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41. 发明授权

US06744135B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US06744135B2
公开(公告)日：2004-06-01
申请号：US10147073
申请日：2002-05-17
申请人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号： H01L2334
CPC分类号： H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译：本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子电子部件连接。在电子设备中，具有高导热性的部件被布置成与金属板和电子部件两者接触。因此，电子设备的散热性提高。

42. 发明授权

US06471115B1 Process for manufacturing electronic circuit devices 失效
标题翻译：电子电路器件制造工艺
公开(公告)号：US06471115B1
公开(公告)日：2002-10-29
申请号：US09585391
申请日：2000-06-02
申请人： Masahito Ijuin , Toru Nishikawa , Ryohei Sato , Mitsugu Shirai , Yuzo Taniguchi , Kosuke Inoue , Masahide Harada , Tetsuya Hayashida
发明人： Masahito Ijuin , Toru Nishikawa , Ryohei Sato , Mitsugu Shirai , Yuzo Taniguchi , Kosuke Inoue , Masahide Harada , Tetsuya Hayashida
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/40 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/73203 , H01L2224/81012 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H05K3/3489 , H01L2924/00 , H01L2924/00014
摘要： The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.
摘要翻译：本发明是一种通过将焊料材料涂布在印刷电路板上的电子部件或电极上来制造电子电路器件的方法; 该方法包括以下步骤：从焊料材料和电极的表面去除初始表面氧化物膜和有机污染膜，覆盖焊料材料和由电极组成的焊料区域，在熔化焊料材料的步骤中完成接合之后的液体蒸发，从而防止接合区域表面的再氧化，并且使焊料材料加热熔化，而不使用任何焊剂进行焊接。

43. 发明授权

US06227436B1 Method of fabricating an electronic circuit device and apparatus for performing the method 失效
标题翻译：电子电路装置的制造方法及其执行方法
公开(公告)号：US06227436B1
公开(公告)日：2001-05-08
申请号：US09160288
申请日：1998-09-25
申请人： Toru Nishikawa , Ryohei Satoh , Masahide Harada , Tetsuya Hayashida , Mitugu Shirai
发明人： Toru Nishikawa , Ryohei Satoh , Masahide Harada , Tetsuya Hayashida , Mitugu Shirai
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K1/0016 , B23K1/008 , B23K1/206 , B23K2101/40 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05184 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/11003 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/73203 , H01L2224/742 , H01L2224/749 , H01L2224/75 , H01L2224/7501 , H01L2224/757 , H01L2224/7901 , H01L2224/81012 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/3025 , H05K3/3426 , H05K3/3436 , H05K3/3489 , H05K2201/10984 , H05K2203/025 , H05K2203/0278 , H05K2203/041 , H05K2203/0435 , H05K2203/086 , H05K2203/087 , H05K2203/095 , H05K2203/1157 , Y02P70/613 , H01L2924/00 , H01L2924/00014
摘要： In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.
摘要翻译：在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中排列。然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。

44. 发明授权

US5973406A Electronic device bonding method and electronic circuit apparatus 失效
标题翻译：电子装置接合方法和电子电路装置
公开(公告)号：US5973406A
公开(公告)日：1999-10-26
申请号：US918019
申请日：1997-08-25
申请人： Masahide Harada , Toru Nishikawa , Ryohei Satoh , Osamu Yamada , Takayuki Uda , Mitsugu Shirai
发明人： Masahide Harada , Toru Nishikawa , Ryohei Satoh , Osamu Yamada , Takayuki Uda , Mitsugu Shirai
IPC分类号： H01L21/60 , H05K3/34 , H01L23/48
CPC分类号： H01L24/81 , H05K3/3436 , H01L2224/13111 , H01L2224/17517 , H01L2224/81136 , H01L2224/8114 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K2201/09781 , H05K2201/2036 , H05K2203/0182 , H05K2203/086 , Y02P70/613
摘要： An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.
摘要翻译：无需使用焊剂即可正确焊接电子设备，也不会对基板进行精确定位。在要安装电子装置的基板上的区域中形成尺寸约为电子装置的端子焊盘尺寸的两倍的焊盘。在放置基板表面的电子装置之后，将整个单元在氮气气氛中加热以熔化形成在电子装置的端子板上的凸块。熔融的焊料润湿并扩散在形成在衬底上的接合焊盘上，从而在接合焊盘和端子焊盘之间建立回流焊接。电子器件相对于衬底的位置由于通过在衬底的焊盘上的熔融焊料的润湿和扩散而引起的自对准功能自发校正。

