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1. 发明授权

US09642548B2 Electrode pad for use on living organism 有权
公开(公告)号：US09642548B2
公开(公告)日：2017-05-09
申请号：US14404370
申请日：2012-05-28
申请人： Yoshihiko Sano , Masahide Harada
发明人： Yoshihiko Sano , Masahide Harada
IPC分类号： A61B5/0408 , A61B5/0416 , A61B5/00
CPC分类号： A61B5/04087 , A61B5/0408 , A61B5/7207
摘要： An electrode pad for use on a living organism can measure an electrocardiographic signal without being hindered by body-motion noise. The electrode pad is attached to the skin of the living organism, detects an electrical signal, and supplies the electrical signal to an electrocardiograph. The electrode pad for use on a living organism is characterized by the provision of a mesh-like electrode that extends along the skin, a conductive gel sheet that is layered on top of the electrode and extends along the surface of the skin, and a soft protective sheet that covers the layered electrode and conductive gel sheet.

2. 发明授权

US07145231B2 Electronic apparatus 有权
公开(公告)号：US07145231B2
公开(公告)日：2006-12-05
申请号：US10844392
申请日：2004-05-13
申请人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号： H01L23/34
CPC分类号： H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

3. 发明申请

US20060068609A1 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US20060068609A1
公开(公告)日：2006-03-30
申请号：US11183972
申请日：2005-07-19
申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
发明人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
IPC分类号： H05K1/00
CPC分类号： H05K5/069 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/3025 , H05K1/0313 , H05K3/3447 , H05K5/0069 , H05K2201/0999 , H05K2201/10189 , H05K2201/10977 , H05K2201/2009 , Y10S439/935 , H01L2924/00
摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要翻译：一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善电子设备的可靠性。

4. 发明授权

US5476726A Circuit board with metal layer for solder bonding and electronic circuit device employing the same 失效
标题翻译：用于焊接焊接的金属层的电路板和采用该电路的电子电路装置
公开(公告)号：US5476726A
公开(公告)日：1995-12-19
申请号：US5353
申请日：1993-01-19
申请人： Masahide Harada , Akihiro Ando , Ryohei Satoh , Akira Yabushita , Naoya Kanda , Kazuhiko Horikoshi
发明人： Masahide Harada , Akihiro Ando , Ryohei Satoh , Akira Yabushita , Naoya Kanda , Kazuhiko Horikoshi
IPC分类号： B23K35/00 , H01L23/498 , H05K1/09 , H05K3/24 , B32B15/04 , H01L23/488
CPC分类号： H05K3/244 , B23K35/001 , H01L23/49866 , H01L2924/0002 , H05K1/09 , H05K2203/0723 , H05K2203/176 , Y10S428/901 , Y10T428/12687 , Y10T428/12861 , Y10T428/12868 , Y10T428/12882 , Y10T428/24917
摘要： A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.
摘要翻译：形成在电路板上的焊料接合金属层包括金属层，该金属层具有容易形成合金或金属间化合物的金属容易润湿的第一金属和容易形成合金或金属间化合物的第一金属和不容易形成的第二金属的混合物以上焊料不熔化。在这种情况下，可以在金属层中形成接合面上的第一金属的浓度高的浓度梯度。具有焊接接合金属层的电路板，即使在多次维修之后也能够保持良好的接合并提高可靠性。

5. 发明授权

US4899658A Delay type electric detonator 失效
标题翻译：延迟式电雷管
公开(公告)号：US4899658A
公开(公告)日：1990-02-13
申请号：US254811
申请日：1988-10-07
申请人： Koji Ochi , Masahide Harada
发明人： Koji Ochi , Masahide Harada
IPC分类号： F42B3/16 , F42B3/12 , F42C21/00
CPC分类号： F42C21/00 , F42B3/122
摘要： An electric detonator of the delay type including a housing having a metal portion and an insulating portion, a pair of leg wires extending outside through the housing, a delay circuit connected across the leg wires and generating an ignition current at a predetermined timing, and an igniting resistor connected to an output terminal of the delay circuit and one of the leg wires. In order to check the resistance value of the igniting resistor even after the detonator has been assembled, a by-pass resistor is connected between the other of the leg wires and a junction point between the delay circuit and the igniting resistor. A small measuring current is conducted through the igniting resistor via the by-pass resistor to generate a voltage drop across the igniting resistor. This voltage drop is measured by connecting a voltage measuring device between the leg wire and the metal portion of the housing.
摘要翻译：一种延迟型的电雷管，包括具有金属部分和绝缘部分的壳体，通过壳体向外延伸的一对腿线，延伸电路，跨越腿线连接并在预定定时产生点火电流，以及连接到延迟电路的输出端子和一根腿线的点火电阻器。为了即使在雷管组装之后也检查点火电阻的电阻值，旁路电阻连接在另一条腿线和延迟电路与点火电阻之间的连接点上。通过旁路电阻器通过点火电阻器传导小的测量电流，以产生穿过点火电阻器的电压降。通过将电压测量装置连接在腿线和壳体的金属部分之间来测量该电压降。

