会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 43. 发明授权
    • Process for forming a photoresist pattern by top surface imaging process
    • 通过顶表面成像工艺形成光致抗蚀剂图案的工艺
    • US06319654B1
    • 2001-11-20
    • US09566290
    • 2000-05-05
    • Myoung Soo KimJae Chang JungHyung Gi KimKi Ho Baik
    • Myoung Soo KimJae Chang JungHyung Gi KimKi Ho Baik
    • G03F740
    • G03F7/38G03F7/0045G03F7/038G03F7/265Y10S430/168
    • The present invention relates to a process for forming a photoresist pattern by employing a silylation process, and particularly to a method for forming a photoresist pattern according to a top surface imaging (TSI) process using a photoresist composition comprising a cross-linker having a cross-linker monomer of the following Chemical Formula 1 or 2. The photoresist composition containing a polymer of the above cross-linker monomer is preferably used in a TSI process which has been optimized by controlling the conditions of each step, such as temperature and time, thereby obtaining an ultrafine pattern that can be more efficiently applied to a 4 G or 16 G DRAM semiconductor fabrication process: wherein, R1, R2, R3, R5, R6, R7, R, m and n are as defined in the specification attached hereto.
    • 本发明涉及一种通过使用甲硅烷化方法形成光致抗蚀剂图案的方法,特别涉及一种使用光致抗蚀剂组合物的顶表面成像(TSI)方法形成光致抗蚀剂图案的方法,所述光致抗蚀剂组合物包含交联剂 含有上述交联剂单体的聚合物的光致抗蚀剂组合物优选用于通过控制各步骤的条件如温度和时间而优化的TSI方法, 从而获得可以更有效地应用于4G或16G DRAM半导体制造工艺的超精细图案:其中,R1,R2,R3,R5,R6,R7,R,m和n如本文所附的说明书中所定义。 。
    • 44. 发明授权
    • Photoresist cross-linker and photoresist composition comprising the same
    • 光阻抗交联剂和包含其的光致抗蚀剂组合物
    • US06312868B1
    • 2001-11-06
    • US09501096
    • 2000-02-09
    • Keun Kyu KongJae Chang JungMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • Keun Kyu KongJae Chang JungMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • G03F7004
    • G03F7/0045G03F7/038
    • The present invention is directed to photoresist cross-linkers selected from the group consisting of a cross-linker monomer represented by following Chemical Formula 1, and homopolymers and copolymers thereof. Such cross-linkers are suitable for use in photolithography processes employing KrF(248nm), ArF(193nm), E-beam, ion-beam or EUV light sources. wherein X1 and X2 individually represent CH2, CH2CH2, O or S; p and s individually represent an integer from 0 to 5; q is 0 or 1; R′ and R″ independently represent hydrogen or methyl; R represents straight or branched C1-10 alkyl, straight or branched C1-10 ether, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ether including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; R1 and R2 independently represent hydrogen, straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group.
    • 本发明涉及选自由以下化学式1表示的交联剂单体和其均聚物和共聚物的光致抗蚀剂交联剂。 这种交联剂适用于采用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的光刻工艺.X1和X2分别表示CH2,CH2CH2,O或S; p和s各自表示0至5的整数; q为0或1; R'和R“独立地表示氢或甲基; R代表直链或支链C 1-10烷基,直链或支链C1-10醚,直链或支链C1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10醚,包括至少一个羟基的直链或支链C 1-10酯,直链或支链C 1-10酮 包括至少一个羟基,包括至少一个羟基的直链或支链C 1-10羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; R 1和R 2独立地表示氢,直链或支链C 1-10烷基,直链或支链C 1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛,直链或 包括至少一个羟基的支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酯,包括至少一个羟基,直链或支链C 1-10羧酸的直链或支链C 1-10酮包括 至少一个羟基,以及包含至少一个羟基的直链或支链C 1-10缩醛。
    • 45. 发明授权
    • Metal oxide semiconductor (MOS) field effect transistor having trench isolation region and method of fabricating the same
    • 具有沟槽隔离区域的金属氧化物半导体(MOS)场效应晶体管及其制造方法
    • US08416599B2
    • 2013-04-09
    • US12498652
    • 2009-07-07
    • Myoung-Soo Kim
    • Myoung-Soo Kim
    • G11C11/00
    • H01L21/823481H01L29/78
    • A leakage current occurring on a boundary of a trench isolation region and an active region can be prevented in a Metal Oxide Semiconductor (MOS) Field Effect transistor, and a fabricating method thereof is provided. The transistor includes the trench isolation region disposed in a predetermined portion of a semiconductor substrate to define the active region. A source region and a drain region are spaced apart from each other within the active region with a channel region disposed between the source region and the drain region. A gate electrode crosses over the channel region between the source region and the drain region, and a gate insulating layer is disposed between the gate electrode and the channel region. An edge insulating layer thicker than the gate insulating layer is disposed on a lower surface of the gate electrode around the boundary of the trench isolation region and the active region.
