或结束的第一图形与表示处理单元的第二图形的编辑命令时,形成所述第二图形的线上的点 连接线的连接线将自动连接到连接线的一端,并且当从用户接收到指定连接线所在的线上的任何位置的规格时,还连接 在形成第一图形的线之间连接,连接线的另一端与用户指定的位置连接。
    • 46. 发明申请
    • Light-emitting semiconductor device using group III nitrogen compound
    • 使用III族氮化合物的发光半导体器件
    • US20080173880A1
    • 2008-07-24
    • US12003173
    • 2007-12-20
    • Katsuhide ManabeHisaki KatoMichinari SassaShiro YamazakiMakoto AsaiNaoki ShibataMasayoshi Koike
    • Katsuhide ManabeHisaki KatoMichinari SassaShiro YamazakiMakoto AsaiNaoki ShibataMasayoshi Koike
    • H01L33/00H01L21/00
    • H01L33/32H01L33/0025H01L33/007H01L33/325H01L33/38H01L33/382H01L33/385H01L33/40
    • A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n+-layer (3) of high carrier (n-type) concentration, a Si-doped (Alx3Ga1-x3)y3In1-y3N n+-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1-x2)y2In1-y2N emission layer (5), and a Mg-doped (Alx1Ga1-x1)y1In1-y1N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n+-layer (3) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The n+-layer (4) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The emission layer (5) has about a 0.5 μm thickness. The p-layer 6 has about a 1.0 μm thickness and a 2×1017/cm3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n+-layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n+-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.
    • 发光半导体器件(10)连续地包括蓝宝石衬底(1),AlN缓冲层(2),高载体的硅(Si)掺杂GaN n + +层(3) (n型)浓度,Si掺杂(Al x3 Ga 1-x 3)y 3在1-y 3中, 具有高载流子(n型)浓度的氮(Zn)和Si掺杂(Al 2 x 2 Ga 2) 1-x2 Y2在1-y2 N发射层(5)中,以及Mg掺杂(Al x1 Ga) 在1-y1 N p层(6)中。 AlN层(2)的厚度为500埃。 GaN n + +(3)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 n + +层(4)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 发射层(5)的厚度约为0.5μm。 p层6具有约1.0μm厚度和2×10 17 / cm 3孔浓度。 镍电极(7,8)分别连接到p层(6)和n + +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 选择各层(4,5,6)中的Al,Ga和In的组成比以满足n +层(3)中的GaN的晶格常数。 LED(10)被设计为提高发光强度并获得更纯的蓝色。