6. 发明申请

US20150112176A1 ELECTRODE PAD FOR USE ON LIVING ORGANISM 有权
标题翻译：电极板用于生活有机体
公开(公告)号：US20150112176A1
公开(公告)日：2015-04-23
申请号：US14404370
申请日：2012-05-28
申请人： Yoshihiko Sano , Masahide Harada
发明人： Yoshihiko Sano , Masahide Harada
IPC分类号： A61B5/0408
CPC分类号： A61B5/04087 , A61B5/0408 , A61B5/7207
摘要： An electrode pad for use on a living organism can measure an electrocardiographic signal without being hindered by body-motion noise. The electrode pad is attached to the skin of the living organism, detects an electrical signal, and supplies the electrical signal to an electrocardiograph. The electrode pad for use on a living organism is characterized by the provision of a mesh-like electrode that extends along the skin, a conductive gel sheet that is layered on top of the electrode and extends along the surface of the skin, and a soft protective sheet that covers the layered electrode and conductive gel sheet.
摘要翻译：用于生物体的电极垫可以测量心电图信号而不受身体运动噪声的阻碍。电极垫连接到生物体的皮肤，检测电信号，并将电信号提供给心电图仪。用于生物体的电极垫的特征在于提供沿着皮肤延伸的网状电极，层叠在电极顶部并沿皮肤表面延伸的导电凝胶片，并且软覆盖层状电极和导电凝胶片的保护片。

7. 发明授权

US08002076B2 Electric power steering apparatus 有权
标题翻译：电动助力转向装置
公开(公告)号：US08002076B2
公开(公告)日：2011-08-23
申请号：US11488079
申请日：2006-07-18
申请人： Hideto Yoshinari , Masahide Harada , Kaoru Uchiyama , Osamu Koizumi
发明人： Hideto Yoshinari , Masahide Harada , Kaoru Uchiyama , Osamu Koizumi
IPC分类号： B62D5/04
CPC分类号： B62D5/0406 , H02K5/225 , H02K11/33
摘要： The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.
摘要翻译：本发明提供一种电动助力转向装置，其中可以实现其减小和厚度，同时可以确保其辐射性能，并且即使当该装置包括具有电机和与其集成的电动机控制装置。该装置包括辅助转向操作的电动机，控制电动机的电动机控制装置以及容纳电动机和电动机控制装置的壳体。壳体包括容纳电动机的电动机容纳部分和容纳电动机控制装置的控制装置容纳部分。马达控制装置包括驱动马达的驱动单元和控制马达的控制单元。驱动单元设置在控制装置容纳部分中的位置，该位置靠近电动机容纳部分。

8. 发明授权

US07554039B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07554039B2
公开(公告)日：2009-06-30
申请号：US10535857
申请日：2003-06-20
申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
发明人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
IPC分类号： H05K1/00
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K3/3436 , H05K3/4608 , H05K2201/10734 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要翻译：在具有作为MCM结构的插入器基板的电子设备中，提高了散热性能，同时保持了插入器基板和母板之间的接合的可靠性。在本发明中，中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。此外，在内插基板和母板的至少一个上设置有芯金属露出的部分。在芯金属露出部上直接形成焊点焊盘，并将插入基板与母板焊接。

9. 发明申请

US20080142571A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20080142571A1
公开(公告)日：2008-06-19
申请号：US11949849
申请日：2007-12-04
申请人： Takehide Yokozuka , Ukyo Ikeda , Masahide Harada , Hideto Yoshinari
发明人： Takehide Yokozuka , Ukyo Ikeda , Masahide Harada , Hideto Yoshinari
IPC分类号： B23K1/06
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00
摘要： Since an electronic device of the present invention has a pair of joint pieces thereof formed (extended) on both sides with respect to one end of the body thereof, the pair of joint pieces both connected to one of the substrates improves the joining strength between the lead frame connector and the one of substrates and ensures the reliability of electrical connection between the lead frame connector and the one of the substrates.
摘要翻译：由于本发明的电子设备具有相对于其本体的一端在两侧形成（延伸）的一对连接件，所以与一个基板连接的一对连接件提高了两者之间的接合强度引线框架连接器和基板之一，并且确保引线框架连接器和一个基板之间的电连接的可靠性。

10. 发明申请

US20070145473A1 Semiconductor device and electronic control unit using the same 有权
标题翻译：半导体装置和使用该装置的电子控制装置
公开(公告)号：US20070145473A1
公开(公告)日：2007-06-28
申请号：US11635561
申请日：2006-12-08
申请人： Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida
发明人： Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida
IPC分类号： H01L29/76
CPC分类号： H01L23/49822 , H01L23/142 , H01L23/3677 , H01L23/49816 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device with enhanced heat releasability and low-cost manufacturability is disclosed. This device has a substrate with an electronic circuit disposed on a first principal surface, a semiconductor element which is provided at the first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer which is provided in the substrate and electrically connected to the semiconductor element, a plurality of conductive bumps provided on a second principal surface opposite to the first surface of the substrate, a thermal hardenable sealing resin for sealing at least the semiconductor element and the first surface side of the substrate, and a metal plate provided at the second surface for being electrically connected to the metal core layer. An electronic control module using the device is also disclosed.
摘要翻译：公开了具有增强的散热性和低成本可制造性的半导体器件。该器件具有设置在第一主表面上的电子电路的基板，设置在基板的第一表面并通过引线键合而与电子电路电连接的半导体元件，设置在基板中的金属芯层并且电连接到所述半导体元件，设置在与所述基板的第一表面相对的第二主表面上的多个导电凸块，用于至少密封所述基板的所述半导体元件和所述第一表面侧的热可硬化密封树脂，以及设置在第二表面处用于电连接到金属芯层的金属板。还公开了一种使用该装置的电子控制模块。

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