    • 在金属氧化物半导体(MOS)场效应晶体管中,可以防止在沟槽隔离区域和有源区域的边界上产生的漏电流,并提供其制造方法。 晶体管包括设置在半导体衬底的预定部分中以限定有源区的沟槽隔离区。 源极区域和漏极区域在有源区域内彼此间隔开,沟道区域设置在源极区域和漏极区域之间。 栅电极跨越源极区域和漏极区域之间的沟道区域,栅极绝缘层设置在栅电极和沟道区域之间。 在沟槽隔离区域和有源区域的边界周围的栅电极的下表面上设置比栅绝缘层厚的边缘绝缘层。
    • 47. 发明授权
    • Transistor, a transistor arrangement and method thereof
    • 晶体管,晶体管结构及其方法
    • US07696054B2
    • 2010-04-13
    • US11802004
    • 2007-05-18
    • Myoung-Soo Kim
    • Myoung-Soo Kim
    • H01L21/336
    • H01L29/7833H01L29/41758H01L29/66575
    • A transistor, transistor arrangement and method thereof are provided. The example method may include determining whether a gate width of the transistor has been adjusted; and adjusting a distance between a higher-concentration impurity-doped region of the transistor and a device isolation layer of the transistor based on the adjusted gate width if the determining step determines the gate width of the transistor is adjusted. The example transistor may include a first device isolation layer defining a first active region, a first gate line having a first gate width and crossing over the first active region, a first lower-concentration impurity-doped region formed in the first active region at first and second sides of the first gate line and a first higher-concentration impurity-doped region formed in the lower-concentration impurity-doped region and not in contact with the gate line and the device-isolation layer.
    • 提供一种晶体管,晶体管结构及其方法。 示例性方法可以包括确定晶体管的栅极宽度是否已被调整; 以及如果所述确定步骤确定所述晶体管的栅极宽度,则基于所述调整的栅极宽度来调整所述晶体管的高浓度杂质掺杂区域和所述晶体管的器件隔离层之间的距离。 示例性晶体管可以包括限定第一有源区的第一器件隔离层,具有第一栅极宽度并与第一有源区交叉的第一栅极线,首先在第一有源区中形成的第一低浓度杂质掺杂区 和第一栅极线的第二面和形成在低浓度杂质掺杂区域中的第一较高浓度杂质掺杂区,并且不与栅极线和器件隔离层接触。
    • 49. 发明授权
    • Photoresist cross-linker and photoresist composition comprising the same
    • 光阻抗交联剂和包含其的光致抗蚀剂组合物
    • US06482565B1
    • 2002-11-19
    • US09448964
    • 1999-11-24
    • Jae Chang JungKeun Kyu KongMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • Jae Chang JungKeun Kyu KongMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • G03F7004
    • C07D407/12C07D317/12C07D319/06
    • The present invention relates to a cross-linker for use in a photoresist which is suitable for a photolithography process using KrF (248 ru), ArF (193 nm), E-beam, ion beam or EUV light source. According to the present invention, preferred cross-linkers comprise a copolymer having repeating units derived from: (i) a compound represented by following Chemical Formula 1 and/or (ii) one or more compound(s) selected from the group consisting of acrylic acid, methacrylic acid and maleic anhydride. wherein, R1, R2 and R individually represent straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; R3 represents hydrogen or methyl; m represents 0 or 1; and n represents a number of 1 to 5.
    • 本发明涉及用于光致抗蚀剂的交联剂,其适用于使用KrF(248uR),ArF(193nm),电子束,离子束或EUV光源的光刻工艺。 根据本发明,优选的交联剂包含具有衍生自以下的重复单元的共聚物:(i)由以下化学式1表示的化合物和/或(ii)一种或多种选自丙烯酸的化合物 酸,甲基丙烯酸和马来酸酐。其中R1,R2和R各自表示直链或支链C1-10烷基,直链或支链C1-10酯,直链或支链C1-10酮,直链或支链C1-10羧酸, 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酮, 包含至少一个羟基的直链或支链C 1-10羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; R3表示氢或甲基; m表示0或1; n表示1〜5的数。