45. 发明授权

US5816473A Method of fabricating electronic circuit device and apparatus for performing the same method 失效
标题翻译：制造电子电路装置的方法和用于执行相同方法的装置
公开(公告)号：US5816473A
公开(公告)日：1998-10-06
申请号：US578054
申请日：1995-12-22
申请人： Toru Nishikawa , Ryohei Satoh , Masahide Harada , Tetsuya Hayashida , Mitugu Shirai
发明人： Toru Nishikawa , Ryohei Satoh , Masahide Harada , Tetsuya Hayashida , Mitugu Shirai
IPC分类号： B23K1/00 , B23K1/008 , B23K1/20 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/68 , H01L23/498 , H05K3/34
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K1/206 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/75 , H05K3/3436 , H05K3/3489 , B23K2201/40 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/742 , H01L2224/749 , H01L2224/75 , H01L2224/81141 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H05K2201/10984 , H05K2203/025 , H05K2203/0278 , H05K2203/041 , H05K2203/0435 , H05K2203/086 , H05K2203/087 , H05K2203/095 , H05K2203/1157 , H05K3/3426 , Y02P70/613
摘要： An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.
摘要翻译：一种装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待粘合的部件的表面，或者可以使用镀金的焊球。要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的互补凹部。

46. 发明授权

US5276289A Electronic circuit device and method of producing the same 失效
标题翻译：电子电路装置及其制造方法
公开(公告)号：US5276289A
公开(公告)日：1994-01-04
申请号：US674599
申请日：1991-03-25
申请人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
发明人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34 , H05K1/00
CPC分类号： H01L24/81 , B23K35/30 , H01L23/10 , H01L23/16 , H01L23/5385 , H01L25/0655 , H05K3/3463 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/30107 , H05K2201/094 , H05K2201/10704 , H05K2201/10734
摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
摘要翻译：本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金（熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃））。

47. 发明授权

US5136360A Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals 失效
标题翻译：电子电路器件，连接焊料和焊料的方法，用于连接镀金端子
公开(公告)号：US5136360A
公开(公告)日：1992-08-04
申请号：US563281
申请日：1990-08-06
申请人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
发明人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
IPC分类号： B23K35/22 , B23K35/26 , C22C13/00 , H01L21/60 , H01L23/488 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225
摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.
摘要翻译：一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分基材由1.0〜8.0重量份的合金组成构成。提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

48. 发明授权

US5072258A Method of controlling surface potential of photoconductive element 失效
标题翻译：控制光电导元件表面电位的方法
公开(公告)号：US5072258A
公开(公告)日：1991-12-10
申请号：US563344
申请日：1990-08-07
申请人： Masahide Harada
发明人： Masahide Harada
IPC分类号： G03G15/02 , G03G15/00 , G03G15/04 , G03G15/043 , G03G15/06 , G03G21/00
CPC分类号： G03G15/5037
摘要： A method of controlling the surface potential of a photoconductive element included in an electrophotograpic copier or similiar image forming apparatus. When the background area of a photoconductive element is contaminated due to the shaving of the photoconductive film provided on the photoconductive element or similar type of cause, the method increases the amount of light for imagewise exposure. When the contamination is ascribable to residual potential on the surface of the photoconductor element, the method increases bias potential for development and charge potential. The method, therefore, adequately controls the background contamination ascribable to the change in the sensitivity of the photoconductive element which is in turn ascribable to different types of causes, i.e., the increase in the residual potential and the shaving of the photoconductive film or the like.
摘要翻译：一种控制包含在电子照相复印机或类似图像形成装置中的光电导元件的表面电位的方法。当感光元件的背景区域由于在感光体上设置的感光膜的刮屑或类似原因而被污染时，该方法增加了成像曝光的光量。当污染物归因于光电导体元件的表面上的残留电势时，该方法增加了用于显影和电荷电位的偏置电位。因此，该方法可以适当地控制归因于光电导元件的灵敏度变化的背景污染物，其又归因于不同类型的原因，即光电导膜等的残留电位和剃刮的增加。

