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    • 2. 发明申请
    • Semiconductor device including a transistor having low threshold voltage and high breakdown voltage
    • 半导体器件包括具有低阈值电压和高击穿电压的晶体管
    • US20050194648A1
    • 2005-09-08
    • US11066492
    • 2005-02-28
    • Myoung-soo Kim
    • Myoung-soo Kim
    • H01L21/283H01L21/336H01L21/8234H01L27/088H01L29/78
    • H01L21/823418H01L21/823462H01L27/088
    • A semiconductor device, including a transistor having low threshold voltage and high breakdown voltage, includes a first gate electrode, a second gate electrode, and a third gate electrode arranged on a predetermined first, second, and third region of a semiconductor substrate, respectively, a first gate insulating layer, a second gate insulating layer, and a third gate insulating layer, which are interposed between the first, second and third gate electrode and the semiconductor substrate, respectively, and first, second, and third junction regions arranged in the first, second, and third region of the semiconductor substrate, respectively, on both sides of the first, second and third gate electrode, respectively, wherein a thickness of the first gate insulating layer is greater than a thickness of either of the second or third gate insulating layers, and wherein a structure of the first junction region and a structure of the third junction region are the same.
    • 包括具有低阈值电压和高击穿电压的晶体管的半导体器件分别包括布置在半导体衬底的预定第一,第二和第三区域上的第一栅电极,第二栅电极和第三栅电极, 第一栅极绝缘层,第二栅极绝缘层和第三栅极绝缘层,分别介于第一,第二和第三栅电极与半导体衬底之间,第一,第二和第三结区域布置在 分别在第一,第二和第三栅极的两侧分别具有半导体衬底的第一,第二和第三区域,其中第一栅极绝缘层的厚度大于第二栅极绝缘层的厚度 栅极绝缘层,并且其中第一结区域的结构和第三结区域的结构相同。
    • 3. 发明授权
    • Semiconductor device including a transistor having low threshold voltage and high breakdown voltage
    • 半导体器件包括具有低阈值电压和高击穿电压的晶体管
    • US07217985B2
    • 2007-05-15
    • US11066492
    • 2005-02-28
    • Myoung-soo Kim
    • Myoung-soo Kim
    • H01L29/00
    • H01L21/823418H01L21/823462H01L27/088
    • A semiconductor device, including a transistor having low threshold voltage and high breakdown voltage, includes a first gate electrode, a second gate electrode, and a third gate electrode arranged on a predetermined first, second, and third region of a semiconductor substrate, respectively, a first gate insulating layer, a second gate insulating layer, and a third gate insulating layer, which are interposed between the first, second and third gate electrode and the semiconductor substrate, respectively, and first, second, and third junction regions arranged in the first, second, and third region of the semiconductor substrate, respectively, on both sides of the first, second and third gate electrode, respectively, wherein a thickness of the first gate insulating layer is greater than a thickness of either of the second or third gate insulating layers, and wherein a structure of the first junction region and a structure of the third junction region are the same.
    • 包括具有低阈值电压和高击穿电压的晶体管的半导体器件分别包括布置在半导体衬底的预定第一,第二和第三区域上的第一栅电极,第二栅电极和第三栅电极, 第一栅极绝缘层,第二栅极绝缘层和第三栅极绝缘层,分别介于第一,第二和第三栅电极与半导体衬底之间,第一,第二和第三结区域布置在 分别在第一,第二和第三栅极的两侧分别具有半导体衬底的第一,第二和第三区域,其中第一栅极绝缘层的厚度大于第二栅极绝缘层的厚度 栅极绝缘层,并且其中第一结区域的结构和第三结区域的结构相同。
    • 4. 发明授权
    • Method of forming MOS transistor
    • 形成MOS晶体管的方法
    • US06962840B2
    • 2005-11-08
    • US10659954
    • 2003-09-11
    • Myoung-soo Kim
    • Myoung-soo Kim
    • H01L21/8234H01L27/06H01L21/336
    • H01L27/0629H01L21/823462
    • Methods of simultaneously forming MOS transistors and a capacitor on a substrate having gate insulation layers of varying thicknesses are disclosed. A method includes forming field regions in a substrate to define a first transistor region, a capacitor region, and a second transistor region, forming a first gate stack in the first transistor region and a lower electrode in the capacitor region, and forming an upper electrode on the lower electrode with a dielectric layer interposed therebetween and a second gate stack in the second transistor region.
    • 公开了在具有不同厚度的栅极绝缘层的基板上同时形成MOS晶体管和电容器的方法。 一种方法包括在衬底中形成场区以限定第一晶体管区域,电容器区域和第二晶体管区域,在第一晶体管区域中形成第一栅极堆叠以及在电容器区域中形成下电极,以及形成上电极 在其上插有电介质层的下电极和在第二晶体管区域中的第二栅极叠层。