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    • 41. 发明授权
    • Bipolar transistor with raised extrinsic base fabricated in an integrated BiCMOS circuit
    • 具有凸起的外部基极的双极晶体管在集成的BiCMOS电路中制造
    • US06492238B1
    • 2002-12-10
    • US09887310
    • 2001-06-22
    • David C. AhlgrenGregory G. FreemanFeng-Yi HuangAdam D. Ticknor
    • David C. AhlgrenGregory G. FreemanFeng-Yi HuangAdam D. Ticknor
    • H01L2100
    • H01L29/66287H01L21/8249H01L27/0623
    • A process for forming a bipolar transistor with a raised extrinsic base, an emitter, and a collector integrated with a CMOS circuit with a gate. An intermediate semiconductor structure is provided having CMOS and bipolar areas. An intrinsic base layer is provided in the bipolar area. A base oxide is formed across, and a sacrificial emitter stack silicon layer is deposited on, both the CMOS and bipolar areas. A photoresist is applied to protect the bipolar area and the structure is etched to remove the sacrificial layer from the CMOS area only such that the top surface of the sacrificial layer on the bipolar area is substantially flush with the top surface of the CMOS area. Finally, a polish stop layer is deposited having a substantially flat top surface across both the CMOS and bipolar areas suitable for subsequent chemical-mechanical polishing (CMP) to form the raised extrinsic base.
    • 用于形成具有凸起的外部基极,发射极和与具有栅极的CMOS电路集成的集电极的双极晶体管的工艺。 提供具有CMOS和双极区域的中间半导体结构。 在双极区域内提供本征基层。 基底氧化物跨越形成,牺牲发射极堆叠硅层沉积在CMOS和双极区两者上。 施加光致抗蚀剂以保护双极区域,并且蚀刻该结构以从CMOS区域去除牺牲层,使得双极区域上的牺牲层的顶表面基本上与CMOS区域的顶表面齐平。 最后,沉积抛光停止层,其具有穿过适于随后的化学机械抛光(CMP)的CMOS和双极区域的基本平坦的顶表面,以形成凸起的外在基体。
    • 49. 发明授权
    • BiCMOS integration scheme with raised extrinsic base
    • BiCMOS整合方案具有突出的外在基础
    • US06780695B1
    • 2004-08-24
    • US10249563
    • 2003-04-18
    • Huajie ChenSeshadri SubbannaBasanth JagannathanGregory G. FreemanDavid C. AhlgrenDavid AngellKathryn T. SchonenbergKenneth J. SteinFen F. Jamin
    • Huajie ChenSeshadri SubbannaBasanth JagannathanGregory G. FreemanDavid C. AhlgrenDavid AngellKathryn T. SchonenbergKenneth J. SteinFen F. Jamin
    • H01L218238
    • H01L21/8249H01L27/0623
    • A method of forming a BiCMOS integrated circuit having a raised extrinsic base is provided. The method includes first forming a polysilicon layer atop a surface of a gate dielectric which is located atop a substrate having device areas for forming at least one bipolar transistor and device areas for forming at least one complementary metal oxide semiconductor (CMOS) transistor. The polysilicon layer is then patterned to provide a sacrificial polysilicon layer over the device areas for forming the at least one bipolar transistor and its surrounding areas, while simultaneously providing at least one gate conductor in the device areas for forming at least one CMOS transistor. At least one pair of spacers are then formed about each of the at least one gate conductor and then a portion of the sacrificial polysilicon layer over the bipolar device areas are selectively removed to provide at least one opening in the bipolar device area. At least one bipolar transistor having a raised extrinsic base is then formed in the at least one opening.
    • 提供一种形成具有凸起的外在基极的BiCMOS集成电路的方法。 该方法包括首先在位于具有用于形成至少一个双极晶体管的器件区域的衬底的顶部的栅极电介质的表面上方形成多晶硅层,以及用于形成至少一个互补金属氧化物半导体(CMOS)晶体管的器件区域)。 然后将多晶硅层图案化以在器件区域上提供用于形成至少一个双极晶体管及其周围区域的牺牲多晶硅层,同时在用于形成至少一个CMOS晶体管的器件区域中提供至少一个栅极导体。 然后围绕至少一个栅极导体的每一个形成至少一对间隔物,然后选择性地去除双极器件区域上的牺牲多晶硅层的一部分以在双极器件区域中提供至少一个开口。 然后在至少一个开口中形成至少一个具有凸起的非本征基极的双极晶体管。