49. 发明授权

US4984519A Delay circuit for use in electric blasting system 失效
标题翻译：延迟电路用于电喷射系统
公开(公告)号：US4984519A
公开(公告)日：1991-01-15
申请号：US309157
申请日：1989-02-13
申请人： Koji Ochi , Masahide Harada , Kunio Kobayashi
发明人： Koji Ochi , Masahide Harada , Kunio Kobayashi
IPC分类号： F42B3/16 , F42B3/18 , F42C11/06 , F42D1/055 , F42D1/06 , H03K5/135
CPC分类号： F42D1/055
摘要： A delay circuit for use in an electric blasting system including a capacitor for storing electric energy supplied from an electric blaster, an actuation circuit for detecting the stop of voltage supply from the blaster to generate an actuation signal, a circuit for generating clock pulses, a circuit for counting a predetermined number of clock pulses in response to the actuation signal to generate an igniting signal, and a switching circuit for responding to the igniting signal to discharge the electric energy stored in the capacitor through an igniting resistor, the actuation circuit having a zener diode with a threshold voltage. When the voltage supply from the blaster is stopped and the voltage across the zener diode becomes lower than the threshold voltage, the zener diode is cut-off to generate the actuation signal.
摘要翻译：一种用于电喷射系统的延迟电路，包括用于存储从电动发生器供应的电能的电容器，用于检测从起动器停止供电以产生致动信号的致动电路，用于产生时钟脉冲的电路，电路，用于响应于所述致动信号计数预定数量的时钟脉冲以产生点火信号;以及开关电路，用于响应于所述点火信号，以通过点火电阻放电存储在所述电容器中的电能，所述致动电路具有具有阈值电压的齐纳二极管。当来自爆破器的电压停止并且齐纳二极管两端的电压变得低于阈值电压时，该齐纳二极管被切断以产生致动信号。

50. 发明授权

US4469771A Electrophotographic light-sensitive member with thin overlayer 失效
标题翻译：具有薄覆盖层的电子照相感光构件
公开(公告)号：US4469771A
公开(公告)日：1984-09-04
申请号：US362176
申请日：1982-03-25
申请人： Haruo Hasegawa , Kenji Seki , Hideaki Ema , Masahide Harada , Shiro Yamane
发明人： Haruo Hasegawa , Kenji Seki , Hideaki Ema , Masahide Harada , Shiro Yamane
IPC分类号： G03G5/147 , G03G5/043 , G03G5/047 , G03G5/14 , G03G13/22
CPC分类号： G03G5/0436 , G03G5/047 , Y10S428/913 , Y10T428/265 , Y10T428/269 , Y10T428/31504 , Y10T428/31507 , Y10T428/3154 , Y10T428/31544 , Y10T428/31725 , Y10T428/31786
摘要： Electrophotographic light-sensitive member having a protective coating on a photoconductive layer of the light-sensitive member, said protective coating consisting of an organic high polymer containing Lewis acid.
摘要翻译：在感光构件的光电导层上具有保护涂层的电子照相感光构件，所述保护涂层由含有路易斯酸的有机高分子组成。

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